TC4421AVMF13
更新时间：2025-01-14 05:11:56
品牌：MICROCHIP
描述：10 A BUF OR INV BASED MOSFET DRIVER, PDSO8, 6 X 8 MM, LEAD FREE, PLASTIC, MO-220, DFN-8
概述
数据手册TC4421AVMF13 概述
10 A BUF OR INV BASED MOSFET DRIVER, PDSO8, 6 X 8 MM, LEAD FREE, PLASTIC, MO-220, DFN-8
TC4421AVMF13 数据手册
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PDF下载TC4421A/TC4422A
9A High-Speed MOSFET Drivers
General Description
Features
• High Peak Output Current: 10A (typ.)
The TC4421A/TC4422A are improved versions of the
earlier TC4421/TC4422 family of single-output
MOSFET drivers. These devices are high-current
buffer/drivers capable of driving large MOSFETs and
Insulated Gate Bipolar Transistors (IGBTs). The
TC4421A/TC4422A have matched output rise and fall
times, as well as matched leading and falling-edge
propagation delay times. The TC4421A/TC4422A
devices also have very low cross-conduction current,
reducing the overall power dissipation of the device.
• Low Shoot-Through/Cross-Conduction Current in
Output Stage
• Wide Input Supply Voltage Operating Range:
- 4.5V to 18V
• High Continuous Output Current: 2A (max.)
• Matched Fast Rise and Fall Times:
- 15 ns with 4,700 pF Load
- 135 ns with 47,000 pF Load
These devices are essentially immune to any form of
upset, except direct overvoltage or over-dissipation.
They cannot be latched under any conditions within
their power and voltage ratings. These parts are not
subject to damage or improper operation when up to
5V of ground bounce is present on their ground
terminals. They can accept, without damage or logic
upset, more than 1A inductive current of either polarity
being forced back into their outputs. In addition, all
terminals are fully protected against up to 4 kV of
electrostatic discharge.
• Matched Short Propagation Delays: 42 ns (typ.)
• Low Supply Current:
- With Logic ‘1’ Input – 130 µA (typ.)
- With Logic ‘0’ Input – 33 µA (typ.)
• Low Output Impedance: 1.2Ω (typ.)
• Latch-Up Protected: Will Withstand 1.5A Output
Reverse Current
• Input Will Withstand Negative Inputs Up To 5V
• Pin-Compatible with the TC4420/TC4429
and TC4421/TC4422 MOSFET Drivers
The TC4421A/TC4422A inputs may be driven directly
from either TTL or CMOS (3V to 18V). In addition,
300 mV of hysteresis is built into the input, providing
noise immunity and allowing the device to be driven
from slowly rising or falling waveforms.
• Space-Saving, Thermally-Enhanced, 8-Pin DFN
Package
Applications
• Line Drivers for Extra Heavily-Loaded Lines
• Pulse Generators
With both surface-mount and pin-through-hole
packages, in addition to a wide operating temperature
range, the TC4421A/TC4422A family of 9A MOSFET
drivers fit into most any application where high gate/line
capacitance drive is required.
• Driving the Largest MOSFETs and IGBTs
• Local Power ON/OFF Switch
• Motor and Solenoid Driver
• LF Initiator
(1)
Package Types
8-Pin DFN(2) TC4421A TC4422A
5-Pin TO-220
8-Pin
PDIP/SOIC
TC4421A TC4422A
Tab is
V
1
2
3
4
DD
V
V
DD
8
7
6
5
Common
to V
V
8
V
DD
V
1
2
3
4
DD
DD
DD
DD
INPUT
NC
7
6
5
OUTPUT OUTPUT
OUTPUT OUTPUT
INPUT
NC
OUTPUT
OUTPUT
GND
OUTPUT
OUTPUT
GND
TC4421A
TC4422A
TC4421A
TC4422A
TC4421A
TC4422A
GND
GND
GND
GND
Note 1: Duplicate pins must both be connected for proper operation.
2: Exposed pad of the DFN package is electrically isolated.
© 2005 Microchip Technology Inc.
DS21946A-page 1
TC4421A/TC4422A
Functional Block Diagram
VDD
TC4421A
Inverting
130 µA
300 mV
Output
Output
Cross-Conduction
Reduction and Pre-Drive
Circuitry
TC4422A
Non-Inverting
Input
GND
4.7V
Effective
Input
C = 25 pF
DS21946A-page 2
© 2005 Microchip Technology Inc.
TC4421A/TC4422A
† Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage .....................................................+20V
Input Voltage .................... (VDD + 0.3V) to (GND – 5V)
Input Current (VIN > VDD)...................................50 mA
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, TA = +25°C with 4.5V ≤ VDD ≤ 18V.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input
Logic ‘1’, High Input Voltage
Logic ‘0’, Low Input Voltage
Input Current
VIH
VIL
IIN
2.4
—
1.8
1.3
—
—
0.8
V
V
–10
–5
+10
µA 0V ≤ VIN ≤ VDD
Input Voltage
VIN
—
VDD – 0.3
V
Output
High Output Voltage
Low Output Voltage
Output Resistance, High
Output Resistance, Low
Peak Output Current
Continuous Output Current
VOH
VOL
ROH
ROL
IPK
VDD – 0.025
—
—
—
0.025
1.5
1.1
—
V
V
Ω
Ω
A
A
DC Test
—
—
—
—
2
DC Test
1.25
0.8
10.0
—
IOUT = 10 mA, VDD = 18V
IOUT = 10 mA, VDD = 18V
VDD = 18V
IDC
—
10V ≤ VDD ≤ 18V, TA = +25°C
(TC4421A/TC4422A CAT only)
(Note 2)
Latch-Up Protection
Withstand Reverse Current
IREV
—
>1.5
—
A
Duty cycle ≤ 2%, t ≤ 300 µsec
Switching Time (Note 1)
Rise Time
tR
tF
—
—
—
—
28
26
38
42
34
32
45
49
ns Figure 4-1, CL = 10,000 pF
ns Figure 4-1, CL = 10,000 pF
ns Figure 4-1, CL = 10,000 pF
ns Figure 4-1, CL = 10,000 pF
Fall Time
Propagation Delay Time
Propagation Delay Time
Power Supply
tD1
tD2
Power Supply Current
IS
—
—
130
35
250
100
18
µA VIN = 3V
µA VIN = 0V
V
Operating Input Voltage
VDD
4.5
—
Note 1: Switching times ensured by design.
2: Tested during characterization, not production tested.
© 2005 Microchip Technology Inc.
DS21946A-page 3
TC4421A/TC4422A
DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE)
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 18V.
Parameters
Sym
Min
Typ
Max Units
Conditions
Input
Logic ‘1’, High Input Voltage
Logic ‘0’, Low Input Voltage
Input Current
VIH
VIL
IIN
2.4
—
—
—
—
—
0.8
+10
V
V
–10
µA 0V ≤ VIN ≤ VDD
Output
High Output Voltage
Low Output Voltage
Output Resistance, High
Output Resistance, Low
Switching Time (Note 1)
Rise Time
VOH
VOL
ROH
ROL
VDD – 0.025
—
—
—
—
—
0.025
2.0
V
V
Ω
Ω
DC Test
—
—
—
DC Test
IOUT = 10 mA, VDD = 18V
IOUT = 10 mA, VDD = 18V
1.6
tR
tF
—
—
—
—
38
33
45
40
60
60
ns Figure 4-1, CL = 10,000 pF
ns Figure 4-1, CL = 10,000 pF
ns Figure 4-1, CL = 10,000 pF
ns Figure 4-1, CL = 10,000 pF
Fall Time
Propagation Delay Time
Propagation Delay Time
Power Supply
tD1
tD2
50.4
53
Power Supply Current
IS
—
—
200
50
500
150
18
µA VIN = 3V
µA VIN = 0V
V
Operating Input Voltage
VDD
4.5
—
Note 1: Switching times ensured by design.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 18V.
Parameters
Temperature Ranges
Sym
Min
Typ
Max
Units
Conditions
Specified Temperature Range (V)
Maximum Junction Temperature
Storage Temperature Range
TA
TJ
TA
–40
—
—
—
—
+125
+150
+150
°C
°C
°C
–65
Package Thermal Resistances
Thermal Resistance, 5L-TO-220
Thermal Resistance, 8L-6x5 DFN
θJA
θJA
—
—
71
—
—
°C/W Without heat sink
33.2
°C/W Typical 4-layer board with
vias to ground plane
Thermal Resistance, 8L-PDIP
Thermal Resistance, 8L-SOIC
θJA
θJA
—
—
125
155
—
—
°C/W
°C/W
DS21946A-page 4
© 2005 Microchip Technology Inc.
TC4421A/TC4422A
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, TA = +25°C with 4.5V ≤ VDD ≤ 18V.
300
180
160
140
120
100
80
250
200
150
100
50
5V
22,000 pF
10V
10,000 pF
60
15V
40
1,000 pF
6
100 pF
20
0
0
4
8
10
12
14
16
18
100
1000
10000
100000
Supply Voltage (V)
Capacitive Load (pF)
FIGURE 2-1:
Rise Time vs. Supply
FIGURE 2-4:
Fall Time vs. Capacitive
Voltage.
Load.
55
300
250
200
150
100
50
VDD = 15V
50
45
40
35
30
25
20
5V
10V
tRISE
tFALL
15V
0
100
1000
10000
100000
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (°C)
Capacitive Load (pF)
FIGURE 2-2:
Rise Time vs. Capacitive
FIGURE 2-5:
Rise and Fall Times vs.
Load.
Temperature.
-7
180
160
140
120
100
80
1
10
22,000 pF
-8
1
10
60
10,000 pF
1,000 pF
40
100 pF
20
0
-9
1
10
4
6
8
10
12
14
16
18
4
6
8
10
12
14
16
18
Supply Voltage (V)
Supply Voltage (V)
FIGURE 2-3:
Fall Time vs. Supply
FIGURE 2-6:
Crossover Energy vs Supply
Voltage.
Voltage.
© 2005 Microchip Technology Inc.
DS21946A-page 5
TC4421A/TC4422A
Note: Unless otherwise indicated, TA = +25°C with 4.5V ≤ VDD ≤ 18V.
140
120
100
80
80
75
70
65
60
55
CLOAD = 10,000 pF
INPUT = High
50
45
40
35
30
tD2
tD1
60
INPUT = Low
40
20
4
6
8
10
12
14
16
18
4
6
8
10
12
14
16
18
Supply Voltage (V)
Supply Voltage (V)
FIGURE 2-7:
Propagation Delay vs.
FIGURE 2-10:
Quiescent Supply Current
Supply Voltage.
vs. Supply Voltage.
75
70
65
60
55
50
220
VDD = 18V
200
VDD = 12V
180
160
INPUT = High
140
120
100
80
60
40
tD2
INPUT = Low
tD1
45
40
20
2
3
4
5
6
7
8
9
10
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (°C)
Input Amplitude (V)
FIGURE 2-8:
Propagation Delay vs. Input
FIGURE 2-11:
Quiescent Supply Current
Amplitude.
vs. Temperature.
60
2.0
VDD = 12V
1.9
VDD = 12V
IN = 5V
LOAD = 10,000 pF
V
C
55
50
45
40
35
30
1.8
1.7
1.6
VIH
tD2
1.5
tD1
1.4
1.3
1.2
VIL
1.1
1.0
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (°C)
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (°C)
FIGURE 2-9:
Propagation Delay vs.
FIGURE 2-12:
Input Threshold vs.
Temperature.
Temperature.
DS21946A-page 6
© 2005 Microchip Technology Inc.
TC4421A/TC4422A
Note: Unless otherwise indicated, TA = +25°C with 4.5V ≤ VDD ≤ 18V.
2.0
180
VDD = 18V
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
160
200 kHz
140
2 MHz
120
1 MHz
VIH
100
100 kHz
50 kHz
80
60
40
20
0
VIL
10 kHz
4
6
8
10
12
14
16
18
100
1,000
10,000
100,000
Supply Voltage (V)
Capacitive Load (pF)
FIGURE 2-13:
Input Threshold vs. Supply
FIGURE 2-16:
Supply Current vs.
Voltage.
Capactive Load (VDD = 18V).
5.0
4.5
4.0
3.5
3.0
2.5
2.0
200
VIN = 5V (TC4422A)
VIN = 0V (TC4421A)
VDD = 12V
180
160
140
200 kHz
TJ = 150°C
120
2 MHz
1 MHz
100
100 kHz
50 kHz
80
TJ = 25°C
1.5
1.0
0.5
0.0
60
40
20
0
10 kHz
100
1,000
10,000
100,000
4
6
8
10
12
14
16
18
Capacitive Load (pF)
Supply Voltage (V)
FIGURE 2-14:
High-State Output
FIGURE 2-17:
Supply Current vs.
Resistance vs. Supply Voltage.
Capactive Load (VDD = 12V).
3.5
3.0
220
VDD = 6V
VIN = 0V (TC4422A)
200
180
160
140
120
100
80
60
40
20
0
VIN = 5V (TC4421A)
1 MHz
2.5
TJ = 150°C
2 MHz
200 kHz
2.0
1.5
100 kHz
50 kHz
TJ = 25°C
1.0
0.5
0.0
10 kHz
100
1,000
10,000
100,000
4
6
8
10
12
14
16
18
Supply Voltage (V)
Capacitive Load (pF)
FIGURE 2-15:
Low-State Output
FIGURE 2-18:
Supply Current vs.
Resistance vs. Supply Voltage.
Capactive Load (VDD = 6V).
© 2005 Microchip Technology Inc.
DS21946A-page 7
TC4421A/TC4422A
Note: Unless otherwise indicated, TA = +25°C with 4.5V ≤ VDD ≤ 18V.
180
160
140
120
100
80
220
VDD = 18V
47,000 pF
VDD = 6V
200
180
160
140
120
100
80
60
40
20
10,000 pF
22,000 pF
22,000 pF
47,000 pF
0.1 µF
1000 pF
10,000 pF
0.1 µF
60
40
1000 pF
470 pF
470 pF
20
0
0
10
100
1000
10000
10
100
1000
10000
Frequency (kHz)
Frequency (kHz)
FIGURE 2-19:
Supply Current vs.
FIGURE 2-21:
Supply Current vs.
Frequency (VDD = 18V).
Frequency (VDD = 6V).
200
VDD = 12V
180
10,000 pF
160
47,000 pF
140
120
22,000 pF
1000 pF
100
0.1 µF
80
60
40
20
0
470 pF
10
100
1000
10000
Frequency (kHz)
FIGURE 2-20:
Supply Current vs.
Frequency (VDD = 12V).
DS21946A-page 8
© 2005 Microchip Technology Inc.
TC4421A/TC4422A
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin No.
8-Pin PDIP,
SOIC
Pin No.
5-Pin TO-220
Pin No.
8-Pin DFN
Symbol
Description
1
2
1
2
—
1
VDD
INPUT
NC
Supply input, 4.5V to 18V
Control input, TTL/CMOS-compatible input
No connection
3
3
—
2
4
4
GND
Ground
5
5
4
GND
Ground
6
6
5
OUTPUT
OUTPUT
VDD
CMOS push-pull output
CMOS push-pull output
Supply input, 4.5V to 18V
Exposed metal pad
7
7
—
3
8
8
—
—
PAD
—
—
TAB
NC
VDD
Metal tab is at the VDD potential
3.1
Supply Input (V
)
3.3
CMOS Push-Pull Output
DD
The VDD input is the bias supply for the MOSFET driver
and is rated for 4.5V to 18V with respect to the ground
pin. The VDD input should be bypassed to ground with
a local ceramic capacitor. The value of the capacitor
should be chosen based on the capacitive load that is
being driven. A minimum value of 1.0 µF is suggested.
The MOSFET driver output is a low-impedance,
CMOS, push-pull style output capable of driving a
capacitive load with 9.0A peak currents. The MOSFET
driver output is capable of withstanding 1.5A peak
reverse currents of either polarity.
3.4
Ground
3.2
Control Input
The ground pins are the return path for the bias current
and for the high peak currents that discharge the load
capacitor. The ground pins should be tied into a ground
plane or have very short traces to the bias supply
source return.
The MOSFET driver input is a high-impedance,
TTL/CMOS-compatible input. The input also has
300 mV of hysteresis between the high and low
thresholds that prevents output glitching even when the
rise and fall time of the input signal is very slow.
3.5
Exposed Metal Pad
The exposed metal pad of the 6x5 DFN package is not
internally connected to any potential. Therefore, this
pad can be connected to a ground plane or other
copper plane on a Printed Circuit Board (PCB) to aid in
heat removal from the package.
3.6
Metal Tab
The metal tab of the TO-220 package is connected to
the VDD potential of the device. This connection to VDD
can be used as a current carrying path for the device.
© 2005 Microchip Technology Inc.
DS21946A-page 9
TC4421A/TC4422A
4.0
APPLICATIONS INFORMATION
+5V
90%
Input
V
DD = 18V
10%
0V
+18V
Output
0V
tD1
90%
tD2
tF
tR
0.1 µF
4.7 µF
90%
0.1 µF
1
8
VDD
VDD
10%
10%
Inverting Driver
TC4421A
2
6
Output
Output
Input
Input
Output
7
+5V
CL = 10,000 pF
90%
GND
4
GND
5
Input
10%
0V
+18V
90%
90%
tD1
tD2
tF
tR
Output
0V
Input: 100 kHz,
square wave,
10%
10%
tRISE = tFALL ≤ 10 nsec
Non-Inverting Driver
TC4422A
Note: Pinout shown is for the DFN, PDIP and SOIC packages.
FIGURE 4-1:
Switching Time Test Circuits.
DS21946A-page 10
© 2005 Microchip Technology Inc.
TC4421A/TC4422A
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
5-Lead TO-220
Example:
XXXXXXXXX
XXXXXXXXX
TC4421A
XXXXXXXXX
e
3
VAT^
YYWWNNN
0514256
8-Lead DFN
Example:
XXXXXXX
XXXXXXX
XXYYWW
NNN
TC4421A
VMF
0514
256
^
e
3
8-Lead PDIP (300 mil)
Example:
TC4421A
XXXXXXXX
XXXXXNNN
e
3
PA ^ 256
0514
YYWW
8-Lead SOIC (150 mil)
Example:
TC4421A
XXXXXXXX
XXXXYYWW
SN
e
3
0514
NNN
256
Legend: XX...X Customer-specific information
Y
YY
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
WW
NNN
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2005 Microchip Technology Inc.
DS21946A-page 11
TC4421A/TC4422A
5-Lead Plastic Transistor Outline (AT) (TO-220)
L
H1
Q
b
e3
e1
E
e
EJECTOR PIN
ØP
(5X)
a
C1
A
J1
F
D
Units
INCHES*
MIN
.060
MILLIMETERS
MIN MAX
1.52
Dimension Limits
MAX
.072
e
Lead Pitch
1.83
6.93
1.02
4.83
10.54
14.99
6.55
1.40
2.87
3.96
14.22
2.92
0.56
1.02
Overall Lead Centers
Space Between Leads
Overall Height
e1
e3
A
.263
.030
.160
.385
.560
.234
.045
.103
.146
.540
.090
.014
.025
.273
.040
.190
.415
.590
.258
.055
.113
.156
.560
.115
.022
.040
6.68
0.76
4.06
9.78
14.22
5.94
1.14
2.62
3.71
13.72
2.29
0.36
0.64
Overall Width
E
Overall Length
D
Flag Length
H1
F
Flag Thickness
Q
Through Hole Center
Through Hole Diameter
Lead Length
P
L
Base to Bottom of Lead
Lead Thickness
Lead Width
J1
C1
b
a
Mold Draft Angle
3°
7°
3°
7°
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed .010" (0.254mm) per side.
JEDEC equivalent: TO-220
Drawing No. C04-036
DS21946A-page 12
© 2005 Microchip Technology Inc.
TC4421A/TC4422A
8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S) – Saw Singulated
© 2005 Microchip Technology Inc.
DS21946A-page 13
TC4421A/TC4422A
8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
B
p
eB
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.100
.155
.130
2.54
Top to Seating Plane
A
.140
.170
3.56
2.92
3.94
3.30
4.32
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
A2
A1
E
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
.145
3.68
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
.313
.250
.373
.130
.012
.058
.018
.370
10
.325
.260
.385
.135
.015
.070
.022
.430
15
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
E1
D
Tip to Seating Plane
Lead Thickness
L
c
Upper Lead Width
B1
B
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
§
eB
α
β
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS21946A-page 14
© 2005 Microchip Technology Inc.
TC4421A/TC4422A
8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
1
B
n
h
α
45°
c
A2
A
φ
β
L
A1
Units
INCHES*
MILLIMETERS
Dimension Limits
MIN
NOM
8
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
.050
1.27
Overall Height
A
.053
.061
.056
.007
.237
.154
.193
.015
.025
4
.069
1.35
1.32
1.55
1.42
0.18
6.02
3.91
4.90
0.38
0.62
4
1.75
Molded Package Thickness
Standoff
A2
A1
E
.052
.004
.228
.146
.189
.010
.019
0
.061
.010
.244
.157
.197
.020
.030
8
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
§
0.10
5.79
3.71
4.80
0.25
0.48
0
Overall Width
Molded Package Width
Overall Length
E1
D
Chamfer Distance
Foot Length
h
L
φ
Foot Angle
c
Lead Thickness
Lead Width
.008
.013
0
.009
.017
12
.010
.020
15
0.20
0.33
0
0.23
0.42
12
0.25
0.51
15
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
© 2005 Microchip Technology Inc.
DS21946A-page 15
TC4421A/TC4422A
NOTES:
DS21946A-page 16
© 2005 Microchip Technology Inc.
TC4421A/TC4422A
APPENDIX A: REVISION HISTORY
Revision A (May 2005)
• Original Release of this Document.
© 2005 Microchip Technology Inc.
DS21946A-page 17
TC4421A/TC4422A
NOTES:
DS21946A-page 18
© 2005 Microchip Technology Inc.
TC4421A/TC4422A
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
XX
XXX
a)
b)
c)
TC4421AVAT: 9A High-Speed Inverting
Temperature Package Tape & Reel
Range
MOSFET Driver,
TO-220 package,
-40°C to +125°C.
TC4421AVOA: 9A High-Speed Inverting
MOSFET Driver,
Device:
TC4421A: 9A High-Speed MOSFET Driver, Inverting
TC4422A: 9A High-Speed MOSFET Driver, Non-Inverting
SOIC package,
-40°C to +125°C.
Temperature Range:
Package: *
V
=
-40°C to +125°C
TC4421AVMF: 9A High-Speed Inverting
MOSFET Driver,
DFN package,
-40°C to +125°C.
AT
MF
=
=
TO-220, 5-lead
Dual, Flat, No-Lead (6x5 mm Body), 8-lead
MF713 = Dual, Flat, No-Lead (6x5 mm Body), 8-lead
(Tape and Reel)
a)
b)
TC4422AVPA: 9A High-Speed
Non-Inverting MOSFET
Driver, PDIP package,
-40°C to +125°C.
PA
OA
=
=
Plastic DIP (300 mil Body), 8-lead
Plastic SOIC (150 mil Body), 8-lead
OA713 = Plastic SOIC (150 mil Body), 8-lead
(Tape and Reel)
TC4422AVOA: 9A High-Speed
Non-Inverting
*All package offerings are Pb Free (Lead Free).
MOSFET Driver,
SOIC package,
-40°C to +125°C.
c)
TC4422AVMF: 9A High-Speed
Non-Inverting MOSFET
Driver, DFN package,
-40°C to +125°C.
© 2005 Microchip Technology Inc.
DS21946A-page 19
TC4421A/TC4422A
NOTES:
DS21946A-page 20
© 2005 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR WAR-
RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION, INCLUDING BUT NOT
LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and
its use. Use of Microchip’s products as critical components in
life support systems is not authorized except with express
written approval by Microchip. No licenses are conveyed,
implicitly or otherwise, under any Microchip intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro,
PICSTART, PRO MATE, PowerSmart, rfPIC, and
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
PICMASTER, SEEVAL, SmartSensor and The Embedded
Control Solutions Company are registered trademarks of
Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Linear Active Thermistor,
MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM,
PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo,
PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode,
Smart Serial, SmartTel, Total Endurance and WiperLock are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2005, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2005 Microchip Technology Inc.
DS21946A-page 21
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
India - Bangalore
Tel: 91-80-2229-0061
Fax: 91-80-2229-0062
Austria - Weis
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
Denmark - Ballerup
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-5160-8631
Fax: 91-11-5160-8632
China - Chengdu
Tel: 86-28-8676-6200
Fax: 86-28-8676-6599
France - Massy
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Kanagawa
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Atlanta
China - Fuzhou
Tel: 86-591-8750-3506
Fax: 86-591-8750-3521
Germany - Ismaning
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Korea - Seoul
Alpharetta, GA
Tel: 770-640-0034
Fax: 770-640-0307
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Boston
Malaysia - Penang
Tel:011-604-646-8870
Fax:011-604-646-5086
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Philippines - Manila
Tel: 011-632-634-9065
Fax: 011-632-634-9069
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
England - Berkshire
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Dallas
Addison, TX
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Tel: 972-818-7423
Fax: 972-818-2924
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Shunde
Detroit
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Qingdao
Tel: 86-532-502-7355
Fax: 86-532-502-7205
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Taiwan - Hsinchu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
San Jose
Mountain View, CA
Tel: 650-215-1444
Fax: 650-961-0286
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
04/20/05
DS21946A-page 22
© 2005 Microchip Technology Inc.
TC4421AVMF13 相关器件
| 型号 | 制造商 | 描述 | 价格 | 文档 |
| TC4421AVMF713 | MICROCHIP | 9A High-Speed MOSFET Drivers | 获取价格 |
|
| TC4421AVOA | MICROCHIP | 9A High-Speed MOSFET Drivers | 获取价格 |
|
| TC4421AVOA713 | MICROCHIP | 9A High-Speed MOSFET Drivers | 获取价格 |
|
| TC4421AVPA | MICROCHIP | 9A High-Speed MOSFET Drivers | 获取价格 |
|
| TC4421A_13 | MICROCHIP | 9A High-Speed MOSFET Drivers | 获取价格 |
|
| TC4421CAT | TELCOM | 9A HIGH-SPEED MOSFET DRIVERS | 获取价格 |
|
| TC4421CAT | MICROCHIP | 9A High-Speed MOSFET Drivers | 获取价格 |
|
| TC4421CATG | MICROCHIP | 暂无描述 | 获取价格 |
|
| TC4421CATPA | MICROCHIP | BUF OR INV BASED MOSFET DRIVER | 获取价格 |
|
| TC4421CG | MICROCHIP | 9A High-Speed MOSFET Drivers | 获取价格 |
|
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