ZXMP4A16G [ZETEX]

40V P-CHANNEL ENHANCEMENT MODE MOSFET; 40V P沟道增强型MOSFET
ZXMP4A16G
型号: ZXMP4A16G
厂家: ZETEX SEMICONDUCTORS    ZETEX SEMICONDUCTORS
描述:

40V P-CHANNEL ENHANCEMENT MODE MOSFET
40V P沟道增强型MOSFET

文件: 总7页 (文件大小:269K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ZXMP4A16G  
40V P-CHANNEL ENHANCEMENT MODE MOSFET  
SUMMARY  
(BR)DSS  
V
= -40V: R  
= 0.060 : I = -6.4A  
DS(on) D  
DESCRIPTION  
This new generation of Trench MOSFETs from Zetex utilizes a unique structure  
that combines the benefits of low on-resistance with fast switching speed. This  
makes them ideal for high efficiency, low voltage, power management  
applications.  
SOT223  
FEATURES  
·
·
·
·
·
Low on-resistance  
Fast switching speed  
Low threshold  
Low gate drive  
SOT223 package  
APPLICATIONS  
·
·
·
·
DC-DC Converters  
Disconnect switches  
Audio output stages  
Motor Control  
PINOUT  
ORDERING INFORMATION  
DEVICE  
REEL  
SIZE  
TAPE  
WIDTH  
QUANTITY  
PER REEL  
ZXMP4A16GTA  
ZXMP4A16GTC  
7”  
12mm  
12mm  
1000 units  
4000 units  
13”  
Top View  
DEVICE MARKING  
· ZXMP  
4A16  
ISSUE 4 - J ULY 2003  
1
S E M IC O N D U C T O R S  
ZXMP4A16G  
ABSOLUTE MAXIMUM RATING  
PARAMETER  
S YMBOL  
VDSS  
VGS  
LIMIT  
-40  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
V
V
A
Ϯ20  
(b)  
(b)  
(a)  
Continuous Drain Current (VGS= -10V; TA=25°C)  
(VGS= -10V; TA=70°C)  
ID  
-6.4  
-5.1  
-4.6  
(VGS= -10V; TA=25°C)  
(c)  
Pulsed Drain Current  
IDM  
IS  
-21  
-5.2  
-21  
A
A
A
(b)  
Continuous Source Current (Body Diode)  
Pulsed Source Current (Body Diode)(c)  
ISM  
PD  
(a)  
Power Dissipation at TA=25°C  
Linear Derating Factor  
2.0  
16  
W
mW/°C  
(b)  
Power Dissipation at TA=25°C  
Linear Derating Factor  
PD  
3.9  
31  
W
mW/°C  
Operating and Storage Temperature Range  
Tj:Tstg  
-55 to +150  
°C  
THERMAL RESISTANCE  
PARAMETER  
S YMBOL  
RθJA  
VALUE  
62.5  
UNIT  
°C/W  
°C/W  
(a)  
Junction to Ambient  
(b)  
Junction to Ambient  
RθJA  
32.2  
NOTES  
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper,  
in still air conditions  
(b) For a device surface mounted on FR4 PCB measured at tр10 secs.  
(c) Repetitive rating 25mm x 25mm FR4 PCB, D=0.05 pulse width limited by maximum junction temperature.  
ISSUE 4 - J ULY 2003  
2
S E M IC O N D U C T O R S  
ZXMP4A16G  
CHARACTERISTICS  
ISSUE 4 - J ULY 2003  
3
S E M IC O N D U C T O R S  
ZXMP4A16G  
ELECTRICAL CHARACTERISTICS (at Tamb = 25°C unless otherwise stated).  
PARAMETER  
S YMBOL MIN. TYP. MAX. UNIT CONDITIONS  
S TATIC  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Body Leakage  
V(BR)DSS  
IDSS  
-40  
V
ID=-250µA, VGS=0V  
VDS=-40V, VGS=0V  
VGS=Ϯ20V, VDS=0V  
ID=-250A, VDS= VGS  
VGS=-10V, ID=-3.8A  
-1  
A  
nA  
V
IGSS  
100  
Gate-Source Threshold Voltage  
VGS(th)  
RDS(on)  
-1.0  
Static Drain-Source On-State  
0.060  
0.100  
(1)  
Resistance  
V
GS=-4.5V, ID=-2.9A  
(1)(3)  
Forward Transconductance  
gfs  
8.85  
S
VDS=-15V,ID=-3.8A  
(3)  
DYNAMIC  
Input Capacitance  
Ciss  
Coss  
Crss  
1007  
130  
85  
pF  
pF  
pF  
V
DS=-20V, VGS=0V,  
Output Capacitance  
f=1MHz  
Reverse Transfer Capacitance  
(2)(3)  
S WITCHING  
Turn-On Delay Time  
Rise Time  
td(on)  
tr  
td(off)  
tf  
2.33  
ns  
ns  
ns  
ns  
nC  
8.84  
V
DD =-20V, ID=-1A  
RG 6.0, VGS=-10V  
Turn-Off Delay Time  
Fall Time  
29.18  
12.54  
13.6  
Gate Charge  
Qg  
VDS=-20V,VGS=-5V,  
ID=-3.8A  
Total Gate Charge  
Qg  
26.1  
2.8  
nC  
nC  
nC  
V
DS=-20V,VGS=-10V,  
Gate-Source Charge  
Gate-Drain Charge  
S OURCE-DRAIN DIODE  
Qgs  
Qgd  
ID=-3.8A  
4.8  
(1)  
Diode Forward Voltage  
VSD  
-0.85 -1.2  
V
TJ=25ЊC, IS=-3.4A,  
V
GS=0V  
(3)  
Reverse Recovery Time  
trr  
27.2  
25.4  
ns  
TJ=25ЊC, IF=-3A,  
di/dt= 100A/s  
(3)  
Reverse Recovery Charge  
Qrr  
nC  
NOTES  
(1) Measured under pulsed conditions. Width Յ300µs. Duty cycle Յ 2%.  
(2) Switching characteristics are independent of operating junction temperature.  
(3) For design aid only, not subject to production testing.  
ISSUE 4 - J ULY 2003  
4
S E M IC O N D U C T O R S  
ZXMP4A16G  
TYPICAL CHARACTERISTICS  
ISSUE 4 - J ULY 2003  
5
S E M IC O N D U C T O R S  
ZXMP4A16G  
ISSUE 4 - J ULY 2003  
6
S E M IC O N D U C T O R S  
ZXMP4A16G  
PACKAGE OUTLINE  
PAD LAYOUT DETAILS  
PACKAGE DIMENSIONS  
Millim e t re s  
In ch e s  
Millim e t re s  
DIM  
In ch e s  
DIM  
Min  
-
Ma x  
1.80  
0.10  
0.84  
3.10  
0.33  
6.70  
Min  
Ma x  
Min  
Ma x  
Min  
Ma x  
0.0905 BSC  
0.181 BSC  
A
A1  
b
-
0.071  
e
e1  
E
2.30 BSC  
4.60 BSC  
0.02  
0.66  
2.90  
0.23  
6.30  
0.0008 0.004  
0.026  
0.114  
0.009  
0.248  
0.033  
0.122  
0.013  
0.264  
6.70  
7.30  
3.70  
-
0.264  
0.130  
0.287  
0.146  
-
b2  
C
E1  
L
3.30  
0.90  
0.0355  
D
© Zetex plc 2003  
Europe  
Am ericas  
Asia Pacific  
Zetex plc  
Fields New Road  
Chadderton  
Oldham, OL9 8NP  
United Kingdom  
Telephone (44) 161 622 4444  
Fax: (44) 161 622 4446  
hq@zetex.com  
Zetex GmbH  
Streitfeldstraße 19  
D-81673 München  
Zetex Inc  
700 Veterans Memorial Hwy  
Hauppauge, NY 11788  
Zetex (Asia) Ltd  
3701-04 Metroplaza Tower 1  
Hing Fong Road  
Kwai Fong  
Hong Kong  
Telephone: (852) 26100 611  
Fax: (852) 24250 494  
asia.sales@zetex.com  
Germany  
USA  
Telefon: (49) 89 45 49 49 0  
Fax: (49) 89 45 49 49 49  
europe.sales@zetex.com  
Telephone: (1) 631 360 2222  
Fax: (1) 631 360 8222  
usa.sales@zetex.com  
These offices are supported by agents and distributors in major countries world-wide.  
This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced  
for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company  
reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.  
For the latest product information, log on to w w w .zetex.com  
ISSUE 4 - J ULY 2003  
7
S E M IC O N D U C T O R S  

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