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EPSA23BBHB-13.3632M

更新时间：2025-06-30 04:30:38

品牌：ECLIPTEK

描述：CMOS, Spread Spectrum Quartz Crystal Clock Oscillators LVCMOS (CMOS) 3.3Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD) Spread Spectrum Quartz Crystal Clock Oscillators LVCMOS (CMOS) 3.3Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD)

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EPSA23BBHB-13.3632M 概述

CMOS, Spread Spectrum Quartz Crystal Clock Oscillators LVCMOS (CMOS) 3.3Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD) Spread Spectrum Quartz Crystal Clock Oscillators LVCMOS (CMOS) 3.3Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD)

EPSA23BBHB-13.3632M 数据手册

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Ecliptek | EPSA23 Series Oscillator

http://www.ecliptek.com/oscillators/EPSA23/

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EPSA23 Series Oscillator

Spread Spectrum Quartz Crystal Clock Oscillators LVCMOS (CMOS) 3.3Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount

(SMD)

2011/65 +

168 SVHC

2015/863

Revision D 02/27/2015

Electrical Specifications

Nominal Frequency

2.000MHz to 200.000MHz

Some frequencies within this range may not be available.

Frequency Tolerance/Stability

(Inclusive of all conditions: Frequency Stability over the Operating

Temperature Range, Supply Voltage Change, Output Load Change,

First Year Aging at 25°C, Shock, and Vibration)

±50ppm Maximum

Operating Temperature Range

-40°C to +85°C

Supply Voltage (V

)

3.3V

±10%

Maximum Supply Voltage

Input Current

-0.5V

to +4.2V

15mA Maximum over Nominal Frequency of 2MHz to 25MHz

23mA Maximum over Nominal Frequency of 25.000001MHz to 50MHz

27mA Maximum over Nominal Frequency of 50.000001MHz to 100MHz

30mA Maximum over Nominal Frequency of 100.000001MHz to

166MHz

40mA Maximum over Nominal Frequency of 166.000001MHz to

200MHz

Output Voltage Logic High (V

)

IOH=-8mA

90% of V

Minimum

Maximum

Output Voltage Logic Low (V

)

IOL=+8mA

10% of V

Duty Cycle

Measured at 50% of waveform

50 ±5(%)

Rise Time/Fall Time

Measured at 10% to 90% of Waveform

3nSec Maximum

Load Drive Capability

Output Logic Type

15pF Maximum

CMOS

Output Control Function

Tri-State (Disabled Output: High Impedance)

Power Down (Disabled Output: High Impedance)

Power Down Input Voltage (Vih and Vil)

Tri-State Input Voltage (Vih and Vil)

70% of V

Minimum or No Connection to Enable Output, 30% of V

Maximum to Disable Output

70% of V

Minimum or No Connection to Enable Output, 30% of V

Maximum to Disable Output

Power Down Output Disable Time

Power Down Output Enable Time

Standby Current

100nSec Maximum

3mSec Maximum

Unloaded; Pad 1 = Ground

10µA Maximum (Power Down)

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Tri-State Output Disable Time

Tri-State Output Enable Time

Disable Current

100nSec Maximum

Unloaded; Pad 1 = Ground

20mA Maximum (Tri-State)

Spread Spectrum

±0.25% Center Spread

±0.50% Center Spread

±0.75% Center Spread

±1.00% Center Spread

±1.50% Center Spread

±2.00% Center Spread

-0.50% Down Spread

-1.00% Down Spread

-1.50% Down Spread

-2.00% Down Spread

-3.00% Down Spread

-4.00% Down Spread

Modulation Frequency

Period Jitter

30kHz Minimum, 32kHz Typical, 45kHz Maximum

Cycle to Cycle; Spread Spectrum-On

100pSec Maximum

Storage Temperature Range

Start Up Time

-55°C to +125°C

10mSec Maximum

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Mechanical Dimensions

All Dimensions in Millimeters

Pin 1: Power Down Or Tri-State

Pin 2: Case Ground

Pin 3: Output

Pin 4: Supply Voltage

Marking Specifications

Line 1:

E XXXXXX

E = Ecliptek Designator

XXXXXX = Nominal Frequency in MHz (5 Digits + Decimal)

Line 2:

XXXXX

XXXXX = Ecliptek Manufacturing Identifier

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Environmental and Mechanical Specifications

ESD Susceptibility

Fine Leak Test

MIL-STD-883, Method 3015, Class 1, HBM:1500V

MIL-STD-883, Method 1014, Condition A

UL94-V0

Flammability

Gross Leak Test

MIL-STD-883, Method 1014, Condition C

MIL-STD-883, Method 2002, Condition B

MIL-STD-883, Method 1004

Mechanical Shock

Moisture Resistance

Moisture Sensitivity

Resistance to Soldering Heat

Resistance to Solvents

Solderability

J-STD-020, MSL 1

MIL-STD-202, Method 210, Condition K

MIL-STD-202, Method 215

MIL-STD-883, Method 2003

Temperature Cycling

Vibration

MIL-STD-883, Method 1010, Condition B

MIL-STD-883, Method 2007, Condition A

40°C/W (degrees Celsius per Watt)

Thermal Resistance (θ

)

14°C/W (degrees Celsius per Watt)

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Tape & Reel Dimensions

1000 pieces per reel

Compliant to EIA-481

All Dimensions in Millimeters

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CMOS Test Circuit

Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass capacitor close

(less than 2mm) to the package ground and supply voltage pin is required.

Note 2: A low capacitance (<12pF), 10X Attentuation Factor, High Impedance (>10Mohms), and High bandwidth

(>300MHz) passive probe is recommended.

Note 3: Capacitance value (C ) includes sum of all probe and fixture capacitance.

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Recommended Solder Pad Dimensions

Tolerances = ±0.1

All Dimensions in Millimeters

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Solder Reflow Profile

High Temperature Infrared/Convection

Note: Temperatures shown are applied to body of

device.

MAX to T (Ramp-up Rate)

3°C/second Maximum

Preheat

- Temperature Minimum (T MIN)

150°C

- Temperature Typical (T TYP)

175°C

- Temperature Maximum (T MAX)

200°C

- Time (t )

60 - 180 Seconds

3°C/second Maximum

Ramp-up Rate (T to T )

Time Maintained Above:

- Temperature (T )

217°C

- Time (t )

60 - 150 Seconds

260°C Maximum for 10 Seconds Maximum

250°C +0/-5°C

Peak Temperature (T )

Target Peak Temperature (T Target)

Time within 5°C of actual peak (t )

20 - 40 seconds

Ramp-down Rate

6°C/second Maximum

8 minutes Maximum

Level 1

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

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Low Temperature Infrared/Convection

Note: Temperatures shown are applied to body of

device.

MAX to T (Ramp-up Rate)

5°C/second Maximum

Preheat

- Temperature Minimum (T MIN)

N/A

- Temperature Typical (T TYP)

150°C

- Temperature Maximum (T MAX)

N/A

- Time (t )

60 - 120 Seconds

5°C/second Maximum

Ramp-up Rate (T to T )

Time Maintained Above:

- Temperature (T )

150°C

- Time (t )

200 Seconds Maximum

Peak Temperature (T )

240°C Maximum

Target Peak Temperature (T Target)

240°C Maximum 2 Times / 230°C Maximum 1 Time

10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time

Time within 5°C of actual peak (t )

Ramp-down Rate

5°C/second Maximum

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

N/A

Level 1

High Temperature Manual Soldering

Note: Temperatures listed are applied to body of device.

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

Low Temperature Manual Soldering

Note: Temperatures listed are applied to body of device.

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

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1 - Build A Part Number

2 - Next Page

Select the parameters that meet your requirements and then click

Access these Part Number specific

resources and tools

Frequency in Megahertz (2 to 200):

Some frequencies within this range may not be

available

Output Control Function:

Spread Spectrum Percentage:

Packaging Options:

Part Numbering Guide

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