NHD-0220FZ-SYG-GBW

更新时间:2025-06-11 20:28:59
品牌:NEWHAVEN
描述:LCD MOD CHAR 2X20 Y/G TRANSFL

NHD-0220FZ-SYG-GBW 概述

LCD MOD CHAR 2X20 Y/G TRANSFL

NHD-0220FZ-SYG-GBW 数据手册

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User’s Guide  
NHD-0220FZ-SYG-GBW  
LCM  
(Liquid Crystal Display Module)  
RoHS Compliant  
NHD- Newhaven Display  
0220- 2 Lines x 20 Characters  
FZ-  
Version Line  
Transflective  
SYG- Side Yellow/Green LED B/L  
G-  
B-  
W-  
STN-Gray  
6:00 View  
Wide Temperature (-20 ~ +70c)  
For product support, contact  
Newhaven Display International  
2511 Technology Drive, #101  
Elgin, IL 60124  
Tel: (847) 844-8795 Fax: (847) 844-8796  
June 5, 2008  
DOCUMENT REVISION HISTORY  
Version  
DATE  
DESCRIPTION  
CHANGED BY  
First issue  
00  
Apr-06-2006  
CONTENTS  
Item  
Page  
Functions & Features  
3
Mechanical specifications  
Dimensional Outline  
Absolute maximum ratings  
Block diagram  
Pin description  
Contrast adjust  
3
4
5
5
5
6
Optical characteristics  
Electrical characteristics  
Timing Characteristics  
Instruction description  
Display character address code:  
character pattern  
6
6
7-8  
9-12  
12  
13  
14--21  
Quality Specifications  
2
ꢀꢁ&EATURES  
ꢀꢁ ꢂXꢃ DOTS WITH CURSOR  
ꢄꢁ "UILTꢅIN CONTROLLER ꢆ+3ꢇꢇꢈꢈ5 OR EQUIVALENTꢉ  
ꢊꢁ ꢋꢂ6 POWER SUPPLY ꢆALSO AVAILABLE FOR ꢌꢊꢁꢇ6ꢉ  
ꢍꢁ ꢀꢎꢀꢈ DUTY CYCLEꢏꢀꢎꢂBIAS  
ꢂꢁ "+, TO BE DRIVEN BY PINꢀꢐ PINꢄꢐ OR PINꢀꢂꢐ PINꢀꢈ OR !ꢐ +  
ꢈꢁ ꢄꢇCHARACTERS ꢑꢄLINES DISPLAY  
,#$ TYPE  
&34. POSITIVE  
34. 'RAY  
ꢈ /ꢒCLOCK  
2EFLECTIVE  
,%$  
&34. .EGATIVE  
34. 9ELLOWꢎ'REEN  
ꢀꢄ /ꢒCLOCK  
34.ꢅ"LUE  
6IEW DIRECTION  
2EAR 0OLARIZER  
"ACKLIGHT 4YPE  
4RANSFLECTIVE  
4RANSMISSIVE  
ꢍꢁꢄ6 INPUT  
%,  
)NTERNAL 0OWER  
##&,  
!MBER  
%XTERNAL 0OWER  
"LUEꢅ'REEN  
ꢊꢁꢊ INPUT  
9ELLOWꢅ'REEN  
3UPER 7IDE  
"ACKLIGHT #OLOR  
4EMPERATURE 2ANGE  
$# TO $# CIRCUIT  
%L $RIVER )#  
4OUCH SCREEN  
&ONT TYPE  
7HITE  
.ORMAL  
"UILDꢅIN  
"UILDꢅIN  
7ITH  
%NGLISHꢅ*AP  
ANESE  
7IDE  
.OT "UILDꢅIN  
.OT "UILDꢅIN  
7ITHOUT  
%NGLISHꢅ%UR  
OPEN  
%NGLISHꢅ2USSIAN  
OTHER  
ꢂꢁ -%#(!.)#!, 30%#)&)#!4)/.3  
-ODULE SIZE  
6IEWING AREA  
#HARACTER SIZE  
#HARACTER PITCH  
7EIGHT  
ꢈꢂꢁꢇMMꢆ,ꢉꢑꢄꢇꢁꢇMMꢆ7ꢉꢑ -AXꢃꢁꢂꢆ(ꢉMM  
ꢍꢈꢁꢇMMꢆ,ꢉꢑꢀꢇꢁꢇMMꢆ7ꢉ  
ꢀꢁꢃꢂMMꢆ,ꢉꢑꢊꢁꢄꢊMMꢆ7ꢉ  
ꢄꢁꢀꢂMMꢆ,ꢉꢑꢍꢁꢀꢓMMꢆ7ꢉ  
!PPROXꢁ  
4.Absolute maximum ratings  
Item  
Symbol  
Standard  
Unit  
Power voltage  
V
DD-VSS  
0
-
-
-
-
7.0  
VDD  
+70  
+80  
V
Input voltage  
Operating temperature range  
Storage temperature range  
5.Block diagram  
VIN  
VOP  
VST  
VSS  
-20  
-30  
k
6.Interface pin description  
External  
Pin no.  
Symbol  
Function  
connection  
Signal ground for LCM (GND)  
Power supply for logic (+5V) for LCM  
Contrast adjust  
1
2
3
4
5
6
V
SS  
DD  
Power supply  
V
V
0
RS  
R/W  
E
MPU  
MPU  
MPU  
Register select signal  
Read/write select signal  
Operation (data read/write) enable signal  
Four low order bi-directional three-state data bus lines.  
Used for data transfer between the MPU and the LCM.  
These four are not used during 4-bit operation.  
Four high order bi-directional three-state data bus lines.  
Used for data transfer between the MPU  
7~10  
DB0~DB3  
MPU  
11~14  
DB4~DB7  
MPU  
15  
16  
LED+  
LED-  
Power supply for LED backlight(+4.2V)  
Power supply  
Power supply for LED backlight(0V)  
7.Contrast adjust  
V
DD~V0: LCD Driving voltage  
VR: 10k~20k  
8.Optical characteristics  
TN type display module (Ta=25k, VDD=5.0V)  
Item  
Symbol  
Condition  
Min.  
Typ.  
-
-
2
120  
120  
Max.  
-
30  
Unit  
Viewing angle  
-25  
Cr  
ƒ4  
-
-
deg  
-30  
Contrast ratio  
C
r
-
-
-
-
-
Response time (rise)  
T
r
150  
150  
ms  
Response time (fall)  
T
r
STN type display module (Ta=25k, VDD=5.0V)  
Item  
Symbol  
Condition  
Min.  
Typ.  
Max.  
Unit  
Viewing angle  
-60  
-
35  
Cr  
ƒ2  
-
-
deg  
-40  
-
6
150  
150  
40  
-
250  
250  
Contrast ratio  
Response time (rise)  
Response time (fall)  
C
r
-
-
-
-
T
T
r
ms  
r
9.Electrical characteristics  
DC characteristics  
Parameter  
Symbol  
Conditions  
Min.  
Typ.  
Max.  
Unit  
Supply voltage for LCD  
Input voltage  
Ta =25k  
-
4.7  
-
4.6  
5.0  
2
-
V
V
DD-V  
0
V
5.5  
3.0  
1.0  
VDD  
0.6  
-
DD  
Supply current  
Ta=25k, VDD=5.0V  
mA  
uA  
I
DD  
Input leakage current  
“H” level input voltage  
“L” level input voltage  
“H” level output voltage  
“L” level output voltage  
Backlight supply voltage  
Backlight supply current  
-
-
-
-
-
I
LKG  
2.2  
0
2.4  
-
-
-
V
V
V
V
V
IH  
IL  
Twice initial value or less  
LOH=-0.25mA  
LOH=1.6mA  
V
OH  
OL  
F
-
0.4  
4.2  
20  
mA  
-
I
F
V
F= 4.2V  
6
10.Timing Characteristics  
Write cycle (Ta=25k, VDD=5.0V)  
Parameter  
Enable cycle time  
Enable pulse width  
Enable rise/fall time  
RS; R/W setup time  
Symbol  
Test pin  
Min.  
500  
300  
-
Typ.  
Max.  
Unit  
-
-
-
-
-
-
tc  
E
tw  
25  
-
tr, tf  
tsu1  
100  
ns  
RS; R/W  
RS; R/W  
RS; R/W address hold  
10  
-
-
th1  
time  
Read data output delay  
Read data hold time  
60  
10  
-
-
-
-
tsu2  
th2  
DB0~DB7  
Write mode timing diagram  
VIH1  
VIL1  
th1  
th1  
tsu1  
VIL1  
VIL1  
tw  
VIH1  
tf  
VIH1  
VIL1  
VIL1  
VIL1  
tr  
tsu2  
th2  
VIH1  
VIL1  
VIH1  
VIL1  
VALID DATA  
tc  
7
Read cycle (Ta=25k, VDD=5.0V)  
Parameter  
Enable cycle time  
Enable pulse width  
Enable rise/fall time  
RS; R/W setup time  
Symbol  
Test pin  
Min.  
500  
300  
-
Typ.  
Max.  
Unit  
-
-
-
-
-
-
tc  
tw  
E
25  
-
tr, tf  
tsu  
100  
ns  
RS; R/W  
RS; R/W  
RS; R/W address hold  
10  
-
-
th  
time  
Read data output delay  
Read data hold time  
60  
20  
-
-
90  
-
td  
tdh  
DB0~DB7  
Read mode timing diagram  
VIH1  
VIL1  
th  
tsu  
VIL1  
VIL1  
th  
tf  
tw  
VIH1  
VIL1  
VIH1  
VIL1  
VIL1  
tr  
tdh  
td  
VIH1  
VIL1  
VIH1  
VIL1  
VALID DATA  
tc  
8
11.Instruction description  
11.1Outline  
To overcome the speed difference between the internal clock of KS0066U and the MPU clock, KS0066U  
performs internal operations by storing control in formations to IR or DR. The internal operation is determined  
according to the signal from MPU, composed of read/write and data bus (Refer to Table7).  
Instructions can be divided largely into four groups:  
1) KS0066U function set instructions (set display methods, set data length, etc.)  
2) Address set instructions to internal RAM  
3) Data transfer instructions with internal RAM  
4) Others  
The address of the internal RAM is automatically increased or decreased by 1.  
Note: during internal operation, busy flag (DB7) is read “High”.  
Busy flag check must be preceded by the next instruction.  
11.2 Instruction Table  
Instruction code  
DB  
Execution  
time (fosc=  
270 KHZ  
Instruction  
Description  
DB  
1
RS R/W DB7 DB6  
DB4 DB3 DB2  
DB0  
5
Write “20H” to DDRA and set  
DDRAM address to “00H” from  
AC  
Set DDRAM address to “00H”  
From AC and return cursor to  
Its original position if shifted.  
The contents of DDRAM are  
not changed.  
Clear  
1.53ms  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
Display  
Return  
Home  
1.53ms  
39us  
0
1
-
Assign cursor moving direction  
And blinking of entire display  
Entry mode  
Set  
Display ON/  
OFF control  
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
I/D SH  
Set display (D), cursor (C), and  
Blinking of cursor (B) on/off  
Control bit.  
Set cursor moving and display  
Shift control bit, and the  
Direction, without changing of  
DDRAM data.  
Set interface data length (DL:  
8-  
D
C
-
B
-
Cursor or  
39us  
39us  
0
0
0
0
0
0
0
0
1
1
S/C R/L  
Display shift  
Function  
set  
Bit/4-bit), numbers of display  
Line (N: =2-line/1-line) and,  
Display font type (F: 5x11/5x8)  
Set CGRAM address in  
address  
0
1
DL  
N
F
-
-
Set  
39us  
39us  
CGRAM  
Address  
Set  
0
0
0
0
0
1
AC5 AC4 AC3 AC2 AC1 AC0  
Counter.  
Set DDRAM address in  
address  
Counter.  
DDRAM  
Address  
AC6 AC5 AC4 AC3 AC2 AC1 AC0  
Whether during internal  
Operation or not can be known  
By reading BF. The contents of  
Address counter can also be  
read.  
Read busy  
Flag and  
Address  
0us  
0
1
BF AC6 AC5 AC4 AC3 AC2 AC1 AC0  
Write data into internal RAM  
(DDRAM/CGRAM).  
Write data  
to  
Address  
Read data  
From RAM  
43us  
43us  
1
1
0
1
D7 D6 D5 D4 D3 D2 D1 D0  
D7 D6 D5 D4 D3 D2 D1 D0  
Read data from internal RAM  
(DDRAM/CGRAM).  
NOTE:  
When an MPU program with checking the busy flag (DB7) is made, it must be necessary 1/2fosc is  
necessary for executing the next instruction by the falling edge of the “E” signal after the busy flag (DB7) goes  
to “Low”.  
9
11.3Contents  
1) Clear display  
RS  
0
R/W  
0
DB7  
0
DB6  
0
DB5  
0
DB4  
0
DB3  
0
DB2  
0
DB1  
0
DB0  
1
Clear all the display data by writing “20H” (space code) to all DDRAM address, and set DDRAM address  
to “00H” into AC (address counter).  
Return cursor to the original status, namely, bring the cursor to the left edge on the fist line of the display.  
Make the entry mode increment (I/D=“High”).  
2) Return home  
RS  
0
R/W  
0
DB7  
0
DB6  
0
DB5  
0
DB4  
0
DB3  
0
DB2  
0
DB1  
1
DB0  
-
Return home is cursor return home instruction.  
Set DDRAM address to “00H” into the address counter.  
Return cursor to its original site and return display to its original status, if shifted.  
Contents of DDRAM does not change.  
3) Entry mode set  
RS  
0
R/W  
0
DB7  
0
DB6  
0
DB5  
0
DB4  
0
DB3  
0
DB2  
1
DB1  
I/D  
DB0  
SH  
Set the moving direction of cursor and display.  
I/D: increment / decrement of DDRAM address (cursor or blink)  
When I/D=“high”, cursor/blink moves to right and DDRAM address is increased by 1.  
When I/D=“Low”, cursor/blink moves to left and DDRAM address is increased by 1.  
*CGRAM operates the same way as DDRAM, when reading from or writing to CGRAM.  
SH: shift of entire display  
When DDRAM read (CGRAM read/write) operation or SH=“Low”, shifting of entire display is not performed. If  
SH =“High” and DDRAM write operation, shift of entire display is performed according to I/D value. (I/D=“high”.  
shift left, I/D=“Low”. Shift right).  
4) Display ON/OFF control  
RS  
0
R/W  
0
DB7  
0
DB6  
0
DB5  
0
DB4  
0
DB3  
1
DB2  
D
DB1  
C
DB0  
B
Control display/cursor/blink ON/OFF 1 bit register.  
D: Display ON/OFF control bit  
When D=“High”, entire display is turned on.  
When D=“Low”, display is turned off, but display data remains in DDRAM.  
C: cursor ON/OFF control bit  
When D=“High”, cursor is turned on.  
When D=“Low”, cursor is disappeared in current display, but I/D register preserves its data.  
B: Cursor blink ON/OFF control bit  
When B=“High”, cursor blink is on, which performs alternately between all the “High” data and display  
characters at the cursor position.  
When B=“Low”, blink is off.  
5) Cursor or display shift  
RS  
0
R/W  
0
DB7  
0
DB6  
0
DB5  
0
DB4  
1
DB3  
S/C  
DB2  
R/L  
DB1  
-
DB0  
-
Shifting of right/left cursor position or display without writing or reading of display data.  
This instruction is used to correct or search display data.  
During 2-line mode display, cursor moves to the 2nd line after the 40th digit of the 1st line.  
Note that display shift is performed simultaneously in all the lines.  
10  
When display data is shifted repeatedly, each line is shifted individually.  
When display shift is performed, the contents of the address counter are not changed.  
Shift patterns according to S/C and R/L bits  
S/C  
0
R/L  
0
Operation  
Shift cursor to the left, AC is decreased by 1  
0
1
Shift cursor to the right, AC is increased by 1  
Shift all the display to the left, cursor moves according to the display  
Shift all the display to the right, cursor moves according to the display  
1
1
0
1
6) Function set  
RS  
0
R/W  
0
DB7  
0
DB6  
0
DB5  
1
DB4  
DL  
DB3  
N
DB2  
F
DB1  
-
DB0  
-
DL: Interface data length control bit  
When DL=“High”, it means 8-bit bus mode with MPU.  
When DL=“Low”, it means 4-bit bus mode with MPU. Hence, DL is a signal to select 8-bit or 4-bit bus mode.  
When 4-but bus mode, it needs to transfer 4-bit data twice.  
N: Display line number control bit  
When N=“Low”, 1-line display mode is set.  
When N=“High”, 2-line display mode is set.  
F: Display line number control bit  
When F=“Low”, 5x8 dots format display mode is set.  
When F=“High”, 5x11 dots format display mode.  
7) Set CGRAM address  
RS  
0
R/W  
0
DB7  
0
DB6  
1
DB5  
AC5  
DB4  
AC4  
DB3  
AC3  
DB2  
AC2  
DB1  
AC1  
DB0  
AC0  
Set CGRAM address to AC.  
The instruction makes CGRAM data available from MPU.  
8) Set DDRAM address  
RS  
0
R/W  
0
DB7  
1
DB6  
AC6  
DB5  
AC5  
DB4  
AC4  
DB3  
AC3  
DB2  
AC2  
DB1  
AC1  
DB0  
AC0  
Set DDRAM address to AC.  
This instruction makes DDRAM data available form MPU.  
When 1-line display mode (N=LOW), DDRAM address is form “00H” to “4FH”.In 2-line display mode (N=High),  
DDRAM address in the 1st line form “00H” to “27H”, and DDRAM address in the 2nd line is from “40H” to  
“67H”.  
9) Read busy flag & address  
RS  
0
R/W  
1
DB7  
BF  
DB6  
AC6  
DB5  
AC5  
DB4  
AC4  
DB3  
AC3  
DB2  
AC2  
DB1  
AC1  
DB0  
AC0  
This instruction shows whether KS0066U is in internal operation or not.  
If the resultant BF is “High”, internal operation is in progress and should wait BF is to be LOW, which by then  
the nest instruction can be performed. In this instruction you can also read the value of the address counter.  
10) Write data to RAM  
RS  
1
R/W  
0
DB7  
D7  
DB6  
D6  
DB5  
D5  
DB4  
D4  
DB3  
D3  
DB2  
D2  
DB1  
D1  
DB0  
D0  
Write binary 8-bit data to DDRAM/CGRAM.  
11  
The selection of RAM from DDRAM, and CGRAM, is set by the previous address set instruction (DDRAM  
address set, CGRAM address set).  
RAM set instruction can also determine the AC direction to RAM.  
After write operation. The address is automatically increased/decreased by 1, according to the entry mode.  
11) Read data from RAM  
RS  
1
R/W  
1
DB7  
D7  
DB6  
D6  
DB5  
D5  
DB4  
D4  
DB3  
D3  
DB2  
D2  
DB1  
D1  
DB0  
D0  
Read binary 8-bit data from DDRAM/CGRAM.  
The selection of RAM is set by the previous address set instruction. If the address set instruction of RAM  
is not performed before this instruction, the data that has been read first is invalid, as the direction of AC is not  
yet determined. If RAM data is read several times without RAM address instructions set before, read operation,  
the correct RAM data can be obtained from the second. But the first data would be incorrect, as there is no  
time margin to transfer RAM data.  
In case of DDRAM read operation, cursor shift instruction plays the same role as DDRAM address set  
instruction, it also transfers RAM data to output data register.  
After read operation, address counter is automatically increased/decreased by 1 according to the entry  
mode.  
After CGRAM read operation, display shift may not be executed correctly.  
NOTE: In case of RAM write operation, AC is increased/decreased by 1 as in read operation.  
At this time, AC indicates next address position, but only the previous data can be read by the read  
instruction.  
12.Display character address code:  
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19 20  
00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 10 11 12 13  
40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F 50 51 52 53  
12  
13.Standard character pattern  
13  
14.QUALITY SPECIFICATIONS  
14.1 Standard of the product appearance test  
Manner of appearance test: The inspection should be performed in using 20W x 2 fluorescent lamps.  
Distance between LCM and fluorescent lamps should be 100 cm or more. Distance between LCM and  
inspector eyes should be 30 cm or more.  
Viewing direction for inspection is 45° from vertical against LCM.  
Fluorescent  
Lamps  
30cm  
min  
100cm min  
o
o
45  
45  
LCD  
LCM  
Definition of zone:  
A Zone  
B Zone  
A Zone: Active display area (minimum viewing area).  
B Zone: Non-active display area (outside viewing area).  
14  
14.2 Specification of quality assurance  
AQL inspection standard  
Sampling method: MIL-STD-105E, Level II, single sampling  
Defect classification (Note: * is not including)  
Classify  
Major  
Item  
Note  
1
AQL  
0.65  
Display state  
Short or open circuit  
LC leakage  
Flickering  
No display  
Wrong viewing direction  
Contrast defect (dim, ghost)  
Back-light  
2
1,8  
10  
11  
2
Non-display  
Flat cable or pin reverse  
Wrong or missing component  
Background color deviation  
Black spot and dust  
Line defect, Scratch  
Rainbow  
Minor  
Display  
state  
1.0  
3
4
5
Chip  
6
Pin hole  
7
Protruded  
12  
3
Polarizer  
Soldering  
Wire  
Bubble and foreign material  
Poor connection  
Poor connection  
Position, Bonding strength  
9
10  
13  
TAB  
15  
Note on defect classification  
No.  
1
Item  
Criterion  
Not allow  
Short or open circuit  
LC leakage  
Flickering  
No display  
Wrong viewing direction  
Wrong Back-light  
Contrast defect  
2
3
Refer to approval sample  
Background  
deviation  
color  
Point defect,  
Black spot, dust  
(including Polarizer)  
Point  
Size  
Accpetable Qty.  
Y
X
Disregard  
φ<0.10  
3
2
1
0.10‚0.20  
0.20‚0.25  
0.25‚0.30  
φ>0.30  
φ = (X+Y)/2  
0
Unitmm  
Line defect,  
Scratch  
4
W
Line  
Acceptable Qty.  
L
W
---  
Disregard  
2
0.015ƒW  
L
3.0ƒL 0.03ƒW  
2.0ƒL 0.05ƒW  
1
1.0ƒL  
0.1W  
0.05<W  
---  
Applied as point defect  
Unit: mm  
Not more than two color changes across the viewing area.  
5
Rainbow  
16  
No  
6
Item  
Criterion  
Chip  
Acceptable criterion  
X
X
Y
Z
Y
Remark:  
0.5mm  
‚2  
‚9/2  
X: Length  
direction  
t
Z
Y: Short  
direction  
Z: Thickness  
direction  
Acceptable criterion  
X
t: Glass  
thickness  
Y
X
Y
0.5mm  
Z
‚2  
‚9  
W: Terminal  
Width  
Z
Acceptable criterion  
X
Y
Z
‚3  
‚2  
‚9  
shall not reach to ITO  
Y
X
Acceptable criterion  
W
Y
X
Y
Z
Disregard  
‚0.2  
‚9  
Z
X
Acceptable criterion  
Y
X
Y
Z
‚ꢁ  
‚ꢂ  
‚t/3  
Z
X
17  
No.  
7
Item  
Criterion  
Segment  
pattern  
(1) Pin hole  
φ < 0.10mm is acceptable.  
W = Segment width  
φ = (X+Y)/2  
X
X
Point Size  
φ‚ꢃꢄꢅW  
Acceptable Qty  
Disregard  
Y
Y
1
0
ꢃꢄꢅW< φ‚ꢃꢄꢂW  
φꢀꢃꢄꢂW  
W
Unit: mm  
8
9
Back-light  
Soldering  
(1) The color of backlight should correspond its  
specification.  
(2) Not allow flickering  
(1) Not allow heavy dirty and solder ball on PCB.  
(The size of dirty refer to point and dust defect)  
(2) Over 50% of lead should be solderedon Land.  
Lead  
Land  
50% lead  
10 Wire  
(1) Copper wire should not be rusted  
(2) Not allow crack on copper wire connection.  
(3) Not allow reversing the position of the flat cable.  
(4) Not allow exposed copper wire inside the flat cable.  
(1) Not allow screw rust or damage.  
11* PCB  
(2) Not allow missing or wrong putting of component.  
18  
No  
12  
Item  
Criterion  
Protruded  
W: Terminal Width  
Acceptable criteria:  
W
Y 0.4  
Y
X
13  
TAB  
1. Position  
W
W1  
ITO  
W1‚1/3W  
H1‚1/3H  
H
H1  
TAB  
2
TAB bonding strength test  
F
TAB  
P (=F/TAB bonding width) ƒ650gf/cm ,(speed rate: 1mm/min)  
5pcs per SOA (shipment)  
14  
Total no. of acceptable  
Defect  
A. Zone  
Maximum 2 minor non-conformities per one unit.  
Defect distance: each point to be separated over 10mm  
B. Zone  
It is acceptable when it is no trouble for quality and assembly  
in customer’s end product.  
19  

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