IXD3236A30DMR-G [ZILOG]
IC REG BUCK 3V 0.6A SYNC SOT25;
| 型号： | IXD3236A30DMR-G |
| 厂家： | 
ZILOG, INC. |
| 描述： | IC REG BUCK 3V 0.6A SYNC SOT25 |
| 文件： | 总27页 (文件大小：2144K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Product Specification
IXD3235/36/37
Synchronous 600 mA Step-Down DC/DC Converter
Operating voltage range is from 2.0 V to 6.0 V (A ～
FEATURES
C types) or 1.8 V to 6.0 V (D ～ G types). For the D/F
types, which have a reference voltage of 0.8 V with ±
2.0% accuracy, the output voltage can be set from
0.9 V by using two external resistors.
Built-in transistors
Operating Input Voltage Range: 2.0 V ~ 6.0 V
(A/B/C types) or 1.8 V ~ 6.0 V (D/E/F/G types)
Output Voltage Range Externally Set: 0.8 V ~ 4.0
V (internally set) or 0.9 ~ 6.0 V (externally set)
The A/B/C/E/G types have a fixed output voltage
from 0.8 V to 4.0 V in increments of 0.05 V with
± 2.0% accuracy. The device requires only an
inductor and two externally connected ceramic
capacitors. The built-in oscillator, either 1.2 MHz or
3.0 MHz, can be selected.
Output Current: 600 mA
High Efficiency: 92%
Oscillation Frequency: 1.2 MHz, 3 MHz
Maximum Duty Cycle: 100%
The IXD3235 operates in PWM mode, the IXD3236
automatically switches between PWM/PFM modes,
and the IXD3237 allows switch manually between the
PWM and the automatic PWM/PFM switching control
modes. This allows fast response, low ripple, and
high efficiency over the full range of loads from light
to heavy.
Operating Modes: PWM, PWM/PFM auto select
or PWM/PFM manual select
Functions: Build-in Current Limit, Load Capacitor
Discharge, High Speed Soft start
Operating Ambient temperature: -40 ~ +850C
Packages: SOT-25, USP-6C, USP-6EL, WLP-5-03
EU RoHS Compliant, Pb Free
The soft start and current control functions are
internally optimized. All circuits are disabled in a
standby mode to reduce current consumption to less
than 1.0 μA.
APPLICATION
Mobile Phones
Bluetooth headsets
Digital home appliances
Office automation equipment
Various portable equipment
The B/F/G types have a 0.25 ms high-speed soft-
start for quick turn-on. The built-in Under Voltage
Lockout (UVLO) function forces the internal
P-channel transistor OFF, when input voltage
becomes 1.4 V or lower.
DESCRIPTION
The B to G types have the output capacitor CL
discharge circuitry, which allows fast CL discharge
when IC goes into standby mode.
The IXD3235/36/37 series is a group of synchronous-
rectification type DC/DC converters with a built-in
0.52 Ω N-channel synchronous rectification transistor
and 0.42 Ω P-channel switching transistor providing
up to 600 mA output current.
Device is available in four types of packages: SOT-
25, USP-6C, USP-6EL, and WLP-5-03.
TYPICAL APPLICATION CIRCUITS
TYPICAL PERFORMANCE CHARACTERISTIC
Efficiency vs. Output Current (fOSC = 1.2 MHz, VOUT = 1.8 V)
PWM/PFM Automatic Switching mode
IXD3235/36/37 A, B, C, E, and G types
IXD3235/36/37 D and F types
PS034201-0515
PRELIMINARY
1
Product Specification
IXD3235/36/37
ABSOLUTE MAXIMUM RATINGS
PARAMETER
VIN Pin Voltage
SYMBOL
RATINGS
– 0.3 ~ 6.5
– 0.3 ~ VIN + 0.31
– 0.3 ~ 6.5
– 0.3 ~ 6.5
– 0.3 ~ 6.5
±1500
UNITS
VIN
VLX
VOUT
VFB
VCE
ILX
V
V
LX Pin Voltage
VOUT Pin Voltage
FB Pin Voltage
V
V
CE/MODE Pin Voltage
Lx Pin Current
V
mA
SOT-25
250
USP-6C
USP-6EL
WLP-5-03
120
Power Dissipation
PD
mW
120
750
Operating Temperature Range
Storage Temperature Range
TOPR
TSTG
– 40 ~ + 85
– 50 ~ +125
0C
0C
ELECTRICAL OPERATING CHARACTERISTICS
IXD3235/36/37 A series, VOUT = 1.8 V, Ta = 250C
PARAMETER
Operating Voltage Range
Output Voltage
SYMBOL
VIN
CONDITIONS
MIN. TYP. MAX. UNIT CIRCUIT
2.0
-
6.0
V
V
VOUT
VIN = VCE = 5.0 V, IOUT = 30 mA
VIN = VOUT(E) + 2.0 V, VCE = 1.0 V9)
VCE = VIN, VOUT = 01), 11)
1.764 1.800 1.836
600
Maximum Output Current
UVLO Voltage
IOUT_MAX
VUVLO
mA
V
1.00 1.40 1.78
IXD323xA18Cxx
IXD323xA18Dxx
15
21
0
33
35
Supply
Current
IQ
VIN = VCE = 5.0 V, VOUT = VOUT(E) x 1.1 V
VIN = 5.0 V, VCE = 0 V, VOUT = VOUT(E) x 1.1 V
VIN = VOUT(E) + 2 V, VCE = 1.0 V, IOUT = 100 mA
µA
µA
Standby Current
ISTB
fOSC
1.0
IXD323xA18Cxx
1020 1220 1380
2550 3000 3460
Oscillation
Frequency
kHz
IXD323xA18Dxx
IXD323xA18Cxx
IXD323xA18Dxx
PFM
Switching
Current
120
170
160
220
200
270
12)
IPFM
VIN = VCE = VOUT(E) + 2 V, , IOUT = 1 mA (see table A)
mA
12)
P-channel ON time maximum
Maximum Duty Cycle Ratio
Minimum Duty Cycle Ratio
tPON_MAX
VIN = VCE = (see table B), IOUT = 1 mA
VIN = VCE = 5.0 V, VOUT = VOUT(E) x 0.9 V
VIN = VCE = 5.0 V, VOUT = VOUT(E) x 1.1 V
2Dmax 3DMAX
DMAX
DMIN
100
%
%
0
IXD323xA18Cxx
Efficiency 2)
92
EFFI
VIN = VCE = VOUT(E) + 1.2 V, IOUT = 100 mA
%
IXD323xA18Dxx
86
LX “H” ON Resistance 13)
LX “H” ON Resistance 23)
LX “L” ON Resistance 14)
LX “L” ON Resistance 24)
LX “H” Leakage Current5)
LX “L” Leakage Current5)
Current Limit10)
RLXH1
RLXH2
RLXL1
RLXL2
ILXH
VIN = VCE = 5.0 V, VOUT = 0 V, ILX = 100 mA
VIN = VCE = 3.6 V, VOUT = 0 V, ILX = 100 mA
VIN = VCE = 5.0 V
0.35 0.55
0.42 0.67
0.45 0.65
0.52 0.77
Ω
Ω
Ω
VIN = VCE = 3.6 V
Ω
VIN = VCE = 5.0 V, VOUT = 0 V, VLX = 5.0 V
VIN = VCE = 5.0 V, VOUT = 0 V, VLX = 5.0 V
VIN = VCE = 5.0 V, VOUT = VOUT(E) x 0.9 V8)
0.01
0.01
1.0
1.0
µA
µA
mA
ILXH
ILIM
ꢀꢁꢂꢃ
900 1050 1350
±100
Output Voltage Temperature
Characteristics
CE “H” Voltage14)
CE “L” Voltage15)
PWM mode Start Voltage6), 13)
-400C ≤ TOPR ≤ 850C, IOUT = 30 mA
ppm/0C
ꢀꢁꢂꢃ ꢄ ꢅꢁꢆꢇ
VCEH
VOUT = 0 V
VOUT = 0 V
IOUT = 1 mA
0.65
0
6.0
0.25
V
V
VCEL
VPWM
VIN -1.0
PWM/PFM mode
Start Voltage6), 13)
VIN –
0.25
VPFM
IENH
IOUT = 1 mA
CE “H” Current
VIN = VCE = 5.0 V, VOUT = 0 V
-0.1
0.1
µA
PS034201-0515
PRELIMINARY
2
Product Specification
IXD3235/36/37
CE “L” Current
IENL
tSS
VIN = 5.0 V, VCE = 0 V, VOUT = 0 V
IOUT = 1 mA (see table C)
-0.1
0.5
0.5
0.1
2.5
2.5
µA
ms
IXD323xA18Cxx
IXD323xA18Dxx
1.0
0.9
Soft-Start
Time
VIN = VCE = 5.0 V, VOUT = 0.8 x VOUT(E), LX short with
1 Ω resistor to ground
VIN = VCE = 5.0 V, LX short with 1 Ω resistor to
ground
Latch Time7)
tLAT
1.0
20.0
ms
V
Short Protection Threshold
Voltage
VSHORT
0.675 0.900 1.150
NOTE:
Test conditions: Unless otherwise stated, VIN = 5.0 V, VOUT(E) = Nominal Voltage
1) Including hysteresis operating voltage range
2) EFFI = {(output voltage × output current) / (input voltage × input current)} × 100%
3) ON resistance (Ω) = (VIN - Lx pin measurement voltage) / 100mA
4) Design target value
5) A 10μA (maximum) current may leak at high temperature
6) The CE/MODE pin of the IXD3237A series functions also as an external switching pin between PWM and PWM/PFM control. Control
is switched to the automatic PWM/PFM switching mode when the CE/MODE pin voltage is equal to or greater than VIN minus 0.3 V,
and to the PWM mode when the CE/MODE pin voltage is equal to or lower than VIN minus 1.0V. However, it should be equal to or
greater than VCEH
7) Time from moment when VOUT is shorted to GND via 1 Ω resistor to the moment, when Current Limit generates pulse stopping LX
oscillations
8) When VIN is less than 2.4 V, current limit may not be reached because of voltage drop across ON resistance
9) When the difference between input and output voltage is small, some cycles may be skipped completely before current maximizes. If
load current increases in this state, output voltage will decrease because of the voltage drop across P-channel transistor
10) Current limit denotes the level of an inductor peak current
11) Voltage, when LX pin voltage is “L”=+0.1 V ~ -0.1 V
12) Not for IXD3235 series, because they have PWM mode only
13) The IXD3237 series only
14) Voltage at which LX pin state changes from “L” to “H” = VIN ~ VIN - 1.2 V”
15) Voltage at which LX pin state changes from “H” to “L” ”=+0.1 V ~ -0.1 V
PS034201-0515
PRELIMINARY
3
Product Specification
IXD3235/36/37
ELECTRICAL OPERATING CHARACTERISTICS (CONTINUED)
IXD3235/36/37 B/C/E/G series, VOUT = 1.8 V, Ta = 250C
PARAMETER
SYMBOL
CONDITIONS
MIN. TYP. MAX. UNIT CIRCUIT
B/C series
E/G series
2.0
1.8
-
6.0
6.0
Operating Voltage
Range
VIN
V
Output Voltage
VOUT
IOUT_MAX
VUVLO
VIN = VCE = 5.0 V, IOUT = 30 mA
1.764 1.800 1.836
600
V
mA
V
Maximum Output Current
UVLO Voltage
VIN = VOUT(E) + 2.0 V, VCE = 1.0 V9)
VCE = VIN, VOUT = VOUT(E) x 0.5 V 1), 11), 16)
1.00 1.40 1.78
IXD323xx18Cxx
IXD323xx18Dxx
15
21
0
33
35
Supply
Current
IQ
VIN = VCE = 5.0 V, VOUT = VOUT(E) x 1.1 V
VIN = 5.0 V, VCE = 0 V, VOUT = VOUT(E) x 1.1 V
VIN = VOUT(E) + 2 V, VCE = 1.0 V, IOUT = 100 mA
µA
µA
Standby Current
ISTB
fOSC
1.0
IXD323xx18Cxx
1020 1220 1380
2550 3000 3460
Oscillation
Frequency
kHz
IXD323xx18Dxx
IXD323xx18Cxx
IXD323xx18Dxx
PFM
Switching
Current
120
170
160
220
200
270
12)
IPFM
VIN = VCE = VOUT(E) + 2 V, , IOUT = 1 mA (see table A)
mA
12)
P-channel ON time maximum
Maximum Duty Cycle Ratio
Minimum Duty Cycle Ratio
tPON_MAX
VIN = VCE = (see table B), IOUT = 1 mA
VIN = VCE = 5.0 V, VOUT = VOUT(E) x 0.9 V
VIN = VCE = 5.0 V, VOUT = VOUT(E) x 1.1 V
2Dmax 3DMAX
DMAX
DMIN
100
%
%
0
IXD323xx18Cxx
Efficiency 2)
92
EFFI
VIN = VCE = VOUT(E) + 1.2 V, IOUT = 100 mA
%
IXD323xx18Dxx
86
LX “H” ON Resistance 13)
LX “H” ON Resistance 23)
LX “L” ON Resistance 14)
LX “L” ON Resistance 24)
LX “H” Leakage Current5)
LX “L” Leakage Current5)
Current Limit10)
RLXH1
RLXH2
RLXL1
RLXL2
ILXH
VIN = VCE = 5.0 V, VOUT = 0 V, ILX = 100 mA
VIN = VCE = 3.6 V, VOUT = 0 V, ILX = 100 mA
VIN = VCE = 5.0 V
0.35 0.55
0.42 0.67
0.45 0.65
0.52 0.77
Ω
Ω
Ω
VIN = VCE = 3.6 V
Ω
VIN = VCE = 5.0 V, VOUT = 0 V, VLX = 5.0 V
VIN = VCE = 5.0 V, VOUT = 0 V, VLX = 5.0 V
VIN = VCE = 5.0 V, VOUT = VOUT(E) x 0.9 V8)
0.01
0.01
1.0
1.0
µA
µA
mA
ILXH
ILIM
ꢀꢁꢂꢃ
900 1050 1350
±100
Output Voltage Temperature
Characteristics
CE “H” Voltage14)
CE “L” Voltage15)
PWM mode Start Voltage6), 13)
-400C ≤ TOPR ≤ 850C, IOUT = 30 mA
ppm/0C
ꢀꢁꢂꢃ ꢄ ꢅꢁꢆꢇ
VCEH
VOUT = 0 V
VOUT = 0 V
IOUT = 1 mA
0.65
0
6.0
0.25
V
V
VCEL
VPWM
VIN -1.0
PWM/PFM mode
Start Voltage6), 13)
VIN –
0.25
VPFM
IOUT = 1 mA
CE “H” Current
CE “L” Current
IENH
IENL
VIN = VCE = 5.0 V, VOUT = 0 V
-0.1
0.1
0.1
0.4
2.5
µA
µA
VIN = 5.0 V, VCE = 0 V, VOUT = 0 V
-0.1
0.5
IXD323xB(G)18Cxx
0.25
1.0
IXD323xC(E)18Cxx
IXD323xB(G)18Dxx
IXD323xC(E)18Dxx
Soft-Start
Time
tSS
IOUT = 1 mA (see table C)
ms
ms
0.32 0.50
0.5
1.0
0.9
2.5
VIN = VCE = 5.0 V, VOUT = 0.8 x VOUT(E), LX short with
1 Ω resistor to ground
Latch Time7)
tLAT
20.0
B/C series
E/G series
0.675 0.900 1.150
0.338 0.450 0.563
Short Protection
Threshold Voltage
VIN = VCE = 5.0 V, LX short with 1 Ω resistor to
ground
VSHORT
RDCL
V
CL Discharge Resistance
VIN = VLX = 5.0 V, VCE = 0 V, VOUT - open
200
300
450
Ω
NOTE:
Test conditions: Unless otherwise stated, VIN = 5.0 V, VOUT(E) = Nominal Voltage
1) Including hysteresis operating voltage range
2) EFFI = {(output voltage × output current) / (input voltage × input current)} × 100%
3) ON resistance (Ω) = (VIN - Lx pin measurement voltage) / 100mA
4) Design target value
PS034201-0515
PRELIMINARY
4
Product Specification
IXD3235/36/37
5) A 10μA (maximum) current may leak at high temperature
6) The CE/MODE pin of the IXD3237A series functions also as an external switching pin between PWM and PWM/PFM control. Control
is switched to the automatic PWM/PFM switching mode when the CE/MODE pin voltage is equal to or greater than VIN minus 0.3 V,
and to the PWM mode when the CE/MODE pin voltage is equal to or lower than VIN minus 1.0V. However, it should be equal to or
greater than VCEH
7) Time from moment when VOUT is shorted to GND via 1 Ω resistor to the moment, when Current Limit generates pulse stopping LX
oscillations
8) When VIN is less than 2.4 V, current limit may not be reached because of voltage drop across ON resistance
9) When the difference between input and output voltage is small, some cycles may be skipped completely before current maximizes. If
load current increases in this state, output voltage will decrease because of the voltage drop across P-channel transistor
10) Current limit denotes the level of an inductor peak current
11) Voltage, when LX pin voltage is “L”=+0.1 V ~ -0.1 V
12) Not for IXD3235 series, because they have PWM mode only
13) The IXD3237 series only
14) Voltage at which LX pin state changes from “L” to “H” = VIN ~ VIN - 1.2 V”
15) Voltage at which LX pin state changes from “H” to “L” ”=+0.1 V ~ -0.1 V
16) Voltage at which VOUT becomes more than VIN, while VIN is rising from 0 V to VOUT (E) x 0.5 V
PS034201-0515
PRELIMINARY
5
Product Specification
IXD3235/36/37
ELECTRICAL OPERATING CHARACTERISTICS (CONTINUED)
IXD3235/36/37 D/F series, VOUT = 1.8 V, Ta = 250C
PARAMETER
Operating Voltage Range
FB Voltage
SYMBOL
VIN
CONDITIONS
MIN. TYP. MAX. UNIT CIRCUIT
1.8
-
6.0
V
V
VFB
VIN = VCE = 5.0 V, IOUT = 30 mA
VIN = VOUT(E) + 2.0 V, VCE = 1.0 V9)
VCE = VIN, VOUT = 01), 11)
1.784 1.800 1.816
Maximum Output Current
UVLO Voltage
IOUT_MAX
VUVLO
600
mA
V
1.00 1.40 1.78
15
IXD323xx18Cxx
IXD323xx18Dxx
Supply
Current
IQ
VIN = VCE = 5.0 V, VOUT = VOUT(E) x 1.1 V
VIN = 5.0 V, VCE = 0 V, VOUT = VOUT(E) x 1.1 V
VIN = VOUT(E) + 2 V, VCE = 1.0 V, IOUT = 100 mA
µA
µA
21
0
35
Standby Current
ISTB
fOSC
1.0
IXD323xx18Cxx
1020 1220 1380
2550 3000 3460
Oscillation
Frequency
kHz
IXD323xx18Dxx
IXD323xx18Cxx
IXD323xx18Dxx
PFM
Switching
Current
120
170
160
220
200
270
12)
IPFM
VIN = VCE = VOUT(E) + 2 V, , IOUT = 1 mA (see table A)
mA
12)
P-channel ON time maximum
Maximum Duty Cycle Ratio
Minimum Duty Cycle Ratio
tPON_MAX
VIN = VCE = (see table B), IOUT = 1 mA
VIN = VCE = 5.0 V, VOUT = VOUT(E) x 0.9 V
VIN = VCE = 5.0 V, VOUT = VOUT(E) x 1.1 V
2Dmax 3DMAX
DMAX
DMIN
100
%
%
0
IXD323xx18Cxx
Efficiency 2)
92
EFFI
VIN = VCE = VOUT(E) + 1.2 V, IOUT = 100 mA
%
IXD323xx18Dxx
86
LX “H” ON Resistance 13)
LX “H” ON Resistance 23)
LX “L” ON Resistance 14)
LX “L” ON Resistance 24)
LX “H” Leakage Current5)
LX “L” Leakage Current5)
Current Limit10)
RLXH1
RLXH2
RLXL1
RLXL2
ILXH
VIN = VCE = 5.0 V, VOUT = 0 V, ILX = 100 mA
VIN = VCE = 3.6 V, VOUT = 0 V, ILX = 100 mA
VIN = VCE = 5.0 V
0.35 0.55
0.42 0.67
0.45 0.65
0.52 0.77
Ω
Ω
Ω
VIN = VCE = 3.6 V
Ω
VIN = VCE = 5.0 V, VOUT = 0 V, VLX = 5.0 V
VIN = VCE = 5.0 V, VOUT = 0 V, VLX = 5.0 V
VIN = VCE = 5.0 V, VOUT = VOUT(E) x 0.9 V8)
0.01
0.01
1.0
1.0
µA
µA
mA
ILXH
ILIM
ꢀꢁꢂꢃ
900 1050 1350
±100
Output Voltage Temperature
Characteristics
CE “H” Voltage14)
CE “L” Voltage15)
PWM mode Start Voltage6), 13)
-400C ≤ TOPR ≤ 850C, IOUT = 30 mA
ppm/0C
ꢀꢁꢂꢃ ꢄ ꢅꢁꢆꢇ
VCEH
VOUT = 0 V
VOUT = 0 V
IOUT = 1 mA
0.65
0
6.0
0.25
V
V
VCEL
VPWM
VIN -1.0
PWM/PFM mode
Start Voltage6), 13)
VIN –
0.25
VPFM
IOUT = 1 mA
CE “H” Current
CE “L” Current
IXD323xD18Cxx
IENH
IENL
VIN = VCE = 5.0 V, VOUT = 0 V
-0.1
0.1
0.1
2.5
µA
µA
VIN = 5.0 V, VCE = 0 V, VOUT = 0 V
-0.1
0.5
1.0
IXD323xF18Cxx
IXD323xD18Dxx
IXD323xF18Dxx
0.25 0.40
1.0 2.5
Soft-Start
Time
tSS
IOUT = 1 mA (see table C)
ms
ms
0.5
0.25 0.40
20.0
VIN = VCE = 5.0 V, VOUT = 0.8 x VOUT(E), LX short with
1 Ω resistor to ground
Latch Time7)
tLAT
1.0
Short Protection Threshold
Voltage
VIN = VCE = 5.0 V, LX short with 1 Ω resistor to
ground
VSHORT
RDCL
0.675 0.900 1.150
200 300 450
V
CL Discharge Resistance
VIN = VLX = 5.0 V, VCE = 0 V, VOUT - open
Ω
NOTE:
Test conditions: Unless otherwise stated, VIN = 5.0 V, VOUT(E) = Nominal Voltage
1) Including hysteresis operating voltage range
2) EFFI = {(output voltage × output current) / (input voltage × input current)} × 100%
3) ON resistance (Ω) = (VIN - Lx pin measurement voltage) / 100mA
4) Design target value
5) A 10μA (maximum) current may leak at high temperature
PS034201-0515
PRELIMINARY
6
Product Specification
IXD3235/36/37
6) The CE/MODE pin of the IXD3237A series functions also as an external switching pin between PWM and PWM/PFM control. Control
is switched to the automatic PWM/PFM switching mode when the CE/MODE pin voltage is equal to or greater than VIN minus 0.3 V,
and to the PWM mode when the CE/MODE pin voltage is equal to or lower than VIN minus 1.0V. However, it should be equal to or
greater than VCEH
7) Time from moment when VOUT is shorted to GND via 1 Ω resistor to the moment, when Current Limit generates pulse stopping LX
oscillations
8) When VIN is less than 2.4 V, current limit may not be reached because of voltage drop across ON resistance
9) When the difference between input and output voltage is small, some cycles may be skipped completely before current maximizes. If
load current increases in this state, output voltage will decrease because of the voltage drop across P-channel transistor
10) Current limit denotes the level of an inductor peak current
11) Voltage, when LX pin voltage is “L”=+0.1 V ~ -0.1 V
12) Not for IXD3235 series, because they have PWM mode only
13) The IXD3237 series only
14) Voltage at which LX pin state changes from “L” to “H” = VIN ~ VIN - 1.2 V”
15) Voltage at which LX pin state changes from “H” to “L” ”=+0.1 V ~ -0.1 V
TABLE A
PFM Switching Current (IPFM) vs. Oscillation Frequency and Setting Voltage
fOSC = 1.2 MHz
fOSC = 3.0 MHz
SETTING VOLTAGE
MIN
140
130
120
TYP
180
170
160
MAX
240
220
200
MIN
190
180
170
TYP
260
240
220
MAX
350
300
270
VOUT(E) ≤ 1.2 V
1.2 V < VOUT(E) ≤ 1.75V
VOUT(E) ≥ 1.8 V
TABLE B
Input Voltage (VIN) for Measuring P-channel ON time maximum tPON_MAX
fOSC
1,2 MHZ
3 MHZ
VIN
VOUT(E) + 0.5 V
VOUT(E) +1.0 V
NOTE:
Example:
When VOUT(E) = 1.2V and fOSC = 1.2 MHz, VIN should be 1.7 V, however, VIN should be at least 2.0 V if the minimum operating voltage is 2.0 V
TABLE C
Soft-Start Time vs. Setting Voltage and Oscillation Frequency (IXD3235/36/37 B and G Series only）
SOFT START TIME, µS
SERIES
fOSC
SETTING VOLTAGE, V
MIN
TYP
250
320
250
320
250
320
250
320
MAX
400
500
400
500
400
500
400
500
0.8 ≤ VOUT(E) < 1.75
1.5 ≤ VOUT(E) < 1.8
1.8 ≤ VOUT(E) < 2.5
2.5 ≤ VOUT(E) < 4.0
0.8 ≤ VOUT(E) < 2.5
2.5 ≤ VOUT(E) < 4.0
0.8 ≤ VOUT(E) < 1.8
1.8 ≤ VOUT(E) < 4.0
IXD3235B/G
IXD3237B/G
1.2 MHz
3.0 MHz
IXD3236B/G
IXD3235/36/37 B/G
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Product Specification
IXD3235/36/37
PIN CONFIGURATION
SOT-25 (Top View)
USP-6C (Bottom View)
USP-6EL (Bottom View)
WLP-5-03 (Bottom View)
NOTE:
The dissipation pad for the USP-6C and USP-6EL packages should be soldered in recommended mount pattern and metal masking to enhance
mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the VSS (No 2 and No 5) pins.
VSS pins (No. 2 and 5) should be tied together.
PIN ASSIGNMENT
PIN NUMBER
SOT-25 USP-6C/USP-6EL WLP-5-03
PIN NAME
FUNCTIONS
1
2
3
6
2, 5
4
2
3
1
VIN
VSS
CE/MODE
Power Input
Ground
Enable (Active HIGH), Mode Selection Pin
Fixed Output Voltage - A/B/C/E/G series
(Output Voltage Sense Pin - D/F series)
Switching Node
4
5
3
1
4
5
VOUT (FB)
LX
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Product Specification
IXD3235/36/37
BLOCK DIAGRAMS
IXD3235/36/37 A Series
IXD3235/36/37 B/C/E/G Series
IXD3235/36/37 D/F Series
Internal diodes include an ESD protection and a parasitic diode
BASIC OPERATION
The IXD3235/36/37 series consists of a Reference Voltage source, Ramp Wave Generator, Error Amplifier, PWM
Comparator, Phase Compensation circuit, output voltage resistive divider, P-channel switching transistor, N-
channel transistor for the synchronous switch, Current Limiter circuit, UVLO circuit, and others. (See the block
diagram above.)
The Error Amplifier compares output voltage divided by internal (external for D/F versions) resistors RFB1/RFB2 with
the internal reference voltage. Amplified difference between these two signals applies to the one input of the PWM
Comparator, while ramp voltage from the Ramp Wave Generator applies to the second input. Resulting PWM pulse
determines switching transistor ON time. It goes through the Buffer and it appears at the gate of the internal P-
channel switching transistor. This continuous process stabilizes output voltage.
The Current Feedback circuit monitors current of the P-channel transistor at each switching cycle, and modulates
output signal from the Error Amplifier to provide additional feedback. This guarantees a stable converter operation
even with low ESR ceramic load capacitor.
Reference Voltage Source
The Reference Voltage Source provides the reference voltage to ensure stable output voltage of the DC/DC
converter.
Ramp Wave Generator
The Ramp Wave Generator produces ramp waveform signal needed for PWM operation, and signals to
synchronize all the internal circuits. It operates at internally fixed 1.2 MHz or 3.0 MHz frequency.
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Product Specification
IXD3235/36/37
Error Amplifier
The Error Amplifier monitors output voltage through resistive divider connected to VOUT (FB) pin. If output voltage
falls below preset value and Error Amplifier’s input signal becomes less than internal reference voltage, the Error
Amplifier/s output signal increases. That results in wider PWM pulse and respectively longer ON time for switching
transistor to increase output voltage. The gain and frequency characteristics of the error amplifier output are fixed
internally to optimize IC performance.
Current Limiter
The Current Limiter circuit monitors current flowing through the P-channel transistor connected to the Lx pin, and
combines function of the current limit and operation suspension.
When transistor’s current is greater than a specified level, the Current Limiter turns off P-channel transistor
immediately. After that, the Current Limiter turns off too, returning to monitoring mode.
The driver transistor turns on at the next cycle, but the Current Limiter will turn it off immediately if an over current
exists. When the over current state is eliminated, the IC resumes its normal operation.
The IC waits for end of the over current state repeating above steps (t1 on figure below). If an over-current state
continues for a few ms with IC repeatedly performing above steps, the Current Limiter latches the P-channel
transistor in OFF state, and IC suspends operations (t2 on figure below). To restart IC operation after this condition,
either EN pin should be toggled H – L – H, or VIN pin voltage should be set below UVLO to resume operations from
soft start.
The suspension mode is not a standby mode. In the suspension mode, pulse output is suspended; however,
internal circuitries remain in operation mode consuming power.
Short-Circuit Protection
The short-circuit protection monitors the RFB1/RFB2 divider voltage (FB point in the block diagram). If output is
accidentally shorted to the ground, FB voltage starts falling. When this voltage becomes less than half of the
reference voltage (VREF) and P-channel switching transistor’s current is more than the ILIM threshold, the Short-
Circuit Protection turns off and latches quickly the P-channel transistor.
At D/E/F/G series, Short Circuit Protection starts once FB voltage becomes less than 0.25 of reference voltage
(VREF), disregard to transistor’s current.
To restart IC operation after this condition, either EN pin should be toggled H – L – H, or VIN pin voltage should be
set below UVLO to resume operations from soft start.
The sharp load transients creating a voltage drop at the VOUT, propagate to the FB point through CFB, that may
result in Short Circuit protection operating at voltages higher than 1/2 VREF voltage.
UVLO Circuit
When the VIN pin voltage becomes 1.4V or lower, the P-channel transistor is forced OFF to prevent false pulse
output caused by unstable operation of the internal circuitry. When the VIN pin voltage becomes 1.8 V or higher,
switching operations resume with the soft start. The soft start function operates even when the VIN voltage falls
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Product Specification
IXD3235/36/37
below the UVLO threshold for a very short time. The UVLO circuit does not cause a complete shutdown of the IC,
but causes pulse output to be suspended; therefore, the internal circuitry remains in operation.
PFM Switch Current
In PFM mode, the IC keeps the P-channel transistor on until inductor current reaches a specified level (IPFM).
P-channel transistor’s ON time is equal
tON = L×IPFM / (VIN - VOUT), µs,
where L is an inductance in µH, and IPFM is a current limit in A.
PFM Duty Limit
In PFM mode, P-channel ON time maximum (tPON_MAX) is set to 2DMAX, i.e. two periods of the switching frequency.
Therefore, under conditions, when the ON time increases (i.e. step-down ratio is small), it is possible that P-channel
transistor to be turned off, even when inductor current does not reach to IPFM. (See Figures 1 and 2 below)
Figure 1
CL High Speed Discharge
Figure 2
The IXD3235/36/37 B, C, D, E, F, and G series can quickly discharge the output capacitor (CL) to avoid application
malfunction, when CE pin set logic LOW to disable IC.
CL Discharge Time is proportional to the resistance (R) of the N-channel transistor located between the LX pin and
ground and the output CL capacitance as shown below.
tDSH = RCL x Ln (V OUT(E) / V), where
V - Output voltage after discharge
VOUT(E) - Output voltage
R = 300 Ω (Typical value）
Output Voltage Discharge Characteristics
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Product Specification
IXD3235/36/37
CE/MODE Pin Function
The IXD3235/36/37 series enter the shut down mode, when a LOW logic-level signal applies to the CE/MODE pin.
In the shutdown mode, IC current consumption is ~0 μA (Typical value), with the Lx and VOUT pins at high
impedance state. The IC starts its operation when a HIGH logic-level signal applies to the CE/MODE pin.
Intermediate voltage, generated by external resistive divider can be used to select PWM/PFM auto or PWM only
switching modes in respect with the table below.
OPERATION MODE
CE/MODE VOLTAGE LEVEL
IXD3235
IXD3236
IXD3537
Synchronous PWM/PFM auto
switching mode
0.65 V ≤ V CE/MODE ≤ 6.0 V
Synchronous Fixed PWM mode
-
Synchronous PWM/PFM auto
switching mode
VIN – 0.25 V ≤ V CE/MODE ≤ VIN
-
-
0.65 V ≤ V CE/MODE ≤ VIN – 1.0 V
-
-
Synchronous Fixed PWM mode
Standby mode
0 V ≤ V CE/MODE ≤ 0.25 V
Standby mode
Standby mode
Examples of CE/MODE pin use are shown below. Please set the value of each resistor from few hundreds kΩ to
few hundred MΩ. For switches, CPU open-drain I/O port and transistor can be used.
The CE/MODE pin is a CMOS input with a sink current ~ 0 μA.
IXD3235/36 series - Examples of how to use CE/MODE pin
IC STATUS
SW-CE
POSITION
ON
SCHEMATIC A
SCHEMATIC B
Active
Standby
Active
OFF
Standby
IXD3237 series - Examples of how to use CE/MODE pin
IC STATUS
SW-CE
POSITION
SW-PWM/PFM
POSITION
SCHEMATIC A
SCHEMATIC B
PWM/PFM Auto
Switching Mode
PWM Mode
ON
X
Standby
OFF
OFF
ON
OFF
PWM Mode
PWM/PFM Auto
Switching Mode
Standby
Soft Start
Soft start time is available in two options via product
selection.
The soft-start time of IXD3235/36/37 series is optimized by
using internal circuits and it is 1.0 ms (Typically.) for
A/C/D/E series and 0.25 ms for B/F/G series. D and F
series require external resistors and a capacitor to set the
output voltage, so the soft-start time might vary based on
value of those external components. The definition of the
soft-start time is the time when the output voltage goes up
to the 90% of nominal output voltage after the IC is enabled
by CE ”H” signal.
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Product Specification
IXD3235/36/37
TYPICAL APPLICATION CIRCUITS
IXD3235/36/37 A, B, C, E, G
Series (Fixed Output Voltage)
IXD3235/36/37 D, F Series (Adjustable Output Voltage)
EXTERNAL COMPONENTS
fOSC
1.2 MHz
3.0 MHz
L, µH
CIN, µF
CL, µF
4.7
4.7
10
1.5
4.7
10
Setting Output Voltage
The IXD3235/36/37 D, F Series allows set output voltage externally by two resistors RFB1 and RFB2 as sown on
schematic diagram above.
Output voltage can be set starting from 0.9V. However, when input voltage (VIN) is lower than the set output
voltage, output voltage (VOUT) cannot be higher than the input voltage.
VOUT = 0.8 × (RFB1+RFB2)/RFB2
RFB1 + RFB2 < 1 MΩ.
The value of the phase compensation capacitor CFB is calculated by the follow equation
fZFB = 1/(2×π×CFB×RFB1),
where fZFB < 10 kHz. For optimization, fZFB can be adjusted in the range of 1 kHz to 20 kHz depending on the
inductance L and the load capacitance CL.
Example:
When RFB1 = 470 kΩ and RFB2 = 150 k, VOUT = 0.8 × (470 k+150 k) / 150 k = 3.3 V
VOUT, V
0.9
RFB1, kΩ
100
RFB2, kΩ
820
CFB, pF
150
VOUT, V
2.5
RFB1, kΩ
510
RFB2, kΩ
240
CFB, pF
100
1.2
150
300
100
3.0
330
120
150
1.5
130
150
220
3.3
470
150
100
1.8
300
240
150
4.0
120
30
470
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IXD3235/36/37
LAYOUT AND USE CONSIDERATIONS
1. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce
the circuit impedance. Please, pay special attention to the VIN and GND wiring. Switching noise, which
occurs from the GND, may cause the instability of the IC, so, position VIN and VCL capacitors as close to IC
as possible.
2. Transitional voltage drops or voltage rising phenomenon could make the IC unstable if ratings are
exceeded.
3. The IXD3235/36/37 series are designed to work with ceramic output capacitors. However, if the difference
between input and output voltages is too high, a ceramic capacitor may fail to absorb the resulting high
switching energy and oscillation could occur. In this case, connect an electrolytic capacitor in parallel to
ceramic one to compensate for insufficient capacitance.
4. In PWM mode, IC generates very narrow pulses, and there is a possibility that some cycles will be skipped
completely, if the difference between VIN and VOUT is high.
5. If the difference between VIN and VOUT is small, IC generates very wide pulses, and there is a possibility
that some cycles will be skipped completely at the heavy load current.
6. When dropout voltage or load current is high, Current Limit may activate prematurely that will lead to IC
instability. To avoid this condition, choose inductor’s value to set peak current below Current Limit
threshold. Calculate the peak current according to the following formula:
IPK = (VIN - VOUT) x D / (2 x L x fOSC) + IOUT, where
L - Inductance
fOSC -- Oscillation Frequency
D – Duty cycle
7. Inductor’s rated current should exceed Current Limit threshold to avoid damage, which may occur until
P-channel transistor turns off after Current Limiter activates (see figure below).
Current flows into P-channel transistor reaches the current limit (ILIM).
Current is more than ILIM due the circuit’s delay time from the current limit detection to the P-channel transistor OFF.
The inductor’s current time rate becomes quite small.
IC generates very narrow pulses for several milliseconds.
The circuit latches, stopping operation.
8. If VIN voltage is less than 2.4 V, current limit threshold may be not reached due voltage drop caused by
switching transistor’s ON resistance
9. Latch time may become longer or latch may not work due electrical noise. To avoid this effect, the board
should be laid out so that input capacitors are placed as close to the IC as possible.
10. Use of the IC at voltages below recommended voltage range may lead to instability.
11. At high temperature, output voltage may increase up to input voltage level at no load, because of the
leakage current of the driver transistor.
12. High step-down ratio and very light load may be cause of intermittent oscillations.
13. In PWM/PFM automatic switching mode, IC may become unstable during transition to continuous mode.
Please verify with actual components.
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Product Specification
IXD3235/36/37
VOUT = 3.3 V, fOSC = 1.2 MHz, VIN = 3.7 V, IOUT = 100 mA
Ch 1 – VLX – 5 V/div; Ch 2 – VOUT – 2.0 mV/div
External components:
L = 4.7 µH (NP4018)
CIN = 4.7 µF (ceramic)
CL = 10 µF (ceramic)
14. The IC may enter unstable operation if the combination of ambient temperature, setting voltage, oscillation
frequency, and inductor’s value are not adequate. If IC operates close to the maximum duty cycle, it may
become
unstable, even if inductor values listed below
are used.
fOSC, MHz
3.0
VOUT, V
L, µH
VOUT = 3.3 V, fOSC = 1.2 MHz,
VIN = 4.0 V, IOUT = 150 mA
Ch 1 – VLX – 2.0 V/div;
0.8 V <VOUT < 4.0 V
VOUT ≤2.5 V
1.0 – 2.2
3.3 – 6.8
4.7 – 6.8
1.2
VOUT >2.5 V
Ch 2 – VOUT – 20 mV/div
External components:
L = 1.5 µH (NP3015)
CIN = 4.7 µF (ceramic)
CL = 10 µF (ceramic)
If an inductor less than 4.7μH is used at fOSC
=
1.2 MHz, or inductor less than 1.5 μH is used at fOSC
= 3.0 MHz, inductor peak current may easy reach
the current limit threshold ILIM. In this case, the IC
may be not able to provide 600mA output current.
15. The IC may become unstable, when it goes into continuous operation mode, and difference between VIN
and VOUT is high.
VOUT = 1.8 V, fOSC = 1.2 MHz,
VIN = 6.0 V, IOUT = 100 mA
Ch 1 – VOUT – 10 mV/div
Ch 2 – VLX – 5.0 V/div;
External components:
L = 4.7 µH (NP4018)
CIN = 4.7 µF (ceramic)
CL = 10 µF (ceramic)
16. Note on mounting (WLP-5-03)
a) Mounting pad design should be optimized for user's conditions.
b) Do not use eutectics solder paste. Sn-AG-Cu solder is used for the package terminals. If eutectic
solder is used, mounting reliability decreases.
c) When under fill agent is used to increase interfacial bonding strength, please take enough evaluation
for selection. Some under fill materials and application conditions may decrease bonding reliability.
d) The IC has exposed surface of silicon material in the top marking face and sides, so it is weak against
mechanical damages and external short circuit conditions. Please, take care of handling to avoid
cracks and breaks and keep the circuit open to avoid short-circuit from the outside.
e) Semi-transparent resin is coated on the circuit face of the package. Please be noted that the usage
under strong lights may affects device’s performance.
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Product Specification
IXD3235/36/37
TEST CIRCUITS
Circuit
A/B/C/E/G series
D/F series
External Components
External Components
L = 1.5 µH (NR3015) at 3.0 MHz
L = 4.7 µH (NR4018) at 1.2MHz
CIN = 4.7 μF (ceramic), CL = 10 μF (ceramic)
L = 1.5 µH (NR3015) at 3.0 MHz
L = 4.7 µH (NR4018) at 1.2MHz
CIN = 4.7 μF (ceramic), CL = 10 μF (ceramic)
RFB1 = 150 kΩ, RFB2
Circuit
=
300 kΩ, CFB = 120 pF
Circuit
RPULL = 200 Ω
Circuit
Circuit
IOUT = 100 mA, ON Resistance = (VIN – VOUT/0.1, Ω
Circuit
Circuit
b
RPULL = 1 Ω
Circuit
Circuit
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Product Specification
IXD3235/36/37
TYPICAL PERFORMANCE CHARACTERISTICS
(1) Efficiency vs. Output Current
Topr = 25 0C
IXD3237A18C
IXD3237A18D
L = 1.5 μH (NR3015), CIN = 4.7 μF, CL = 10 μF
L
=
4.7 µH (NR4018), CIN = 4.7 μF, CL= 10 μF
(2) Output Voltage vs. Output Current
IXD3237A18C
IXD3237A18D
L = 1.5 μH (NR3015), CIN = 4.7 μF, CL = 10 μF
L
=
4.7 µH (NR4018), CIN = 4.7 μF, CL= 10 μF
(3) Ripple Voltage vs. Output Current
IXD3237A18C
IXD3237A18D
L = 1.5 μH (NR3015), CIN = 4.7 μF, CL = 10 μF
L
=
4.7 µH (NR4018), CIN = 4.7 μF, CL= 10 μF
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Product Specification
IXD3235/36/37
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(4) Oscillation Frequency vs. Ambient Temperature
IXD3237A18C
IXD3237A18D
L = 1.5 μH (NR3015), CIN = 4.7 μF, CL = 10 μF
L
= 4.7 µH (NR4018), CIN = 4.7 μF, CL= 10 μF
(5) Supply Current vs. Ambient Temperature
IXD3237A18C
IXD3237A18D
(6) Output Voltage vs. Ambient Temperature
(7) UVLO Voltage vs. Ambient Temperature
IXD3237A18D
IXD3237A18D
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Product Specification
IXD3235/36/37
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(8) CE “H” Voltage vs. Ambient Temparature
(9) CE “L” Voltage vs. Ambient Temperature
IXD3237A18D
IXD3237A18D
(10) Soft Start Time vs. Ambient Temperature
IXD3237A18C
IXD3237A18D
L = 1.5 μH (NR3015), CIN = 4.7 μF, CL = 10 μF
L
=
4.7 µH (NR4018), CIN = 4.7 μF, CL= 10 μF
(11) ON Resistance vs. Ambient Temperature
IXD3237A18D
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Product Specification
IXD3235/36/37
(12) IXD3235/36/37 B version Start Wave Form
IXD3237B12C
IXD3237B33D
L = 1.5 μH (NR3015), CIN = 4.7 μF, CL = 10 μF
L
= 4.7 µH (NR4018), CIN = 4.7 μF, CL= 10 μF
100 µs/div
100 µs/div
(13) IXD3235/36/37 B version Soft Start Time vs. Ambient Temperature
IXD3237B12C
IXD3237B33D
L = 1.5 μH (NR3015), CIN = 4.7 μF, CL = 10 μF
L
= 4.7 µH (NR4018), CIN = 4.7 μF, CL= 10 μF
(14) IXD3235/36/37 B version CL Discharge Time vs. Ambient Temperature
IXD3237B33D
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Product Specification
IXD3235/36/37
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(15) Load Transient Response
IXD3237A18C
L = 4.7 µH (NR4018), CIN = 4.7 μF, CL= 10 μF, VIN = VCE = 3.6 V, (PWM/PFM Auto Switching mode)
IOUT = 1 mA 100 mA
IOUT = 1 mA 300 mA
Ch1 – IOUT, Ch2 – VOUT 50 mV/div, Time – 50 µs/div
Ch1 – IOUT, Ch2 – VOUT 50 mV/div, Time – 50 µs/div
IOUT = 100 mA 1 mA
IOUT = 300 mA 1 mA
Ch1 – IOUT, Ch2 – VOUT 50 mV/div, Time – 200 µs/div
Ch1 – IOUT, Ch2 – VOUT 50 mV/div, Time – 200 µs/div
IXD3237A18C
L = 4.7 µH (NR4018), CIN = 4.7 μF, CL= 10 μF, VIN = 3.6 V, VCE = 1.8 V (PWM mode)
IOUT = 1 mA 100 mA
IOUT = 1 mA 300 mA
Ch1 – IOUT, Ch2 – VOUT 50 mV/div, Time – 50 µs/div
IOUT = 100 mA 1 mA
Ch1 – IOUT, Ch2 – VOUT 50 mV/div, Time – 50 µs/div
IOUT = 300 mA 1 mA
Ch1 – IOUT, Ch2 – VOUT 50 mV/div, Time – 200 µs/div
Ch1 – IOUT, Ch2 – VOUT 50 mV/div, Time – 200 µs/div
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Product Specification
IXD3235/36/37
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(15) Load Transient Response (Continued)
IXD3237A18D
L = 1.5 µH (NR3015), CIN = 4.7 μF, CL= 10 μF, VIN = VCE = 3.6 V, (PWM/PFM Auto Switching mode)
IOUT = 1 mA 100 mA
IOUT = 1 mA 300 mA
Ch1 – IOUT, Ch2 – VOUT 50 mV/div, Time – 50 µs/div
Ch1 – IOUT, Ch2 – VOUT 50 mV/div, Time – 50 µs/div
IOUT = 100 mA 1 mA
IOUT = 300 mA 1 mA
Ch1 – IOUT, Ch2 – VOUT 50 mV/div, Time – 200 µs/div
Ch1 – IOUT, Ch2 – VOUT 50 mV/div, Time – 200 µs/div
IXD3237A18D
L = 1.5 µH (NR3015), CIN = 4.7 μF, CL= 10 μF, VIN = 3.6 V, VCE = 1.8 V (PWM mode)
IOUT = 1 mA 100 mA
IOUT = 1 mA 300 mA
Ch1 – IOUT, Ch2 – VOUT 50 mV/div, Time – 50 µs/div
IOUT = 100 mA 1 mA
Ch1 – IOUT, Ch2 – VOUT 50 mV/div, Time – 50 µs/div
IOUT = 300 mA 1 mA
Ch1 – IOUT, Ch2 – VOUT 50 mV/div, Time – 200 µs/div
Ch1 – IOUT, Ch2 – VOUT 50 mV/div, Time – 200 µs/div
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Product Specification
IXD3235/36/37
ORDERING INFORMATION
IXD3235-
IXD3236-
IXD3237-
DESIGNATOR
DESCRIPTION
SYMBOL
DESCRIPTION
A
B
C
E
G
D
F
Type of DC/DC Controller
Refer to Product Classification
- integer part, - decimal part, i.e.
VOUT = 2.8 V - = 2, = 8
Fixed Output Voltage, V
08 - 40
VOUT = 2.85 V - = 2, = L
0.05 V increments: 0.05 = A, 0.15 = B, 0.25 = C. 0.35 = D, 0.45 = E, 0.55 = F,
0.65 = H, 0.75 = K, 0.85 = L, 0.95 = M
Reference Voltage (Fixed) 0.8 V - = 0, = 8
1.2 MHz
3.0 MHz
SOT-25 (3000/reel)
SOT-25 (3000/reel)
USP-6C (3000/reel)
USP-6C (3000/reel)
USP-6EL (3000/reel)
WLP-5-03 (3000/reel)
Reference Voltage
Oscillation Frequency
Packages (Order Limit)
08
C
D
MR
MR-G
ER
ER-G
4R-G
0R-G
-*
NOTE:
1) The “-G” suffix denotes halogen and antimony free, as well as being fully RoHS compliant.
2) SOT-25, USP-6EL package are available for the A/B/C series only.
3) WLP-5-03 package is available for the A/B series only.
PRODUCT CLASSIFICATION
VOUT
VIN
Soft Start
Type
CL Auto discharge
Fixed
Yes
Yes
Yes
No
Yes
No
Yes
Adjustable
No
≥ 1.8 V
No
No
≥ 2 V
Yes
Yes
Yes
No
No
No
No
High Speed
No
Low Speed
Yes
A
B
C
D
E
F
No
No
No
Yes
No
Yes
No
Yes
Yes
Yes
Yes
Yes
Yes
Yes
No
No
No
Yes
Yes
No
Yes
Yes
Yes
No
No
No
Yes
Yes
Yes
Yes
G
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Product Specification
IXD3235/36/37
PACKAGE DRAWING AND DIMENSIONS
(Units: mm)
SOT-25
USP-6C
USP-6C Reference Metal Mask Design
USP-6C Reference Pattern Layout
PS034201-0515
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Product Specification
IXD3235/36/37
PACKAGE DRAWING AND DIMENSIONS (CONTINUED)
(Units: mm)
USP-6EL
WLP-5-03
NOTE: A part of the pin may appear from the side of the package
because of its structure, but reliability of the package and strength will
be not below the standard.
USP-6EL Reference Metal Mask Design
USP-6EL Reference Pattern Layout
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Product Specification
IXD3235/36/37
MARKING
SOT-25
Represents product series
MARK
IXD3236
PRODUCT SERIES
IXD3235
IXD3237
A
B
C
D
E
F
4
C
K
K
4
5
D
L
L
5
6
E
M
M
6
2
C
7
D
B
E
G
USP-6C/USP-6EL
Represents integer number of the output voltage and
oscillation frequency
A/B/C/F series
MARK
VOUT, V
fOSC = 1.2 MHz
fOSC = 3.0 MHz
0.x
1.x
2.x
3.x
4.x
A
B
C
D
E
F
H
K
L
M
WLP-5-03
E/G/D Series
MARK
VOUT, V
fOSC = 1.2 MHz
fOSC = 3.0 MHz
0.x
1.x
2.x
3.x
4.x
A
B
C
D
E
F
H
K
L
M
Represents decimal value of the output voltage
VOUT, V
x.00
x.10
x.20
x.30
x.40
x.50
x/60
x.70
x.80
x.90
MARK
VOUT, V
x.05
x.15
x.25
x.35
x.45
x.55
x.65
x.75
x.85
X,95
MARK
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
H
K
L
M
represents production lot number
01～09、0A～0Z、11～9Z、A1～A9、AA～AZ、B1～ZZ in order
(G, I, J, O, Q, and W excluded)
PS034201-0515
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Product Specification
IXD3235/36/37
Customer Support
To share comments, get your technical questions answered, or report issues you may be experiencing with our
products, please visit Zilog’s Technical Support page at http://support.zilog.com. To learn more about this product,
find additional documentation, or to discover other fac-ets about Zilog product offerings, please visit the Zilog
Knowledge Base at http:// zilog.com/kb or consider participating in the Zilog Forum at http://zilog.com/forum. This
publication is subject to replacement by a later edition. To determine whether a later edition exists, please visit the
Zilog website at http://www.zilog.com.
Warning: DO NOT USE THIS PRODUCT IN LIFE SUPPORT SYSTEMS.
LIFE SUPPORT POLICY ZILOG’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN
APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF ZILOG CORPORATION.
As used herein Life support devices or systems are devices which (a) are intended for surgical implant into the
body, or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions
for use provided in the labeling can be reasonably expected to result in a significant injury to the user. A critical
component is any component in a life support device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or system or to affect its safety or effectiveness.
Document Disclaimer ©2015 Zilog, Inc. All rights reserved. Information in this publication concerning the
devices, applications, or technology described is intended to suggest possible uses and may be superseded. ZILOG,
INC. DOES NOT ASSUME LIABILITY FOR OR PROVIDE A REPRESENTATION OF ACCURACY OF THE
INFORMATION, DEVICES, OR TECHNOLOGY DESCRIBED IN THIS DOCUMENT. ZILOG ALSO DOES
NOT ASSUME LIABILITY FOR INTELLECTUAL PROPERTY INFRINGEMENT RELATED IN ANY
MANNER TO USE OF INFORMATION, DEVICES, OR TECHNOLOGY DESCRIBED HEREIN OR
OTHERWISE. The information contained within this document has been verified according to the general
principles of electrical and mechanical engineering.
PS034201-0515
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