ZXMN3A01E6TA [ZETEX]

30V N-CHANNEL ENHANCEMENT MODE MOSFET; 30V N沟道增强型MOSFET
ZXMN3A01E6TA
型号: ZXMN3A01E6TA
厂家: ZETEX SEMICONDUCTORS    ZETEX SEMICONDUCTORS
描述:

30V N-CHANNEL ENHANCEMENT MODE MOSFET
30V N沟道增强型MOSFET

晶体 小信号场效应晶体管 开关 光电二极管
文件: 总7页 (文件大小:1079K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ZXMN3A01E6  
30V N-CHANNEL ENHANCEMENT MODE MOSFET  
SUMMARY  
V
=30V; R  
=0.12 I =3.0A  
DS(ON) D  
(BR)DSS  
DESCRIPTION  
This new generation of TRENCH MOSFETs from Zetex utilizes a unique structure  
that combines the benefits of low on-resistance with fast switching speed. This  
makes them ideal for high efficiency, low voltage, power management  
applications.  
SOT23-6  
FEATURES  
Low on-resistance  
Fast switching speed  
Low threshold  
Low gate drive  
SOT23-6 package  
APPLICATIONS  
DC - DC Converters  
Power Management Functions  
Disconnect switches  
Motor control  
ORDERING INFORMATION  
DEVICE  
REEL  
SIZE  
TAPE  
WIDTH  
QUANTITY  
PER REEL  
ZXMN3A01E6TA  
ZXMN3A01E6TC  
7”  
12mm  
12mm  
1000 units  
4000 units  
13”  
DEVICE MARKING  
Top View  
3A1  
ISSUE 1 - MARCH 2002  
1
ZXMN3A01E6  
ABSOLUTE MAXIMUM RATINGS.  
PARAMETER  
SYMBOL  
LIMIT  
30  
UNIT  
Drain-Source Voltage  
Gate Source Voltage  
V
V
V
V
A
DSS  
GS  
20  
Continuous Drain Current V  
=10V; T =25°C (b)  
I
3.0  
2.4  
2.4  
GS  
A
D
V
=10V; T =70°C (b)  
GS  
A
V
=10V; T =25°C (a)  
GS  
A
Pulsed Drain Current (c)  
I
I
I
10  
2.4  
10  
A
A
A
DM  
S
Continuous Source Current (Body Diode) (b)  
Pulsed Source Current (Body Diode) (c)  
SM  
Power Dissipation at T =25°C (a)  
A
P
1.1  
8.8  
W
mW/°C  
D
Linear Derating Factor  
Power Dissipation at T =25°C (b)  
A
P
1.7  
13.6  
W
mW/°C  
D
Linear Derating Factor  
Operating and Storage Temperature Range  
T :T  
-55 to +150  
°C  
j
stg  
THERMAL RESISTANCE  
PARAMETER  
SYMBOL  
VALUE  
113  
UNIT  
°C/W  
°C/W  
Junction to Ambient (a)  
Junction to Ambient (b)  
NOTES  
R
R
θJA  
θJA  
70  
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions  
(b) For a device surface mounted on FR4 PCB measured at tр10 secs.  
(c) Repetitive rating 25mm x 25mm FR4 PCB, D = 0.05, pulse width 10s - pulse width limited by maximum junction temperature. Refer to  
Transient Thermal Impedance graph.  
ISSUE 1 - MARCH 2002  
2
ZXMN3A01E6  
CHARACTERISTICS  
ISSUE 1 - MARCH 2002  
3
ZXMN3A01E6  
ELECTRICAL CHARACTERISTICS (at TA = 25°C unless otherwise stated).  
PARAMETER  
SYMBOL  
MIN. TYP. MAX. UNIT CONDITIONS.  
STATIC  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Body Leakage  
V
30  
1
V
I
=250µA, V  
=0V  
(BR)DSS  
D
GS  
=30V, V =0V  
GS  
I
0.5  
V
µA  
nA  
V
DSS  
DS  
I
100  
V
=Ϯ20V, V  
=0V  
GSS  
GS  
DS  
Gate-Source Threshold Voltage  
V
R
I
=250µA, V  
= V  
GS(th)  
DS(on)  
DS  
=10V, I =2.5A  
GS  
D
Static Drain-Source On-State Resistance  
(1)  
0.106 0.12  
0.18  
V
V
GS  
GS  
D
=4.5V, I =2.0A  
D
Forward Transconductance (1)(3)  
DYNAMIC (3)  
g
3.5  
S
V
=4.5V,I =2.5A  
D
fs  
DS  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
SWITCHING(2) (3)  
Turn-On Delay Time  
Rise Time  
C
C
C
190  
38  
pF  
pF  
pF  
iss  
V
=25 V, V  
=0V,  
DS  
GS  
f=1MHz  
oss  
rss  
20  
t
t
t
t
1.7  
2.3  
6.6.  
2.9  
2.3  
ns  
ns  
ns  
ns  
nC  
d(on)  
V
R
=15V, I =2.5A  
D
r
DD  
=6.0, V  
=10V  
G
GS  
Turn-Off Delay Time  
Fall Time  
d(off)  
f
Gate Charge  
Q
V
=15V,V  
=5V,  
g
DS  
GS  
GS  
ID=2.5A  
Total Gate Charge  
Q
Q
Q
3.9  
0.6  
0.9  
nC  
nC  
nC  
g
V
=15V,V  
=10V,  
DS  
ID=2.5A  
Gate-Source Charge  
Gate-Drain Charge  
gs  
gd  
SOURCE-DRAIN DIODE  
Diode Forward Voltage (1)  
V
0.84  
0.95  
V
T =25°C, I =1.7A,  
GS  
SD  
J
S
V
=0V  
Reverse Recovery Time (3)  
Reverse Recovery Charge (3)  
t
17.7  
13.0  
ns  
T =25°C, I =2.5A,  
J F  
rr  
di/dt= 100A/µs  
Q
nC  
rr  
NOTES  
(1) Measured under pulsed conditions. Width=300µs. Duty cycle 2% .  
(2) Switching characteristics are independent of operating junction temperature.  
(3) For design aid only, not subject to production testing.  
ISSUE 1 - MARCH 2002  
4
ZXMN3A01E6  
TYPICAL CHARACTERISTICS  
ISSUE 1 - MARCH 2002  
5
ZXMN3A01E6  
TYPICAL CHARACTERISTICS  
ISSUE 1 - MARCH 2002  
6
ZXMN3A01E6  
PACKAGE DIMENSIONS  
PAD LAYOUT DETAILS  
e
b
2
L
E1  
E
DATUM A  
a
e1  
D
A
A2  
A1  
DIM Millimetres  
Inches  
Min  
Min  
Max  
Max  
A
0.90  
1.45  
0.15  
1.30  
0.50  
0.20  
3.00  
3.00  
1.75  
0.60  
0.35  
0.057  
0.006  
0.051  
0.019  
0.008  
0.118  
0.118  
0.069  
0.002  
A1  
A2  
b
0.00  
0
0.90  
0.035  
0.014  
0.0035  
0.110  
0.102  
0.059  
0.004  
0.35  
C
0.09  
D
2.80  
E
2.60  
E1  
L
1.50  
0.10  
e
0.95 REF  
1.90 REF  
0°  
0.037 REF  
0.074 REF  
0°  
e1  
L
10°  
10°  
© Zetex plc 2002  
Zetex plc  
Fields New Road  
Chadderton  
Oldham, OL9 8NP  
United Kingdom  
Zetex GmbH  
Streitfeldstraße 19  
D-81673 München  
Zetex Inc  
700 Veterans Memorial Hwy  
Hauppauge, NY11788  
Zetex (Asia) Ltd  
3701-04 Metroplaza, Tower 1  
Hing Fong Road  
Kwai Fong  
Hong Kong  
Germany  
USA  
Telephone (44) 161 622 4422  
Fax: (44) 161 622 4420  
Telefon: (49) 89 45 49 49 0  
Fax: (49) 89 45 49 49 49  
Telephone: (631) 360 2222  
Fax: (631) 360 8222  
Telephone: (852) 26100 611  
Fax: (852) 24250 494  
These offices are supported by agents and distributors in major countries world-wide.  
This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced  
for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company  
reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.  
For the latest product information, log on to www.zetex.com  
ISSUE 1 - MARCH 2002  
7

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