ATS-53230B-C1-R0
更新时间：2025-05-19 12:54:32
品牌：ATS
描述：High Performance BGA Cooling Solutions with maxiGRIP⢠Attachment
概述
数据手册ATS-53230B-C1-R0 概述
High Performance BGA Cooling Solutions with maxiGRIP⢠Attachment 高性能BGA散热与maxiGRIPâ ?? ¢附件解决方案
ATS-53230B-C1-R0 数据手册
通过下载ATS-53230B-C1-R0数据手册来全面了解它。这个PDF文档包含了所有必要的细节，如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载High Performance BGA Cooling
Solutions with maxiGRIP™ Attachment
ATS PART # ATS-53230B-C1-R0
Features & Benefits
»
hꢁꢂꢃ ꢄꢅꢆꢇꢈꢉ ꢊꢄꢉꢁꢋ, ꢅꢉꢊꢄꢁꢂꢃꢉ ꢌꢁꢍ ꢃꢇꢄꢉ ꢅꢁꢍꢎꢅ ꢉꢃꢄꢉ ꢄꢊꢇ ꢁdꢇꢄꢏ ꢌꢋꢊ ꢈꢋꢀꢆꢄꢈꢉ pcB
ꢇꢍꢐꢁꢊꢋꢍꢀꢇꢍꢉꢅ
»
ꢀꢄxꢁgrip™ ꢄꢉꢉꢄꢈꢃꢀꢇꢍꢉ ꢄꢆꢆꢏꢁꢇꢅ ꢅꢉꢇꢄdy, ꢇꢐꢇꢍ ꢆꢊꢇꢅꢅꢑꢊꢇ ꢉꢋ ꢉꢃꢇ
ꢈꢋꢀꢆꢋꢍꢇꢍꢉ ꢄꢍd dꢋꢇꢅ ꢍꢋꢉ ꢊꢇqꢑꢁꢊꢇ ꢃꢋꢏꢇꢅ ꢁꢍ ꢉꢃꢇ pcB
»
»
Dꢇꢅꢁꢂꢍꢇd ꢅꢆꢇꢈꢁꢌꢁꢈꢄꢏꢏy ꢌꢋꢊ Bgaꢅ ꢄꢍd ꢋꢉꢃꢇꢊ ꢅꢑꢊꢌꢄꢈꢇ ꢀꢋꢑꢍꢉ ꢆꢄꢈꢎꢄꢂꢇꢅ
mꢇꢇꢉꢅ tꢇꢏꢈꢋꢊdꢁꢄ gr-63-cꢋꢊꢇ oꢌꢌꢁꢈꢇ vꢁbꢊꢄꢉꢁꢋꢍ, etsi 300 019
tꢊꢄꢍꢅꢆꢋꢊꢉꢄꢉꢁꢋꢍ vꢁbꢊꢄꢉꢁꢋꢍ, ꢄꢍd mil-stD-810 sꢃꢋꢈꢎ ꢉꢇꢅꢉꢁꢍꢂ ꢄꢍd
uꢍꢆꢄꢈꢎꢄꢂꢇd Dꢊꢋꢆ tꢇꢅꢉꢁꢍꢂ ꢅꢉꢄꢍdꢄꢊdꢅ
»
»
cꢋꢀꢇꢅ ꢆꢊꢇꢄꢅꢅꢇꢀbꢏꢇd ꢒꢁꢉꢃ ꢃꢁꢂꢃ ꢆꢇꢊꢌꢋꢊꢀꢄꢍꢈꢇ, ꢆꢃꢄꢅꢇ ꢈꢃꢄꢍꢂꢇ, ꢉꢃꢇꢊꢀꢄꢏ
ꢁꢍꢉꢇꢊꢌꢄꢈꢇ ꢀꢄꢉꢇꢊꢁꢄꢏ
“kꢇꢇꢆ-oꢑꢉ” rꢇqꢑꢁꢊꢇꢀꢇꢍꢉꢅ: aꢍ “uꢍ-pꢋꢆꢑꢏꢄꢉꢇd” bꢋꢄꢊdꢇꢊ ꢓꢋꢍꢇ ꢋꢌ 5
ꢀꢀ ꢄꢊꢋꢑꢍd ꢉꢃꢇ ꢈꢋꢀꢆꢋꢍꢇꢍꢉ ꢁꢅ ꢍꢇꢈꢇꢅꢅꢄꢊy ꢉꢋ ꢌꢄꢈꢁꢏꢁꢉꢄꢉꢇ ꢉꢃꢇ iꢍꢅꢉꢄꢏꢏꢄꢉꢁꢋꢍ/
rꢇꢀꢋꢐꢄꢏ ꢋꢌ ꢉꢃꢇ ꢀꢄxꢁgrip™. pꢏꢇꢄꢅꢇ ꢊꢇꢌꢇꢊ ꢉꢋ ꢉꢃꢇ ꢀꢄxꢁgrip™ kꢇꢇꢆ-
oꢑꢉ gꢑꢁdꢇꢏꢁꢍꢇꢅ ꢄꢍd ꢀꢄxꢁgrip™ iꢍꢅꢉꢄꢏꢏꢄꢉꢁꢋꢍ/rꢇꢀꢋꢐꢄꢏ iꢍꢅꢉꢊꢑꢈꢉꢁꢋꢍꢅ ꢌꢋꢊ
ꢌꢑꢊꢉꢃꢇꢊ dꢇꢉꢄꢁꢏꢅ
ꢁhermal Performance
*Image above is for illustration purposes only.
AIR VELOCITy
THERMAL RESISTANCE
ft/min
200
m/s
1.0
1.5
2.0
2.5
3.0
3.5
4.0
°c/w (unDucteD flow)
°c/w (DucteD flow)
7.6
16.8
12.4
10.5
9.3
300
400
500
600
8.5
700
7.8
800
7.3
Product Details
INTERFACE MATERIAL
chomerics t766
DIMENSION A
23 ꢀꢀ
DIMENSION B
DIMENSION C
DIMENSION D
FINISH
23 ꢀꢀ
7.5 ꢀꢀ
23 ꢀꢀ
Blue anoDizeD
Nꢀꢁꢂꢃ:
1)
2)
3)
Dimensions are measureD in millimeters
Dimensions a & B refer to component size
Dimension c = the height of the heat sink shown aBove anD Does not
incluDe the height of the attachment methoD
ats reserves the right to upDate or change it proDucts without
notice
4)
5)
contact ats to learn aBout custom options availaBle
For more information, to find a distributor or to place an order, visit www.qats.com or
call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).
REV1_0908
ATS-53230B-C1-R0 相关器件
| 型号 | 制造商 | 描述 | 价格 | 文档 |
| ATS-53230D-C1-R0 | ATS | BGA Heat Sink - High Performance | 获取价格 |
|
| ATS-53230D-C2-R0 | ATS | High Performance BGA Cooling | 获取价格 |
|
| ATS-53230G-C1-R0 | ATS | High Performance BGA Cooling Solutions with maxiGRIP⢠Attachment | 获取价格 |
|
| ATS-53230K-C1-R0 | ATS | BGA Heat Sink - High Performance | 获取价格 |
|
| ATS-53230K-C2-R0 | ATS | High Performance BGA Cooling | 获取价格 |
|
| ATS-53230P-C1-R0 | ATS | High Performance BGA Cooling Solutions with maxiGRIP⢠Attachment | 获取价格 |
|
| ATS-53230R-C1-R0 | ATS | BGA Heat Sink - High Performance | 获取价格 |
|
| ATS-53230R-C2-R0 | ATS | High Performance BGA Cooling | 获取价格 |
|
| ATS-53250B-C1-R0 | ATS | High Performance BGA Cooling Solutions with maxiGRIP⢠Attachment | 获取价格 |
|
| ATS-53250D-C1-R0 | ATS | BGA Heat Sink - High Performance | 获取价格 |
|
ATS-53230B-C1-R0 相关文章
电路设计中瞬态过压保护：三大疑问全解读
- 2025-05-22
- 6
小米豪掷造芯，YU7 能否重现华为汽车的辉煌时刻？
- 2025-05-22
- 5
千兆级集成电路封装：重塑全球半导体供应链格局
- 2025-05-21
- 17
电容器的原理阐释与重要作用剖析
- 2025-05-21
- 14
