ZMD31030AAF-R [ZMD]

Automotive Sensor Signal Conditioner with LIN Interface; 汽车传感器信号调理与LIN接口
ZMD31030AAF-R
型号: ZMD31030AAF-R
厂家: Zentrum Mikroelektronik Dresden AG    Zentrum Mikroelektronik Dresden AG
描述:

Automotive Sensor Signal Conditioner with LIN Interface
汽车传感器信号调理与LIN接口

传感器
文件: 总2页 (文件大小:522K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
The Analog Mixed Signal Company  
ZMD31030  
Automotive Sensor Signal  
Conditioner with LIN Interface  
PRELIMINARY  
Brief Description  
ZMD31030 is a CMOS integrated circuit for highly-accurate  
amplification and sensor-specific correction of bridge sensor  
and temperature sensor signals.  
Digital compensation of sensor offset, sensitivity, temperature  
drift and non-linearity is accomplished via a 16-bit RISC micro-  
controller running a correction algorithm with calibration coeffi-  
cients stored in a non-volatile EEPROM.  
The ZMD31030 is adjustable to nearly all piezo-resistive bridge  
sensors. Measured values are provided at the PWM output or at  
the LIN interface.  
The digital LIN bus interface can be used for a simple PC-con-  
trolled calibration procedure, in order to program a set of cali-  
bration coefficients into an on-chip EEPROM. Thus a specific  
sensor and a ZMD31030 are mated digitally: fast, precise and  
without the cost overhead associated with trimming by external  
devices or laser.  
Features  
Digital compensation of sensor offset, sensitivity,  
temperature drift and non-linearity  
Adjustable to nearly all piezo-resistive bridge sensor types  
Digital one-shot calibration: quick and precise  
Selectable temperature compensation reference:  
internal or external diode  
Selectable separate input channel for an external  
temperature sensor  
Output options: PWM (bridge sensor signal)  
or LIN interface (bridge and temp. sensor signal)  
Digital sensor calibration via LIN interface  
Sampling rate typically 125Hz  
High voltage protection  
Reverse polarity and short circuit protection  
Operation temperature -40 to +125°C  
Supply voltage 8 to 18V  
The ZMD31030 is optimized for automotive environments by its  
protection circuitry and excellent electromagnetic compatibility.  
Benefits  
No external trimming components required  
PC-controlled configuration and calibration  
via digital LIN bus interface – simple, low cost  
High accuracy ( 0.1ꢀ ꢁSO ꢂ -25 to 85°Cꢃ  
0.25ꢀ ꢁSO ꢂ -40 to 125°C)  
• Evaluation kit will be available, containing PCBs,  
SSOP20 samples, software, documentation  
• Support for industrial mass calibration available  
• Quick circuit customization possible for large  
production volumes  
Block Schematic and Application Circuit (Example)  
VB  
ANALOG SUPPLY  
DIGITAL SUPPLY  
VDDA  
VDD  
POWER MANAGEMENT  
AND  
PROTECTION CIRCUITS  
CONTROL  
VBAT  
LIN  
www.lin-subbus.de  
VTN  
LIN  
LIN  
LIN  
CONTROLLER TRANSCEIVER  
VDDB  
ANALOG  
SIGNAL  
CONDITIONING  
DIGITAL  
SIGNAL  
POST  
I/O  
IF  
GND  
VBP  
PROCESSING  
DI  
TEST IF  
VBN  
VSSB  
CLK  
ZMD31030  
ANALOG  
GROUND  
DIGITAL  
GROUND  
VSS  
VSSA  
Application Examples  
Detection of low-/overpressure in fuel tanks  
MAP Sensors  
LIN (Local Interconnect Network)  
Low-cost open bus standard for electronic components in cars  
Sub-bus for CAN (Controller Area Network)  
Hydraulic reservoir pressure monitoring  
for ABS and power steering  
Engine management  
Single master/multiple slave concept  
Single-wire data transmission with battery voltage swing  
Comfort functions  
www.lin-subbus.de  
Ordering Information  
Ordering Code  
Description  
Operating  
Temperature Range  
Package  
Type  
Device  
Marking  
Shipping Form**  
waffle tray  
ZMD31030AD ES  
ZMD31030AF ES  
engineering samples  
as dice in waffletray  
die  
engineering samples  
as finished parts  
SSOP20  
ZMD  
sample box or tube  
31030Aꢁ  
YYWW***  
ZMD31030AAB*  
ZMD31030AAC*  
ZMD31030AAD*  
dice on tested  
unsawn wafer  
-40°C to +125°C  
-40°C to +125°C  
-40°C to +125°C  
-40°C to +125°C  
die  
6” wafer  
dice on tested  
sawn wafer  
die  
sawn 6” wafer  
on plastic frame  
dice in waffle tray  
die  
waffle tray  
(100 dice/tray)  
ZMD31030AAF-T* finished parts  
SSOP20  
ZMD  
tube  
in tube  
31030AAꢁ  
YYWW  
(66 parts/tube)  
ZMD31030AAF-R* finished parts  
-40°C to +125°C  
SSOP20  
ZMD  
tape on reel  
in tape on reel  
31030AAꢁ  
YYWW  
(2000 parts/reel)  
ZMD31030KIT  
evaluation kit  
box with PCBs,  
CD-ROM,  
SSOP20 samples  
*
Serial parts – available from serial production start  
** The quantity ordered should be a multiple of the quantity/packing unit as specified  
*** Optional labeled with “ES” in addition  
For further  
information:  
ZMD AG  
ZMD America, Inc.  
ZMD America, Inc.  
15373 Innovation Drive, Suite 115  
San Diego, CA 92128  
USA  
Grenzstrasse 28  
01109 Dresden  
Germany  
201 Old Country Road, Suite 204  
Melville, NY 11747  
USA  
Tel +49.351.8822.366  
ꢁax +49.351.8822.337  
salesꢂzmd.de  
Tel +1.631.549.2666  
ꢁax +1.631.549.2882  
salesꢂzmda.com  
Tel +1.858.674.8070  
ꢁax +1.858.674.8071  
salesꢂzmda.com  
© ZMD AG 2004 · Rev. 0.5 · Preliminary  
www.zmd.biz  
This information applies to a product under development. Its characteristics and specifications are subject to change without notice. ZMD assumes no obligation regarding future manufacture  
unless otherwise agreed to in writing. The information furnished hereby is believed to be true and accurate. However, ZMD shall not be liable to any customer, licencee or any other third  
party for any damages in connection with or arising out of the furnishing, performance or use of this technical data. No obligation or liability to any customer, licencee or any other third party  
shall result from ZMD's rendering of technical or other services.  

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