ZXCL5213V33H5TA [ZETEX]
Fixed Positive LDO Regulator, 3.3V, 0.28V Dropout, CMOS, PDSO5, SC-70, 5 PIN;
| 型号： | ZXCL5213V33H5TA |
| 厂家： | 
ZETEX SEMICONDUCTORS |
| 描述： | Fixed Positive LDO Regulator, 3.3V, 0.28V Dropout, CMOS, PDSO5, SC-70, 5 PIN 光电二极管 输出元件 调节器 |
| 文件： | 总14页 (文件大小：404K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ZXCL SERIES
Micropower SC70-5 & SOT23-5 low dropout regulators
ZXCL5213V25, ZXCL5213V26, ZXCL5213V28, ZXCL5213V30, ZXCL5213V33,
ZXCL250, ZXCL260, ZXCL280, ZXCL300, ZXCL330
Description
Features
The ZXCL series have been designed with space
sensitive systems in mind. They are available in
the ultra small SC70-5 package, which is half the
size of SOT23 based regulators.
•
•
•
•
•
•
Low 85mV dropout at 50mA load
50 A ground pin current with full 150mA load
2.5, 2.6, 2.8, 3, & 3.3 volts output
Very low noise, without bypass capacitor
5-pin SC70 and SOT23 package
No-load stable
The devices can be used with all types of output
capacitors including low ESR ceramics and
typical dropout voltage, is only 85mV at 50mA
load. Supply current is minimised with a ground
pin current of only 50A at full 150mA load.
Applications
Logic control allows the devices to be shut
down, consuming typically less than 10nA.
These features make the device ideal for battery
powered applications where power economy is
critical.
•
•
•
•
•
•
Cellular and Cordless phones
PDA
Hand held instruments
Camera, Camcorder, Personal stereo
PC cards
For
applications
requiring
improved
performance over alternative devices, the
ZXCL is also offered in the 5 pin SOT23
package with an industry standard pinout.
Portable and battery-powered equipment
The devices feature thermal overload and
over-current protection and are available with
output voltages of 2.5V, 2.6V, 2.8V, 3V, 3.3V.
No-Load Stability, the ZXCL device will maintain regulation and
is stable with no external load. e.g. CMOS RAM applacations.
Typical application circuit
Package footprint
SOT23-5 (see P7 for SC70-5)
Package suffix - E5
VIN
GND
EN
VO
NC
Top view
Issue 8 - October 2007
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ZXCL SERIES
Ordering information
Order reference
Voltage
Package
Part
marking
Status
Reel size
(inches)
Tape
width
(mm)
Quantity
per reel
(V)
ZXCL250H5TA
2.5
2.6
2.8
3.0
3.3
4.0
2.5
2.6
2.8
3.0
3.3
4.0
SC70-5
SC70-5
SC70-5
SC70-5
SC70-5
SC70-5
SC70-5
SC70-5
SC70-5
SC70-5
SC70-5
SC70-5
L25A
L26A
L28A
L30A
L33A
L40A
L25C
L26C
L28C
L30C
L33C
L40C
Active
Active
Active
Active
Active
Obsolete
Active
Active
Active
Active
Active
7
7
7
7
7
7
7
7
7
7
7
7
8
8
8
8
8
8
8
8
8
8
8
8
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
ZXCL260H5TA
ZXCL280H5TA
ZXCL300H5TA
ZXCL330H5TA
ZXCL400H5TA
ZXCL5213V25H5TA
ZXCL5213V26H5TA
ZXCL5213V28H5TA
ZXCL5213V30H5TA
ZXCL5213V33H5TA
ZXCL5213V40H5TA
Not rec.
for new
designs
ZXCL250E5TA
ZXCL260E5TA
ZXCL280E5TA
ZXCL300E5TA
ZXCL330E5TA
ZXCL400E5TA
2.5
2.6
2.8
3.0
3.3
4.0
SOT23-5
SOT23-5
SOT23-5
SOT23-5
SOT23-5
SOT23-5
L25B
L26B
L28B
L30B
L33B
L40B
Active
Active
7
7
7
7
7
7
8
8
8
8
8
8
3000
3000
3000
3000
3000
3000
Active
Active
Active
Obsolete
Absolute maximum rating
Terminal Voltage with respect to GND
Output short circuit duration Infinite
V
-0.3V to 7.0V
-0.3V to 10V
-0.3V to 5.5V
Continuous power dissipation Internally limited
Operating temperature range -40°C to +85°C
IN
N
E
V
Storage temperature range
-55°C to +125°C
O
Package power dissipation (T =25°C)
A
SC70-5
300mW (Note 1)
450mW (Note 1)
SOT23-5
Stresses beyond those listed under “Absolute maximum ratings” may cause permanent damage
to the device. These are stress ratings only, and functional operation of the device at these or any
other conditions beyond those indicated in the operational sections of the specifications is not
implied. Exposure to absolute maximum conditions for extended periods may affect device
reliability.
Issue 8 - October 2007
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ZXCL SERIES
Recommended operating conditions
Symbol Parameter
Min
Max
Units
V
V
V
Input voltage range
2.0*
5.5
V
IN
Enable pin logic level High pin
Enable pin logic level Low pin
Ambient temperature range
2.2
0
10
0.8
85
V
V
ENH
ENL
T
-40
°C
A
*
Output voltage will start to rise when VIN exceeds a value or approximately 1.3V. For normal operation,
IN(min) > VOUT(nom) + 0.5V.
V
Pin description
Symbol Parameter
V
Supply voltage
Ground
IN
G
ND
E
Active HIGH enable input. TTL/CMOS logic compatible. Connect to V
or logic high for normal operation
N
IN
N/C
No connection
V
Regulator output
O
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ZXCL SERIES
Electrical characteristics
V = V = 0.5V, all values at T = 25°C (Unless otherwise stated)
IN
O
A
Symbol Parameter
Conditions
Limits
Units
Min. Typ. Max.
V
Output voltage
I =1mA
-2%
+2%
V
O
O
I =100mA
O
V +0.5V < V < V max
-3%
+3%
V
O
IN
IN
⌬V /⌬T Output voltage
-15
ppm/°C
O
temperature
coefficient
I
I
I
Output current
150
mA
mA
O(Max)
OLIM
O
XCL250/5213V25 only
100
160
Over current limit
800
XCL250/5213V25 only
No Load
105
230
25
50
750
50
120
Ground pin
current
A
A
I =150mA
O
I =100mA
40
15
100
A
mV
mV
mV
mV
mV
mV
mV
mV
%/V
O
V
Dropout voltage
note 3
I =10mA
All variants
DO
O
I =50mA
85
O
I =100mA ZXCL250 / 5213V25
163
155
140
140
140
140
0.02
325
310
280
280
280
280
0.1
O
I =100mA ZXCL260 / 5213V26
O
I =100mA ZXCL280 / 5213V28
O
I =100mA ZXCL300 / 5213V30
O
I =100mA ZXCL330 / 5213V33
O
I =100mA ZXCL400 / 5213V40
O
⌬V
⌬V
Line regulation
Load regulation
V =(V +0.5V) to 5.5V, I =1mA
IN O O
LNR
LDR
I =1mA to 100mA
0.01 0.04 %/mA
O
E
Output noise
voltage
f=10Hz to 100kHz, C =10F
50
V
RMS
N
O
V
Enable pin
hysteresis
150
mV
ENHS
I
I
Enable pin input
current
Shutdown supply
current
Thermal shutdown
temperature
V
V
=5.5V
=0V
100
1
nV
A
°C
EN
OSD
EN
EN
T
125
165
SD
Device testing is performed at TA=25°C. Device thermal performance is guaranteed by design.
Note1: Maximum power dissipation is calculated assuming the device is mounted on a PCB measuring 2 inches square
Note2:Output voltage will start to rise when VIN exceeds a value or approximately 1.3V. For normal operation,
VIN(min) > VOUT(nom) + 0.5V.
Note3:Dropout voltage is defined as the difference between VIN and VO, when VO has dropped 100mV below its nominal
value. Nominal value of VO is defined at VIN=VO+0.5V.
Issue 8 - October 2007
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ZXCL SERIES
Typical characteristics (ZXCL280 / 5213 shown)
6
5
4
3
2
1
0
0.25
0.20
0.15
0.10
0.05
0.00
VIN
IOUT = 100mA
IOUT = 1mA
0
1
2
3
4
5
6
100
5
0
25
50
75
100
125
150
175
Output Current (mA)
Input Voltage (V)
Input to Output Characteristics
Dropout Voltage v Output Current
25.0
24.8
24.6
24.4
24.2
24.0
23.8
23.6
23.4
23.2
23.0
2.81
2.80
2.79
VIN = 3.3V
No Load
VIN = 3.3V
No Load
-50
-25
0
25
50
75
-50
-25
0
25
50
75
100
Temperature (˚C)
Output Voltage v Temperature
Temperature (˚C)
Ground Current v Temperature
30
25
20
15
10
5
60
No Load
55
50
45
40
35
30
25
20
VIN = 5V
VIN = 3.3V
0
0
1
2
3
4
0
25
50
75
100
125
150
Input Voltage (V)
Ground Current v Input Voltage
Load Current (mA)
Ground Current v Load Current
Issue 8 - October 2007
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ZXCL SERIES
Typical characteristics
6
100
VIN = 5V
IL = 1mA to 50mA
COUT = 1μF
Enable
50
5
4
3
2
1
0
0
VIN = 5V
IL = 1mA
IL = 100mA
100
50
COUT = 1μF
COUT = 10μF
VIN = 3.3V
IL = 1mA
IL = 100mA
0
COUT = 10μF
-50
COUT = 1μF
-100
0
10 20 30 40 50 60 70 80 90 100
0.0
0.1
0.2
0.3
0.4
0.5
0.5
1M
Time (μs)
Start-Up Response
Time (ms)
Load Response
6
5
4
3
6
5
4
3
COUT = 1μF
Tr & Tf = 2.5μs
COUT = 1μF
Tr & Tf = 2.5μs
20
10
20
10
0
0
-10
-10
-20
-20
0.0
0.1
0.2
0.3
0.4
0.5
0.0
0.1
0.2
0.3
0.4
Time (ms)
Line Rejection IL = 1mA
Time (ms)
Line Rejection IL = 100mA
80
10
1
All Caps Ceramic
Surface Mount
IL = 100mA, COUT = 1μF
IL = 100mA, COUT = 10μF
70
60
50
40
30
20
10
0
IL = 50mA
COUT = 10μF
COUT = 2.2μF
0.1
0.01
No Load, COUT = 1μF
No Load, COUT = 10μF
COUT = 1μF
10
100
1k
10k
100k
1M
10
100
1k
10k
100k
Frequency (Hz)
Power Supply Rejection v Frequency
Frequency (Hz)
Output Noise v Frequency
Issue 8 - October 2007
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ZXCL SERIES
Connection diagrams
SC70-5 (H5)
SC70-5 (H5)
EN
N/C*
GND
VIN
VIN
VO
GND
VO
EN
NC
Top view
Top view
* Should be left open circuit
or connected to pin 3
ZXCLxxx
ZXCL5213Vxx
Schematic diagram
Issue 8 - October 2007
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ZXCL SERIES
Input to Output Diode
Increased Output current
In common with many other LDO regulators, the
ZXCL device has an inherent diode associated
with the output series pass transistor. This diode
has its anode connected to the output and its
cathode to the input. The internal diode is
normally reverse biased, but will conduct if the
output is forced above the input by more than a
VBE (approximately 0.6V). Current will then flow
Any ZXCL series device may be used in
conjunction with an external PNP transistor to
boost the output current capability. In the
application circuit shown below, a FMMT717
device is employed as the external pass
element. This SOT23 device can supply up to
2.5A maximum current subject to the thermal
dissipation limits of the package (625mW).
Alternative devices may be used to supply
higher levels of current. Note that with this
arrangement, the dropout voltage will be
from V
to V . For safe operation, the
out
in
maximum current in this diode should be
limited to 5mA continuous and 30mA peak. An
external schottky diode may be used to provide
protection when this condition cannot be
satisfied.
increased by the V drop of the external device.
BE
Also, care should be taken to protect the pass
transistor in the event of excessive output
current.
Scheme to boost output current to 2A
Issue 8 - October 2007
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ZXCL SERIES
Applications information
Enable control
A TTL compatible input is provided to allow the
regulator to be shut down. A low voltage on the
Enable pin puts the device into shutdown mode.
In this mode the regulator circuit is switched off
and the quiescent current reduces to virtually
zero (typically less than 10nA) for input voltages
above the minimum operating threshold of the
device. A high voltage on the Enable pin ensures
normal operation.
R
C
The Enable pin can be connected to V or
IN
driven from an independent source of up to 10V
maximum. (e.g. CMOS logic) for normal
operation. There is no clamp diode from the
Figure 1 Circuit Connection
Enable pin to V , so the V pin may be at any
IN
IN
voltage within its operating range irrespective
of the voltage on the Enable pin. However input
voltage rise time should be kept below 5ms to
ensure consistent start-up response.
Current Limit
The ZXCL devices include a current limit circuit
which restricts the maximum output current
flow to typically 230mA. Practically the range of
over-current should be considered as minimum
160mA to maximum 800mA. The device’s
robust design means that an output short circuit
T
d
to any voltage between ground and V
tolerated for an indefinite period.
can be
Figure 2 Start up delay (T )
OUT
d
Thermal Overload
Thermal overload protection is included on
chip. When the device junction temperature
exceeds a minimum 125°C the device will shut
down. The sense circuit will re-activate the
output as the device cools. It will then cycle until
the overload is removed. The thermal overload
protection will be activated when high load
currents or high input to output voltage
differentials cause excess dissipation in the
device.
VIN
− 1.5
⎛
⎜
⎝
⎞
⎟
⎠
Td(NOM) = RCIn
V
IN
Calculation of start up delay as above
Start up delay
A small amount of hysteresis is provided on the
Enable pin to ensure clean switching. This
feature can be used to introduce a start up delay
if required. Addition of a simple RC network on
the Enable pin provides this function. The
following diagram illustrates this circuit
connection. The equation provided enables
calculation of the delay period.
Issue 8 - October 2007
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ZXCL SERIES
Applications information (Cont)
Power dissipation
The dielectric of the ceramic capacitance is an
important consideration for the ZXCL Series
operation over temperature. Zetex recommends
minimum dielectric specification of X7R for the
input and output capacitors. For example a
ceramic capacitor with X7R dielectric will lose 20%
The maximum allowable power dissipation of
the device for normal operation (P
), is a
max
function of the package junction to ambient
thermal resistance ( ), maximum junction
θ
ja
temperature (Tj
), and ambient temperature
max
of its capacitance over a -40
range, whereas a capacitor with a Y5V dielectric
loses 80% of its capacitance at -40 C and 75% at
85 C.
ЊC to 85ЊC temperature
(T
), according to the expression:
amb
Њ
P
= (Tj
– T
) / θ
max
max
amb ja
Њ
The maximum output current (I
) at a given
max
An input capacitor of 1F (ceramic or tantalum) is
recommended to filter supply noise at the device
input and will improve ripple rejection.
value of Input voltage (V ) and output voltage
IN
(V
) is then given by
OUT
The input and output capacitors should be
positioned close to the device, and a ground plane
board layout should be used to minimise the
I
= P
/ (V - V
)
max
max
IN
OUT
The value of qja is strongly dependent upon the
type of PC board used. Using the SC70 package effects of parasitic track resistance.
it will range from approximately 280°C/W for a
Dropout voltage
multi-layer board to around 450°C/W for a single
sided board. It will range from 180°C/W to
300°C/W for the SOT23-5 package. To avoid
entering the thermal shutdo wn state, Tjmax
should be assumed to be 125°C and Imax less
The output pass transistor is a large PMOS device,
which acts like a resistor when the regulator enters
the dropout region. The dropout voltage is
therefore proportional to output current as shown
in the typical characteristics.
than the over-current limit,(I
). Power
OLIM
derating for the SC70 and SOT23-5 packages is
shown in the following graph.
Ground current
500
The use of a PMOS device ensures a low value of
ground current under all conditions including
dropout, start-up and maximum load.
400
SOT23
300
Power supply rejection and load transient
response
200
SC70
Line and Load transient response graphs are
shown in the typical characteristics.
100
0
These show both the DC and dynamic shift in the
output voltage with step changes of input voltage
and load current, and how this is affected by the
output capacitor.
-40
-20
0
20
40
60
80
100
Temperature (°C)
Derating Curve
Capacitor selection and regulator stability
If improved transient response is required, then an
output capacitor with lower ESR value should be
used. Larger capacitors will reduce over/
The device is designed to operate with all types
of output capacitor, including tantalum and low
ESR ceramic. For stability over the full operating undershoot, but will increase the settling time.
range from no load to maximum load, an output
capacitor with a minimum value of 1 F is
Best results are obtained using a ground plane
layout to minimise board parasitics.
μ
recommended, although this can be increased
without limit to improve load transient
performance. Higher values of output capacitor
will also reduce output noise. Capacitors with
ESR less than 0.5V are recommended for best
results.
Issue 8 - October 2007
© Zetex Semiconductors plc 2007
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ZXCL SERIES
S70-5 Package outline
␣
Dim.
Millimeters
Inches
Dim.
Millimeters
Min. Max.
2.10 BSC
Inches
Max. Max.
Min.
Max.
1.10
0.10
1.00
0.30
0.25
Min.
0.0315 0.0433
0.0039
0.0315 0.0039
0.006 0.0118
Max.
A
A1
A2
b
0.80
-
E
E1
e
0.0826 BSC
0.0492 BSC
0.0255 BSC
0.0511 BSC
-
1.25 BSC
0.65 BSC
1.30 BSC
0.80
0.15
0.08
e1
L
C
0.0031 0.0098
0.0787 BSC
0.26
0°
0.46
8°
0.010
0°
0.018
8°
D
2.00 BSC
␣
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Issue 8 - October 2007
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ZXCL SERIES
SOT23-5 Package outline
DIM
Millimeters
Inches
Max.
Min.
Max.
1.45
0.15
1.30
0.50
0.26
3.10
3.20
1.80
Min.
0.0354
0.00
0.0354
0.0078
0.0035
0.1062
0.0866
0.0511
A
A1
A2
b
C
D
E
E1
e
e1
L
a°
0.90
0.00
0.90
0.20
0.09
2.70
2.20
1.30
0.0570
0.0059
0.0511
0.0196
0.0102
0.1220
0.1181
0.0708
0.0374 REF
0.0748 REF
0.0236
30°
0.95 REF
1.90 REF
0.10
0°
0.60
30°
0.0039
0°
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Issue 8 - October 2007
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ZXCL SERIES
Intentionally left blank
Issue 8 - October 2007
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ZXCL SERIES
Definitions
Product change
Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or
service. Customers are solely responsible for obtaining the latest relevant information before placing orders.
Applications disclaimer
The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for
the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is
assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights
arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract,
tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract,
opportunity or consequential loss in the use of these circuit applications, under any circumstances.
Life support
Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written
approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body
or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labelling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to
cause the failure of the life support device or to affect its safety or effectiveness.
Reproduction
The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the
company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a
representation relating to the products or services concerned.
Terms and Conditions
All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two
when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement.
For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office.
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Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer.
To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our
regionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork
Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels.
ESD (Electrostatic discharge)
Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices.
The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent
of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time.
Devices suspected of being affected should be replaced.
Green compliance
Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding
regulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to
reduce the use of hazardous substances and/or emissions.
All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with
WEEE and ELV directives.
Product status key:
“Preview”
“Active”
Future device intended for production at some point. Samples may be available
Product status recommended for new designs
“Last time buy (LTB)”
Device will be discontinued and last time buy period and delivery is in effect
“Not recommended for new designs” Device is still in production to support existing designs and production
“Obsolete”
Production has been discontinued
Datasheet status key:
“Draft version”
This term denotes a very early datasheet version and contains highly provisional information, which
may change in any manner without notice.
“Provisional version”
“Issue”
This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance.
However, changes to the test conditions and specifications may occur, at any time and without notice.
This term denotes an issued datasheet containing finalized specifications. However, changes to
specifications may occur, at any time and without notice.
Zetex sales offices
Europe
Americas
Asia Pacific
Corporate Headquarters
Zetex GmbH
Kustermann-park
Balanstraße 59
D-81541 München
Germany
Zetex Inc
Zetex (Asia Ltd)
Zetex Semiconductors plc
Zetex Technology Park, Chadderton
Oldham, OL9 9LL
700 Veterans Memorial Highway
Hauppauge, NY 11788
USA
3701-04 Metroplaza Tower 1
Hing Fong Road, Kwai Fong
Hong Kong
United Kingdom
Telefon: (49) 89 45 49 49 0
Fax: (49) 89 45 49 49 49
europe.sales@zetex.com
Telephone: (1) 631 360 2222
Fax: (1) 631 360 8222
usa.sales@zetex.com
Telephone: (852) 26100 611
Fax: (852) 24250 494
asia.sales@zetex.com
Telephone: (44) 161 622 4444
Fax: (44) 161 622 4446
hq@zetex.com
© 2007 Published by Zetex Semiconductors plc
Issue 8 - October 2007
© Zetex Semiconductors plc 2007
14
www.zetex.com
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