U6264BDK07G1 [ZMD]

STANDARD 5K X 8 SRAM; 标准5K ×8 SRAM
U6264BDK07G1
型号: U6264BDK07G1
厂家: Zentrum Mikroelektronik Dresden AG    Zentrum Mikroelektronik Dresden AG
描述:

STANDARD 5K X 8 SRAM
标准5K ×8 SRAM

静态存储器
文件: 总9页 (文件大小:163K)
中文:  中文翻译
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U6264B  
Standard 8K x 8 SRAM  
Features  
Description  
! 8192 x 8 bit static CMOS RAM  
! 70 ns Access Times  
! Common data inputs and  
outputs  
The U6264B is a static RAM manu-  
factured using a CMOS process  
technology with the following ope-  
rating modes:  
address, data input and control  
signals W or G, the operating cur-  
rent (at IO = 0 mA) drops to the  
value of the operating current in the  
Standby mode. The Read cycle is  
finished by the falling edge of E2 or  
W, or by the rising edge of E1,  
respectively.  
! Three-state outputs  
! Typ. operating supply current  
70 ns: 10 mA  
- Read  
- Write  
- Standby  
- Data Retention  
The memory array is based on a  
6-transistor cell.  
! Standby current:  
< 2 µA at T 70 °C  
The circuit is activated by the rising  
edge of E2 (at E1 = L), or the falling  
edge of E1 (at E2 = H). The  
address and control inputs open  
simultaneously. According to the  
information of W and G, the data  
inputs, or outputs, are active. In a  
Read cycle, the data outputs are  
activated by the falling edge of G,  
afterwards the data word read will  
be available at the outputs DQ0 -  
DQ7. After the address change, the  
data outputs go High-Z until the  
new read information is available.  
The data outputs have no preferred  
state. If the memory is driven by  
CMOS levels in the active state,  
and if there is no change of the  
Data retention is guaranteed down  
to 2 V. With the exception of E2, all  
inputs consist of NOR gates, so  
that no pull-up/pull-down resistors  
are required. This gate circuit  
allows to achieve low power  
standby requirements by activation  
with TTL-levels too.  
a
! Data retention current at 2 V:  
< 1 µA at T 70 °C  
a
! TTL/CMOS-compatible  
! Automatic reduction of power  
dissipation in long Read or Write  
cycles  
! Power supply voltage 5 V  
! Operating temperature ranges:  
0 to 70 °C  
If the circuit is inactivated by  
E2 = L, the standby current (TTL)  
drops to 150 µA typ.  
-40 to 85 °C  
-40 to 125 °C  
! QS 9000 Quality Standard  
! ESD protection > 2000 V  
(MIL STD 883C M3015.7)  
! Latch-up immunity > 100 mA  
! Packages: PDIP28 (600 mil)  
SOP28 (330 mil)  
Pin Configuration  
Pin Description  
Signal Name Signal Description  
n.c.  
A12  
A7  
A6  
A5  
A4  
A3  
A2  
A1  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
1
2
3
4
5
6
7
8
VCC  
A0 - A12  
Address Inputs  
Data In/Out  
W (WE)  
E2 (CE2)  
A8  
A9  
A11  
G (OE)  
A10  
E1 (CE1)  
DQ7  
DQ6  
DQ5  
DQ0 - DQ7  
Chip Enable 1  
Chip Enable 2  
Output Enable  
Write Enable  
Power Supply Voltage  
Ground  
E1  
E2  
PDIP  
SOP  
G
9
W
A0  
10  
11  
12  
13  
14  
DQ0  
DQ1  
DQ2  
VSS  
VCC  
VSS  
DQ4  
DQ3  
not connected  
n.c.  
Top View  
April 20, 2004  
1
U6264B  
Block Diagram  
A4  
A5  
A6  
A7  
A8  
A9  
Memory Cell  
Array  
256 Rows x  
256 Columns  
A11  
A12  
A0  
A1  
A2  
A3  
DQ0  
DQ1  
DQ2  
DQ3  
DQ4  
DQ5  
Sense Amplifier/  
Write Control Logic  
A10  
Address  
Change  
Detector  
Clock  
DQ6  
DQ7  
Generator  
E2  
E1  
VSS  
W
G
VCC  
1
Truth Table  
Operating Mode  
E1  
E2  
W
G
DQ0 - DQ7  
*
H
L
L
L
L
*
*
*
*
*
High-Z  
High-Z  
High-Z  
Standby/not selected  
Internal Read  
Read  
H
H
H
H
H
L
H
L
*
Data Outputs Low-Z  
Data Inputs High-Z  
Write  
H or L  
*
April 20, 2004  
2
U6264B  
Characteristics  
All voltages are referenced to VSS = 0 V (ground).  
All characteristics are valid in the power supply voltage range and in the operating temperature range specified.  
Dynamic measurements are based on a rise and fall time of 5 ns, measured between 10 % and 90 % of VI, as well as  
input levels of VIL = 0 V and VIH = 3 V. The timing reference level of all input and output signals is 1.5 V,  
with the exception of the tdis-times, in which cases transition is measured ± 200 mV from steady-state voltage.  
a
Absolute Maximum Ratings  
Symbol  
Min.  
Max.  
Unit  
Power Supply Voltage  
Input Voltage  
VCC  
VI  
-0.3  
-0.3  
-0.3  
-
7
VCC + 0.5  
VCC + 0.5  
1
V
V
b
b
Output Voltage  
VO  
PD  
Ta  
V
Power Dissipation  
Operating Temperature  
W
C-Type  
K-Type  
A-Type  
0
70  
85  
°C  
°C  
°C  
-40  
-40  
125  
Storage Temperature  
C/K-Type  
A-Type  
Tstg  
-55  
-65  
125  
150  
°C  
°C  
Output Short-Circuit Current  
at VCC = 5 V and VO = 0 V c  
| IOS  
|
100  
mA  
a
Stresses greater than those listed under „Absolute Maximum Ratings“ may cause permanent damage to the device. This is a stress rating  
only, and functional operation of the device at condition above those indicated in the operational sections of this specification is not implied.  
Exposure to absolute maximum rating conditions for extended periods may affect reliability  
b
c
Maximum voltage is 7 V  
Not more than 1 output should be shorted at the same time. Duration of the short circuit should not exceed 30 s.  
Recommended  
Symbol  
Conditions  
Min.  
Max.  
Unit  
Operating Conditions  
Power Supply Voltage  
Data Retention Voltage  
VCC  
4.5  
2.0  
5.5  
V
V
VCC(DR)  
Input Low Voltage d  
Input High Voltage  
VIL  
-0.3  
2.2  
0.8  
V
V
VIH  
VCC + 0.3  
d
-2 V at Pulse Width 10 ns  
April 20, 2004  
3
U6264B  
Electrical Characteristics  
Symbol  
Conditions  
Min.  
Max.  
Unit  
Supply Current - Operating Mode  
ICC(OP) VCC  
= 5.5 V  
= 0.8 V  
= 2.2 V  
= 70 ns  
55  
mA  
VIL  
VIH  
tcW  
Supply Current - Standby Mode  
(CMOS level)  
ICC(SB) VCC  
= 5.5 V  
VE1 = VE2 = VCC - 0.2 V  
or VE2  
= 0.2 V  
C-Type  
K-Type  
A-Type  
2
5
µA  
µA  
µA  
100  
Supply Current - Standby Mode  
(TTL level)  
ICC(SB)1 VCC  
= 5.5 V  
3
mA  
VE1 = VE2 = 2.2 V  
or VE2  
= 0.8 V  
Supply Current - Data Retention  
Mode  
ICC(DR) VCC(DR)  
=
2 V  
VE1 = VE2 = VCC(DR) - 0.2 V  
or VE2  
= 0.2 V  
C-Type  
K-Type  
A-Type  
1
3
µA  
µA  
µA  
50  
Output High Voltage  
Output Low Voltage  
VOH  
VOL  
VCC  
IOH  
= 4.5 V  
2.4  
3.2  
V
V
= -1.0 mA  
= 4.5 V  
VCC  
IOL  
0.4  
-1  
= 3.2 mA  
Output High Current  
Output Low Current  
IOH  
IOL  
VCC  
VOH  
VCC  
VOL  
= 4.5 V  
= 2.4 V  
= 4.5 V  
= 0.4 V  
mA  
mA  
Input Leakage Current  
High  
IIH  
VCC  
= 5.5 V  
= 5.5 V  
VIH  
C/K-Type  
A-Type  
-
-
1
2
µA  
µA  
VCC  
= 5.5 V  
Low  
IIL  
VIL  
=
0 V  
C/K-Type  
A-Type  
-1  
-2  
-
-
µA  
µA  
Output Leakage Current  
High at Three-State Outputs  
IOHZ  
VCC  
= 5.5 V  
= 5.5 V  
VOH  
C/K-Type  
A-Type  
-
-
1
2
µA  
µA  
VCC  
= 5.5 V  
Low at Three-State Outputs  
IOLZ  
VOL  
=
0 V  
C/K-Type  
A-Type  
-1  
-2  
-
-
µA  
µA  
April 20, 2004  
4
U6264B  
Symbol  
Switching Characteristics  
Min.  
Max.  
Unit  
Alt.  
IEC  
Time to Output in Low-Z  
tLZ  
tt(QX)  
5
10  
ns  
Cycle Time  
Write Cycle Time  
Read Cycle Time  
tWC  
tRC  
tcW  
tcR  
70  
70  
ns  
ns  
Access Time  
E1 LOW or E2 HIGH to Data Valid  
G LOW to Data Valid  
Address to Data Valid  
tACE  
ta(E)  
ta(G)  
ta(A)  
-
-
-
70  
40  
70  
ns  
ns  
ns  
tOE  
tAA  
Pulse Widths  
Write Pulse Width  
Chip Enable to End of Write  
tWP  
tCW  
tw(W)  
tw(E)  
50  
65  
ns  
ns  
Setup Times  
Address Setup Time  
Chip Enable to End of Write  
Write Pulse Width  
Data Setup Time  
tAS  
tCW  
tWP  
tDS  
tsu(A)  
tsu(E)  
tsu(W)  
tsu(D)  
0
ns  
ns  
ns  
ns  
65  
50  
35  
Data Hold Time  
t
t
th(D)  
th(A)  
0
0
ns  
ns  
DH  
AH  
Address Hold from End of Write  
Output Hold Time from Address Change  
tOH  
tv(A)  
5
0
ns  
ns  
E1 HIGH or E2 LOW to Output in High-Z  
W LOW to Output in High-Z  
tHZCE  
tdis(E)  
25  
G HIGH to Output in High-Z  
tHZWE  
tHZOE  
tdis(W)  
tdis(G)  
0
0
30  
25  
ns  
ns  
Data Retention Mode E1-Controlled  
Data Retention Mode E2-Controlled  
VCC  
VCC  
4.5 V  
4.5 V  
0 V  
V
CC(DR) 2 V  
V
CC(DR) 2 V  
Data Retention  
E2(DR) 0.2 V  
E2  
2.2 V  
E1  
2.2 V  
0 V  
trec  
tDR  
tDR  
trec  
0.8 V  
Data Retention  
0.8 V  
V
V
V
E2(DR) VCC(DR) - 0.2 V or VE2(DR) 0.2 V  
CC(DR) - 0.2 V VE1(DR) VCC(DR) + 0.3 V  
Chip Deselect to Data Retention Time tDR  
Operating Recovery Time trec  
:
:
min 0 ns  
min tcR  
April 20, 2004  
5
U6264B  
Test Configuration for Functional Check  
5 V  
VCC  
A0  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
A9  
A10  
A11  
A12  
DQ0  
DQ1  
DQ2  
DQ3  
DQ4  
DQ5  
DQ6  
DQ7  
960  
VIH  
VIL  
VO  
30 pFe  
E1  
E2  
W
510  
VSS  
G
e In measurement of tdis(E), tdis(W), tdis(G) the capacitance is 5 pF.  
Capacitance  
Conditions  
VCC = 5.0 V  
Symbol  
Min.  
Max.  
Unit  
Input Capacitance  
CI  
8
pF  
VI = VSS  
f
= 1 MHz  
Output Capacitance  
CO  
10  
pF  
Ta = 25 °C  
All pins not under test must be connected with ground by capacitors.  
Ordering Code  
Example  
Type  
U6264B S2  
K
07 LL  
Leadfree Option  
blank= Standard Package  
Package  
G1 = Leadfree Green Package f  
D = PDIP28 (600 mil, only C/K-Type)  
S = SOP28 (330 mil) Type 1  
S2 = SOP28 (330 mil) Type 2  
Power Consumption  
blank= Standard (only A-Type)  
LL  
= Very Low Power (C/K-Type)  
Operating Temperature Range  
C = 0 to 70 °C  
Access Time  
07 = 70 ns  
K = -40 to 85 °C  
A = -40 to 125 °C  
f on special request  
Device Marking (example)  
ZMD  
Product specification  
Date of manufacture  
U6264BS2K  
07LL C 0425  
(The first 2 digits indicating  
the year, and the last 2  
digits the calendar week.)  
Assembly location and  
trace code  
1 ZZ  
G1  
Internal Code  
Leadfree Green Package  
April 20, 2004  
6
U6264B  
Read Cycle 1 (during Read cycle: E1 = G = VIL, E2 = W = VIH)  
tcR  
Ai  
Addresses Valid  
ta(A)  
DQi  
Previous Data Valid  
tv(A)  
Output Data Valid  
Output  
Read Cycle 2 (during Read cycle: W = VIH)  
tcR  
Ai  
Addresses Valid  
ta(E)  
tt(QX)  
tsu(A)  
E1  
tdis(E)  
tdis(E)  
tsu(A)  
ta(E)  
tt(QX)  
E2  
G
ta(G)  
tdis(G)  
tt(QX)  
DQi  
High-Z  
Output Data Valid  
Output  
Write Cycle 1 (W-controlled)  
tcW  
Ai  
Addresses Valid  
tsu(E)  
th(A)  
E1  
E2  
tsu(E)  
tw(W)  
tsu(A)  
W
tsu(D)  
th(D)  
DQi  
Input Data Valid  
Input  
tdis(W)  
tt(QX)  
DQi  
High-Z  
Output  
G
April 20, 2004  
7
U6264B  
Write Cycle 2 (E1-controlled)  
tcW  
Ai  
Addresses Valid  
tw(E)  
tsu(A)  
th(A)  
E1  
E2  
W
tsu(E)  
tsu(W)  
th(D)  
tsu(D)  
DQi  
Input Data Valid  
Input  
tdis(W)  
tt(QX)  
High-Z  
DQi  
Output  
G
Write Cycle 3 (E2-controlled)  
tcW  
Ai  
Addresses Valid  
tsu(E)  
th(A)  
E1  
tsu(A)  
tw(E)  
E2  
W
tsu(W)  
tsu(D)  
th(D)  
DQi  
Input Data Valid  
Input  
tdis(W)  
tt(QX)  
DQi  
High-Z  
Output  
G
L- or H-level  
undefined  
The information describes the type of component and shall not be considered as assured characteristic. Terms of  
delivery and rights to change design reserved.  
April 20, 2004  
8
U6264B  
LIFE SUPPORT POLICY  
ZMD products are not designed, intended, or authorized for use as components in systems intended for surgical  
implant into the body, or other applications intended to support or sustain life, or for any other application in which  
the failure of the ZMD product could create a situation where personal injury or death may occur.  
Components used in life-support devices or systems must be expressly authorized by ZMD for such purpose.  
LIMITED WARRANTY  
The information in this document has been carefully checked and is believed to be reliable. However Zentrum  
Mikroelektronik Dresden AG (ZMD) makes no guarantee or warranty concerning the accuracy of said information  
and shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it.  
The information in this document describes the type of component and shall not be considered as assured charac-  
teristics.  
ZMD does not guarantee that the use of any information contained herein will not infringe upon the patent, trade-  
mark, copyright, mask work right or other rights of third parties, and no patent or licence is implied hereby. This  
document does not in any way extent ZMD’s warranty on any product beyond that set forth in its standard terms and  
conditions of sale.  
ZMD reserves terms of delivery and reserves the right to make changes in the products or specifications, or both,  
presented in this publication at any time and without notice.  
Zentrum Mikroelektronik Dresden AG  
April 20, 2004  
Grenzstraße 28 D-01109 Dresden P. O. B. 80 01 34 D-01101 Dresden Germany  
Phone: +49 351 8822 306 Fax: +49 351 8822 337 Email: memory@zmd.de http://www.zmd.de  

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