MDS739 [ZMD]
Package SOP24; 封装SOP24
| 型号： | MDS739 |
| 厂家： | 
Zentrum Mikroelektronik Dresden AG |
| 描述： | Package SOP24 |
| 文件： | 总1页 (文件大小：129K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ZMD-Standard
November 1995
Package SOP24
MDS
(300 mil)
739
Supersedes
Maße in mm
Based on IEC 191-2Q: Type 075E05 B
Dimens ions
1
View X
k x 45
X
0,1
24
LP
1
b
Z
e
M
0,2
D
Dimens ions of Sub-Group B1
Amax
Dimens ions of Sub-Group C1
2,65
Amin
2,45
0,10
0,30
2,25
2,45
0,23
0,32
15,20
15,60
7,40
7,60
0,25
0
bPmin
bPmax
enom
0,35
0,49
A1min
A1max
A2min
A2max
cmin
1,27
HEmin
HEmax
LPmin
Zmax
10,00
10,65
0,40
cmax
0,82
Dmin
*
Dmax
*
2
3
4
5
6
Weight
0,7 g
Low stress epoxy
Emin
Emax
kmin
*
Package Body Material
Lead Material
Lead Finis h
*
FeNi-Alloy or Cu-Alloy
solder plating
Z-bends
°
°
min
Lead Form
8
max
* without mold-flash
Zentrum Mikroelektronik Dresden GmbH
Editor: signed Schoder
Date: 13.11.1995
Doc-No.
QS-000739-HD-02
Check: signed Wilde
Quality: signed Lorenz
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Proprietary data, company confidential. All rights reserved.
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