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ST1210XR101J251

更新时间：2025-06-10 12:14:56

品牌：MERITEK

描述：Soft Termination Multilayer Ceramic Chip Capacitors

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ST1210XR101J251 概述

Soft Termination Multilayer Ceramic Chip Capacitors 软终端多层陶瓷芯片电容器

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Soft Termination Multilayer

Ceramic Chip Capacitors

STSeries

MERITEK

RoHS

EATURES

•

Wide capacitance range in a given size

High performance to withstanding 5mm of substrate bending

test guarantee

•

Reduction in PCB bend failure

Lead free terminations

High reliability and stability

RoHS compliant

HALOGEN compliant

PPLICATIONS

MERITEK Multilayer Ceramic Chip Capacitors supplied in

bulk or tape & reel package are ideally suitable for thick-film

hybrid circuits and automatic surface mounting on any

printed circuit boards, All of MERITEK's MLCC products meet

RoHS directive.

ST series use a special material between nickel-barrier

and ceramic body. It provides excellent performance to

against bending stress occurred during process and

provide more security for PCB process.

•

High flexure stress circuit board

DC to DC converter

High voltage coupling/DC blocking

Back-lighting inverters

Snubbers in high frequency power convertors

The nickel-barrier terminations are consisted of a nickel

barrier layer over the silver metallization and then finished by

electroplated solder layer to ensure the terminations have

good solderability. The nickel barrier layer in terminations

prevents the dissolution of termination when extended

immersion in molten solder at elevated solder temperature.

PART NUMBER SYSTEM

DIMENSION

ST 0805 XR 104 K 101

Meritek Series

Size

0603 0805 1206 1210 1812 1825 2220 2225

Dielectric

Code

X7R

COG(NPO)

Capacitance

Code

8R2

8.2

101

223

22000

104

100000

100

0.1

Size Inch (mm) L(mm)

W(mm)

0.8±0.15

1.25±0.2

1.6±0.2

2.5±0.4

3.2±0.3

6.3±0.4

5.0±0.4

6.3±0.4

Tmax(mm) M_Bmin (mm)

0603(1608)

0805(2012)

1206(3216)

1210(3225)

1812(4532)

1825(4563)

2220(5750)

2225(5763)

1.6±0.2

2.1±0.2

3.3±0.3

3.3±0.4

4.5±0.4

4.6±0.3

5.7±0.4

0.95

1.45

1.80

2.90

2.80

0.20

0.30

0.26

0.30

0.022

0.1

Tolerance

Code

Tolerance

±0.1pF

±1%

Code

Tolerance

Code

Tolerance

±0.5pF

±5%

±0.25pF

±2%

±10%

±20%

Rated Voltage – 2 significant digits + number of zeros.

Code

101

201

251

501

631

100Vdc

200Vdc

250Vdc

500Vdc

630Vdc

Rev.7

GENERAL ELECTRICAL DATA

Item

Dielectric

Characteristic

NPO

1206

X7R

Size

0603,0805,1206,1210,1808,1812,1825,2

220,2225

Capacitance range*

1.5pF to 220pF

100pF to 4.7uF

Capacitance tolerance

C: ±0.25pF @cap≤5pF

J: ±5%,K: ±10%,M: ±20%

D: ±0.5pF @5pF≤cap≤10pF

J: ±5%, K: ±10% @cap≥10pF

Rated voltage (WVDC)

100V, 200V, 250V, 500V, 630V

Tan δ*

Q < 400+20C @cap<30pF

Q ≤ 2.5%

Q ≥ 1000 @cap≥30pF

Insulation resistance at Ur**

≥10GΩ or RxC ≥100Ω-F whichever is

smaller @Ur=100~630V

≥10GΩ or RxC ≥500Ω-F whichever is

smaller

≥10GΩ @Ur=1000~3000V

Operating temperature

Capacitance characteristic

Termination

-55 to +125°C

±30ppm

±15%

Cu(or Ag)/Ni/Sn (lead-free termination)

*Measured at the condition of 30%~70% related humidity.

NPO: Apply 1.0±0.2Vrms, 1.0MHz±10% for cap ≤ 1000pF and 1.0±0.2Vrms, 1.0kHz±10% for cap>1000pF, 25°C at ambient temperature

X7R: Apply 1.0±0.2Vrms, 1.0kHz±10%, at 25°C ambient temperature

**Measured at 500VDC for 60sec, for Ur > 500VDC

TRUCTURE

Meritek ST series is added a special termination material

( Ultra-Buffer or Anti-Bend) between ceramic body and Ni-barrier

that can absorb mechanical stress to prevent bending crack

occured.

100% Sn External Termination

Ni-Barrier

Ultra-Buffer

Cu or Ag Termination

Inner Electrode

Rev.7

Soft Termination Multilayer

Ceramic Chip Capacitors

STSeries

MERITEK

RoHS

CAPACITANCE RANGE

DIELECTRIC

SIZE

NP0

1206

250

RATED VOLTAGE (VDC)

0.5pF (0R5)

1.0pF (1R0)

1.2pF (1R2)

1.5pF (1R5)

1.8pF (1R8)

2.2pF (2R2)

2.7pF (2R7)

3.3pF (3R3)

3.9pF (3R9)

4.7pF (4R7)

5.6pF (5R6)

6.8pF (6R8)

8.2pF (8R2)

10pF (100)

100

200

500

630

12pF (120)

15pF (150)

18pF (180)

22pF (220)

27pF (270)

33pF (330)

39pF (390)

47pF (470)

56pF (560)

68pF (680)

82pF (820)

100pF (101)

120pF (121)

150pF (151)

180pF (181)

220pF (221)

270pF (271)

330pF (331)

390pF (391)

470pF (471)

560pF (561)

680pF (681)

820pF (821)

1,000pF (102)

1,200pF (122)

1,500pF (152)

1,800pF (182)

2,200pF (222)

2,700pF (272)

3,300pF (332)

3,900pF (392)

4,700pF (472)

5,600pF (562)

6,800pF (682)

8,200pF (822)

Rev.7

Soft Termination Multilayer

Ceramic Chip Capacitors

STSeries

MERITEK

RoHS

DIELECTRIC

X7R

SIZE

0603

0805

1206

1210

RATED VOLTAGE (VDC) 100 200 250 100 200 250 500 100 200 250 500 630 100 200 250 500 630

100pF (101)

120pF (121)

150pF (151)

180pF (181)

220pF (221)

270pF (271)

330pF (331)

390pF (391)

470pF (471)

560pF (561)

680pF (681)

820pF (821)

1,000pF (102)

1,200pF (122)

1,500pF (152)

1,800pF (182)

2,200pF (222)

2,700pF (272)

3,300pF (332)

3,900pF (392)

4,700pF (472)

5,600pF (562)

6,800pF (682)

8,200pF (822)

0.010ꢀF (103)

0.012ꢀF (123)

0.015ꢀF (153)

0.018ꢀF (183)

0.022ꢀF (223)

0.027ꢀF (273)

0.033ꢀF (333)

0.039ꢀF (393)

0.047ꢀF (473)

0.056ꢀF (563)

0.068ꢀF (683)

0.082ꢀF (823)

0.10ꢀF (104)

0.12ꢀF (124)

0.15ꢀF (154)

0.18ꢀF (184)

0.22ꢀF (224)

0.27ꢀF (274)

0.33ꢀF (334)

0.39ꢀF (394)

0.47ꢀF (474)

0.56ꢀF (564)

0.68ꢀF (684)

0.82ꢀF (824)

1.00ꢀF (105)

1.20ꢀF (125)

1.50ꢀF (155)

1.80ꢀF (185)

2.20ꢀF (225)

Rev.7

Soft Termination Multilayer

Ceramic Chip Capacitors

STSeries

MERITEK

RoHS

DIELECTRIC

X7R

1825

2220

2225

SIZE

1812

RATED VOLTAGE

100 200 250 500 630 100 200 250 500 630 100 200 250 500 630

100 200 250 500 630

100pF (101)

120pF (121)

150pF (151)

180pF (181)

220pF (221)

270pF (271)

330pF (331)

390pF (391)

470pF (471)

560pF (561)

680pF (681)

820pF (821)

1,000pF (102)

1,200pF (122)

1,500pF (152)

1,800pF (182)

2,200pF (222)

2,700pF (272)

3,300pF (332)

3,900pF (392)

4,700pF (472)

5,600pF (562)

6,800pF (682)

8,200pF (822)

0.010ꢀF (103)

0.012ꢀF (123)

0.015ꢀF (153)

0.018ꢀF (183)

0.022ꢀF (223)

0.027ꢀF (273)

0.033ꢀF (333)

0.039ꢀF (393)

0.047ꢀF (473)

0.056ꢀF (563)

0.068ꢀF (683)

0.082ꢀF (823)

0.10ꢀF (104)

0.12ꢀF (124)

0.15ꢀF (154)

0.18ꢀF (184)

0.22ꢀF (224)

0.27ꢀF (274)

0.33ꢀF (334)

0.39ꢀF (394)

0.47ꢀF (474)

0.56ꢀF (564)

0.68ꢀF (684)

0.82ꢀF (824)

1.0ꢀF (105)

1.2ꢀF (125)

1.5ꢀF (155)

1.8ꢀF (185)

2.2ꢀF (225)

2.7ꢀF (275)

3.3ꢀF (335)

3.9ꢀF (395)

4.7ꢀF (475)

Rev.7

Soft Termination Multilayer

Ceramic Chip Capacitors

STSeries

MERITEK

RoHS

ACKAGE

IMENSION AND QUANTITY

Thickness

Paper tape

Plastic tape

Size

(mm)

7” reel

13” reel

7” reel

13” reel

0.80+0.15/-0.10

1.25±0.10

1.25±0.20

0.80±0.10

0.95±0.10

1.25±0.10

1.60±0.20

0.95±0.10

1.25±0.10

1.60±0.20

2.00±0.20

2.50±0.40

1.25±0.10

1.60±0.20

2.00±0.20

2.50±0.30

1.60±0.20

2.00±0.20

2.50±0.30

1.60±0.20

2.00±0.20

2.50±0.30

2.00±0.20

2.50±0.30

0603 (1608)

0805 (2012)

15k

10k

15k

10k

1206 (3216)

1210 (3225)

10k

1812 (4532)

1825 (4563)

0.5k

2220 (5750)

2225 (5763)

0.5k

Unit: pieces

Size

Reel size

0603, 0805, 1206, 1210

1812,1825 ,2220 ,2225

7”

10”

13”

W₁

13.0+0.5/-0.2

8.4+1.5/-0

178.0±0.10

60.0±1.0/-0

13.0+0.5/-0.2

8.4+1.5/-0

250.0±1.0

13.0+0.5/-0.2

8.4+1.5/-0

330.0±1.0

100±1.0

13.0+0.5/-0.2

12.4+2.0/-0

178.0±0.10

80.0±1.0

100.0±1.0

Fig. 4 The dimension of reel

Rev.7

Soft Termination Multilayer

Ceramic Chip Capacitors

STSeries

MERITEK

RoHS

CARDBOARD TAPE DIMESIONS

EMBOSSED TAPE DIMENSIONS

Fig. 2 The dimension of paper tape

Fig. 3 The dimension of plastic tape

Size

0603

0805

1206

1210

0.95±0.10

1.25±0.10

1.60±0.20

2.00±0.20

<3.05

Chip

1.25±0.10

1.25±0.20

0.95±0.10

1.25±0.10

0.80+0.15/-0.10 0.80+0.15/-0.10

0.80±0.10

1.60±0.20

2.50±0.40

Thickness

A₀

B₀

1.02+0.05/-0.10

1.80±0.10

0.97±0.05

1.50±0.10

2.30±0.10

0.95±0.05

<1.65

<2.40

2.00±0.10

3.50±0.10

0.95±0.05

<2.00

<3.60

<2.00

<3.70

<3.10

<4.00

<3.80

0.23±0.05

<2.50

0.23±0.05

<2.50

0.23±0.05

<2.50

0.23±0.05

<2.50

0.23±0.05

<3.50

K₀

8.00±0.10

4.00±0.10

40.00±0.20

4.00±0.10

2.00±0.05

1.55±0.05

8.00±0.10

4.00±0.10

40.00±0.20

4.00±0.10

2.00±0.05

1.55±0.05

8.00±0.10

4.00±0.10

40.00±0.20

4.00±0.10

2.00±0.05

1.50±0.10/-0

1.00±0.10

1.75±0.10

3.50±0.05

8.00±0.10

4.00±0.10

40.00±0.20

4.00±0.10

2.00±0.05

1.55±0.05

8.00±0.10

4.00±0.10

40.00±0.20

4.00±0.10

2.00±0.05

1.50±0.10/-0

1.00±0.10

1.75±0.10

3.50±0.05

8.00±0.10

4.00±0.10

40.00±0.20

4.00±0.10

2.00±0.05

1.50±0.10/-0

1.00±0.10

1.75±0.10

3.50±0.05

8.00±0.10

4.00±0.100

40.00±0.20

4.00±0.10

2.00±0.05

1.50±0.10/-0

1.00±0.10

1.75±0.10

3.50±0.05

8.00±0.10

4.00±0.10

40.00±0.20

4.00±0.10

2.00±0.05

1.50±0.10/-0

1.00±0.10

1.75±0.10

3.50±0.05

P₀

10xP₀

P₁

P₂

D₀

D₁

1.75±0.05

3.50±0.05

1.75±0.05

3.50±0.05

1.75±0.10

3.50±0.05

Size

1812

1825

2220

2225

1.25±0.10

1.60±0.20

2.00±0.20

<3.90

Chip

1.60±0.20

2.00±0.20

1.60±0.20

2.00±0.20

2.50±0.30

2.00±0.20

2.50±0.30

Thickness

A₀

B₀

<3.90

<5.30

<6.80

<5.30

<6.80

<5.30

<5.80

<6.50

<5.80

<6.50

<6.80

<6.50

<6.80

<6.50

<5.30

0.25±0.05

<2.50

0.25±0.05

<3.00

0.30±0.10

<2.50

0.30±0.10

<3.10

0.30±0.10

<2.50

0.30±0.10

<3.10

0.30±0.10

<2.50

0.30±0.10

<3.10

K₀

12.0±0.20

4.00±0.10

40.00±0.20

8.00±0.10

2.00±0.05

1.50+0.10/-0

1.50±0.10

1.75±0.10

5.50±0.05

12.0±0.20

4.00±0.10

40.00±0.20

8.00±0.10

2.00±0.05

1.50+0.10/-0

1.50+/-0.10

1.75+/-0.1

5.50+/-0.05

12.0±0.20

4.00±0.10

40.00±0.20

8.00±0.10

2.00±0.05

1.50+0.10/-0

1.50±0.10

1.75±0.1

5.50±0.05

12.0±0.20

4.00±0.10

40.00±0.20

8.00±0.10

2.00±0.05

1.50+0.10/-0

1.50±0.10

1.75±0.10

5.50±0.05

12.0±0.20

4.00±0.10

40.00±0.20

8.00±0.10

2.00±0.05

1.50+0.10/-0

1.50±0.10

1.75±0.1

5.50±0.05

12.0±0.20

4.00±0.10

40.00±0.20

8.00±0.10

2.00±0.05

1.50+0.10/-0

1.50±0.10

1.75±0.10

5.50±0.05

12.0±0.20

4.00±0.10

40.00±0.20

8.00±0.10

2.00±0.05

12.0±0.20

4.00±0.10

40.00±0.20

8.00±0.10

2.00±0.05

P₀

10xP₀

P₁

P₂

D₀

D₁

1.50+0.10/-0

1.50±0.10

1.75±0.10

5.50±0.05

1.50+0.10/-0

1.50±0.10

1.75±0.10

5.50±0.05

Rev.7

Soft Termination Multilayer

Ceramic Chip Capacitors

STSeries

MERITEK

RoHS

APPLICATION NOTES

STORAGE

To prevent the damage of solderability of terminations, the following storage conditions are

recommended:

Indoors under 5 ~ 40℃ and 20% ~ 70% RH.

No harmful gases containing sulfuric acid, ammonia, hydrogen sulfide or chlorine.

Packaging should not be opened until the capacitors are required for use. If opened, the pack should be

re-sealed as soon as is practicable. Taped product should be stored out of direct sunlight, which might

promote deterioration in tape or adhesion performance. The capacitors should be used within 6 months and

checked the solderability before use.

HANDLING

Chip capacitors are dense, hard, brittle, and abrasive materials. They are liable to suffer mechanical

damage, in the form of cracks or chips. Chip Capacitors should be handled with care to avoid contamination

or damage. To use vacuum or plastic tweezers to pick up or plastic tweezers is recommended for manual

placement. Tape and reeled packages are suitable for automatic pick and placement machine.

PREHEAT

In order to minimize the risk of thermal shock during soldering, a carefully controlled preheat is required.

The rate of preheat should not exceed 4℃ per second and the final preheat temperature should be within

100℃ of the soldering temperature for small chips such as 0603, 0805 and 1206, within 50℃ of the

soldering temperature for bigger chips such as 1210, 1808, 1812, 1825, 2220 and 2225, etc.

SOLDERING

Use middy activated rosin RA and RMA fluxes do not use activated flux. The amount of solder in each

solder joint should be controlled to prevent the damage of chip capacitors caused by the stress between

solder, chips, and substrate.

Hand soldering with temperature-controlled iron not exceeding 30 watts and diameter of tip less than 1.2

mm is recommended, tip of iron should not contact the ceramic body directly, and the temperature of iron

should be set to not more than 260℃.

For bigger chips such as 1210, 1808, 1812, 1825, 2220 and 2225, etc. wave soldering and hand

soldering are no recommended.

Recommended soldering profiles as following:

Soldering Solder Temp.(T) Soldering Time (t)

(℃)

soldering

235 – 260 ℃

230 – 260 ℃

Reflow

Wave

< 15 sec.

< 5 sec.

preheat

cooling

200

100

ΔT

Chip Size

100 ℃

0603, 0805, 1206

50 ℃

1210, 1808, 1812, 1825, 2220, 2225

120 sec.

60 sec.

COOLING

After soldering, cool the chips and the substrate gradually to room temperature. Natural cooling in air is

recommended to minimize stress in the solder joint. A cooling rate not exceeding 4℃ per second should be

used when forced cooling is necessary.

CLEANING

All flux residues must be removed by using suitable electronic-grade vapor-cleaning solvents to

eliminate contamination that could cause electrolytic surface corrosion. Good results can be obtained by

using ultrasonic cleaning of the solvent. The choice of the proper system is depends upon many factors such

as component mix, flux, and solder paste and assembly method. The ability of the cleaning system to remove

flux residues and contamination from under the chips is very important.

Rev.7

Soft Termination Multilayer

Ceramic Chip Capacitors

STSeries

MERITEK

RoHS

RELIABILITY

TEST

CONDITIONS AND

REQUIREMENTS

No.

Item

Test Condition

Requirements

1. Visual and

Mechanical

---

* No remarkable defect.

* Dimensions to conform to individual specification sheet.

* Shall not exceed the limits given in the detailed spec.

NP0: Cap≥30pF, Q≥1000; Cap<30pF, Q≥400+20C

X7R: ≤2.5%

2. Capacitance Class I: (NP0)

Cap≤1000pF, 1.0±0.2Vrms, 1MHz±10%

Cap>1000pF, 1.0±0.2Vrms, 1KHz±10%

Class II: (X7R)

3. Q/ D.F.

(Dissipation

Factor)

1.0±0.2Vrms, 1kHz±10%

4. Temperature With no electrical load.

T.C.

NP0

X7R

Operating Temp

-55~125°C at 25°C

T.C.

NPO

X7R

Capacitance Change

Within ±30ppm/°C

Within ±15%

Coefficient

5. Insulation

U =100V: To apply voltage at U for max. 120 sec.

Class I (NP0)

Class II (X7R)

: ≥100Gꢀ or RxC≥1000ꢀ-F whichever is smaller.

: ≥10Gꢀ or RxC≥500ꢀ-F whichever is smaller.

Resistance U >100V: To apply voltage at U (500V max.) for 60

sec.

6. Dielectric

Strength

* To apply voltage:

100V

* No evidence of damage or flashover during test.

=2.5 times of U

200V/250V

500V

=2 times of U

=1.5 times of U

=1.2 times of U

> 500V

* Duration: 1 to 5 sec.

7. Solderability * Solder temperature: 235±5°C

NPO:95% min. coverage of all metalized area.

* Dipping time: 2±0.5 sec.

X7R:75% min. coverage of all metalized area.

8. Resistance * Solder temperature: 260±5°C

to Soldering * Dipping time: 10±1 sec

* No remarkable damage.

* Cap change:

Heat

* Preheating: 120 to 150°C for 1 minute before

immerse the capacitor in a eutectic solder.

* Before initial measurement : Perform 150+0/-10°C

for 1 hr and then set for 48±4 hrs at room temp.

* Measurement to be made after keeping at room

temp. for 24±2hrs (Class I) or 48±4 hrs (Class II)

NP0: within ±2.5% or ±0.25pF whichever is larger.

* Q/D.F., I.R. and dielectric strength: To meet initial requirements.

X7R:

within ±15%

* 25% max. leaching on each edge.

9. Temperature * Conduct the five cycles according to the

* No remarkable damage.

Cycle

temperatures and time.

* Cap change：

Step

Temp. (°C)

Min. operating temp. +0/-3

Room temp.

Max. operating temp. +3/-0

Room temp.

Time (min.)

30±3

2~3

30±3

2~3

NP0: within ±2.5％ or ±0.25pF whichever is larger.

X7R: within ±15%

* Q/D.F.:

X7R: ≤1.5 × Initial requirement

* I.R.≥ 0.25 × initial requirements.

* Before initial measurement : Perform 150+0/-10°C

for 1 hr and then set for 48±4 hrs at room temp.

* Measurement to be made after keeping at room

temp. for 24±2 hrs. (Class I) or 48±4 hrs (Class II)

10. Humidity

* Test temp.: 40±2°C

* No remarkable damage.

* Cap change:

NP0: within ±5.0% or ±0.5pF whichever is larger.

X7R :within ±15%

(Damp Heat) * Humidity: 90~95% RH

Steady State * Test time: 500+24/-0hrs.

* Measurement to be made after keeping at room

temp. for 24±2 hrs. (Class I) or 48±4 hrs (Class II)

Q/D.F Value:

NP0: Cap≥30pF, Q≥350; 10pF≤Cap<30pF, Q≥275+2.5C

Cap<10pF; Q≥200+10C

X7R:

≤7.0%

* I.R.: ≥1Gꢀ or RxC≥50ꢀ-F whichever is smaller.

Rev.7

Soft Termination Multilayer

Ceramic Chip Capacitors

STSeries

MERITEK

RoHS

No.

Item

Test Condition

* Test temp.: 40±2°C

* Humidity: 90~95%RH

* Test time: 500+24/-0 hrs.

* To apply voltage：rated voltage (Max. 500V)

* Measurement to be made after keeping at room

temp. for 24±2 hrs. (Class I).

Requirements

Humidity

(Damp Heat)

Load

* No remarkable damage.

* Cap change: NP0: within ±7.5% or ±0.75pF whichever is larger.

* Q/D.F. value:

NP0: Cap≥30pF, Q≥200; Cap<30pF, Q≥100+10/3C

* I.R.: ≥500Mꢀ or RxC≥25ꢀ-F whichever is smaller.

11.

12.

Vibration

* Vibration frequency: 10~55 Hz/min.

* Total amplitude: 1.5mm

* No remarkable damage.

Resistance

* Cap change and Q/D.F.: To meet initial spec.

* Test time: 6 hrs. (Two hrs each in three mutually

perpendicular directions.)

13. High

Load

* Test temp.:

Temperature 125±3°C

* No remarkable damage.

* Cap change:

NP0: within ±3.0% or ±0.3pF whichever is larger.

X7R :within ±15%

* To apply voltage:

(Endurance)

(1) U ≤ 250V:

200% of rated voltage.

Exception item: To apply 150% of rated voltage

* Q/D.F Value:

Size

1206

1210

1812

1825

2220

2225

Cap. Range

NP0: Cap≥30pF, Q≥350

10pF≤Cap<30pF, Q≥275+2.5C

Cap<10pF, Q≥200+10C

100V

> 224

200V / 250V

> 224

> 474

> 105

X7R:

≤7.0%

* I.R.: ≥1Gꢀ or RxC≥50ꢀ-F whichever is smaller.

(2) 250 < U ≤500V:

150% of rated voltage.

120% of rated voltage.

(3) U > 500V:

* Test time: 1000+24/-0 hrs.

* Measurement to be made after keeping at room

temp. for 24±2 hrs. (Class I) or 48±4 hrs (Class II)

14. Resistance

to Flexure of

Substrate

* No remarkable damage.

* Cap change:

* The middle part of substrate shall be pressurized by

means of the pressurizing rod at a rate of about 1mm

per second until the deflection becomes 5mm.

X7R:

within ±10%

(This capacitance change means the change of capacitance under

specified flexure of substrate from the capacitance measured before the

test.)

R = 230

5mm

45±1

15. Adhesive

Strength of

Termination

* Capacitors mounted on a substrate. A force of 10N * No remarkable damage or removal of the terminations.

applied perpendicular to the place of substrate and

parallel the line joining the center of terminations for

10±1 second.

10N

PC Board

Capacitor

Rev.7

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