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QD

更新时间：2025-06-11 11:17:35
品牌：CYSTEKEC
描述：Part Number : QD; Package : SOD-123; Electrical Characteristics : 90; Note : 63;

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QD 概述

Part Number : QD; Package : SOD-123; Electrical Characteristics : 90; Note : 63;

QD 数据手册

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Spec. No. : C203SH  
Issued Date : 2013.05.30  
Revised Date : 2024.08.19  
Page No. : 1/7  
CYStech Electronics Corp.  
1A / 90V Snubber Damping Rectifier  
QD  
Features  
• High current capability  
• Smoothly soft reverse recovery time (trr)  
• Low profile surface mounted package in order to minimize board space  
• Pb-free lead plating and halogen-free package  
Mechanical data  
• Case : Molded plastic, JEDEC SOD-123.  
• Epoxy : UL94-V0 rated flame retardant  
• Terminals : Plated terminals, solderable per MIL-STD-202 method 208  
• Polarity : Indicated by cathode band  
• Mounting position : Any  
• Weight : approx. 0.009 gram  
Symbol  
Outline  
QD  
2 (Anode)  
SOD-123  
Ordering Information  
Device  
Package  
Shipping  
SOD-123  
QD-0-T1-G  
3000 pcs / tape & reel  
(Pb-free lead plating and halogen-free package)  
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and  
green compound products  
Packing spec, T1 : 3000 pcs / tape & reel, 7” reel  
Product rank, zero for no rank products  
Product name  
QD  
CYStek Product Specification  
Spec. No. : C203SH  
Issued Date : 2013.05.30  
Revised Date : 2024.08.19  
Page No. : 2/7  
CYStech Electronics Corp.  
Absolute Maximum Ratings (TA=25℃, unless otherwise noted)  
Symbol  
VRRM  
VRMS  
VR  
Value  
90  
Units  
Parameters  
Conditions  
V
V
V
Repetitive peak reverse voltage  
RMS voltage  
63  
90  
Continuous reverse voltage  
Single phase half wave,  
1
A
A
Forward rectified current  
IF(AV)  
IFRM  
°
60Hz @TJ=25 C  
Single phase half wave,  
1.57  
Repetitive Peak Forward Current  
°
60Hz @TJ=25 C  
8.3ms single half sine-wave  
superimposed on rated load  
(JEDEC method)  
6
A
Forward surge current  
IFSM  
30  
tp≤ 1μs  
IF=1A, dIF/dt=100A/μ  
500  
ns  
Maximum reverse recovery time  
Storage temperature range  
s
trr  
Tstg  
Tj  
-55~+150  
-55~+150  
°C  
°C  
Operating junction temperature range  
Thermal Data  
Parameter  
Symbol  
Rth,j-c  
Rth,j-a  
Value  
60  
250  
Unit  
°C/W  
Thermal Resistance, Junction-to-case, max  
Thermal Resistance, Junction-to-ambient, max (Note )  
Note: When mounted on FR-4 PCB with area measuring 10×10 mm  
Characteristics (TA=25°C, unless otherwise noted)  
Characteristic  
Reverse Voltage  
Symbol  
Condition  
Min.  
90  
Typ  
Max. Unit  
-
-
-
V
VR  
IR=100μA  
VF 1  
VF 2  
IR  
IF=100mA  
IF=500mA  
VR=90V  
-
-
-
-
0.95  
1.2  
100  
-
Forward Voltage  
V
-
-
Reverse Leakage Current  
Junction Capacitance  
nA  
pF  
7
CJ  
VR=1V, f=1MHz  
QD  
CYStek Product Specification  
Spec. No. : C203SH  
Issued Date : 2013.05.30  
Revised Date : 2024.08.19  
Page No. : 3/7  
CYStech Electronics Corp.  
Typical Characteristics  
Power Derating Curve  
Forward Current vs Forward Voltage  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
10000  
1000  
100  
10  
125℃  
25°C  
0℃  
75°C  
-40°C  
Pulse width=300μs,  
1% Duty cycle  
1
0
25  
50  
75 100 125 150 175 200  
0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7  
Forward Voltage---V (V)  
3
Ambient Temperature---T  
A(℃)  
F
Reverse Leakage Current vs Reverse Voltage  
Junction Capacitance vs Reverse Voltage  
100  
100  
10  
1
Tj=125℃  
Tj=75℃  
10  
Tj=25℃  
Tj=25℃, f=1.0MHz  
1
0
10 20 30 40 50 60 70 80 90 100  
0.1  
1
10  
100  
Reverse Voltage---V  
R
(V)  
Reverse Voltage---VR(V)  
Maximum Safe Operating Area  
100  
10  
1
1μs  
1ms  
0.1  
10ms  
T
A
=25°C, Tj=150°C  
100ms  
DC  
0.01  
0.001  
RθJA=250°C/W  
Single Pulse  
0.1  
1
V
10  
D, Forward Voltage(V)  
100  
1000  
QD  
CYStek Product Specification  
Spec. No. : C203SH  
Issued Date : 2013.05.30  
Revised Date : 2024.08.19  
Page No. : 4/7  
CYStech Electronics Corp.  
Recommended Soldering Footprint  
QD  
CYStek Product Specification  
Spec. No. : C203SH  
Issued Date : 2013.05.30  
Revised Date : 2024.08.19  
Page No. : 5/7  
CYStech Electronics Corp.  
Reel Dimension  
Carrier Tape Dimension  
QD  
CYStek Product Specification  
Spec. No. : C203SH  
Issued Date : 2013.05.30  
Revised Date : 2024.08.19  
Page No. : 6/7  
CYStech Electronics Corp.  
Recommended wave soldering condition  
Product  
Peak Temperature  
Soldering Time  
5 +1/-1 seconds  
Pb-free devices  
260 +0/-5 °C  
Recommended temperature profile for IR reflow  
Profile feature  
Average ramp-up rate  
(Tsmax to Tp)  
Sn-Pb eutectic Assembly  
Pb-free Assembly  
3°C/second max.  
3°C/second max.  
Preheat  
100°C  
150°C  
60-120 seconds  
150°C  
200°C  
60-180 seconds  
−Temperature Min(TS min)  
−Temperature Max(TS max)  
−Time(ts min to ts max)  
Time maintained above:  
−Temperature (TL)  
− Time (tL)  
183°C  
60-150 seconds  
217°C  
60-150 seconds  
Peak Temperature(TP)  
Time within 5°C of actual peak  
temperature(tp)  
240 +0/-5 °C  
260 +0/-5 °C  
10-30 seconds  
20-40 seconds  
Ramp down rate  
6°C/second max.  
6°C/second max.  
6 minutes max.  
8 minutes max.  
Time 25 °C to peak temperature  
Note :1. All temperatures refer to topside of the package, measured on the package body surface.  
2. For devices mounted on FR-4 PCB of 1.6mm or equivalent grade PCB. If other grade PCB is used, care  
should be taken to match the coefficients of thermal expansion between components and PCB. If they are  
not matched well, the solder joints may crack or the bodies of the parts may crack or shatter as the assembly  
cools.  
QD  
CYStek Product Specification  
Spec. No. : C203SH  
Issued Date : 2013.05.30  
Revised Date : 2024.08.19  
Page No. : 7/7  
CYStech Electronics Corp.  
SOD-123 Dimension  
Marking:  
QD  
2-Lead SOD-123 Plastic  
Surface Mounted Package  
CYS Package Code: SH  
Style: Pin 1.Cathode 2.Anode  
Inches  
Millimeters  
Inches  
Millimeters  
DIM  
DIM  
Min.  
Max.  
0.110  
0.067  
0.049  
Min.  
Max.  
2.800  
1.700  
1.250  
Min.  
Max.  
0.026  
0.152  
Min.  
Max.  
0.650  
3.850  
A
B
C
0.102  
0.059  
0.041  
2.600  
1.500  
1.050  
D
E
0.018  
0.140  
0.450  
3.550  
Notes: 1.Controlling dimension : millimeters.  
2.Lead thickness specified per L/F drawing with solder plating.  
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.  
Material:  
• Lead: Pure tin plated.  
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.  
Important Notice:  
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.  
• CYStek reserves the right to make changes to its products without notice.  
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.  
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.  
QD  
CYStek Product Specification  

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