BF512-T

更新时间:2025-05-13 18:58:05
品牌:NXP
描述:TRANSISTOR VHF BAND, Si, N-CHANNEL, RF SMALL SIGNAL, JFET, FET RF Small Signal

BF512-T 概述

TRANSISTOR VHF BAND, Si, N-CHANNEL, RF SMALL SIGNAL, JFET, FET RF Small Signal 射频小信号场效应晶体管

BF512-T 规格参数

生命周期:Obsolete包装说明:SMALL OUTLINE, R-PDSO-G3
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.21.00.95风险等级:5.76
其他特性:LOW NOISE配置:SINGLE
最小漏源击穿电压:20 V最大漏极电流 (ID):0.03 A
FET 技术:JUNCTION最大反馈电容 (Crss):0.4 pF
最高频带:VERY HIGH FREQUENCY BANDJESD-30 代码:R-PDSO-G3
元件数量:1端子数量:3
工作模式:DEPLETION MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性/信道类型:N-CHANNEL
认证状态:Not Qualified表面贴装:YES
端子形式:GULL WING端子位置:DUAL
晶体管应用:AMPLIFIER晶体管元件材料:SILICON
Base Number Matches:1

BF512-T 数据手册

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DISCRETE SEMICONDUCTORS  
DATA SHEET  
BF510 to 513  
N-channel silicon field-effect  
transistors  
December 1997  
Product specification  
File under Discrete Semiconductors, SC07  
Philips Semiconductors  
Product specification  
N-channel silicon field-effect transistors  
BF510 to 513  
DESCRIPTION  
MARKING CODE  
Asymmetrical N-channel planar  
epitaxial junction field-effect  
BF510 = S6p  
BF511 = S7p  
BF512 = S8p  
BF513 = S9p  
transistors in the miniature plastic  
envelope intended for applications up  
to the v.h.f. range in hybrid thick and  
thin-film circuits. Special features are  
the low feedback capacitance and the  
low noise figure. These features  
make the product very suitable for  
applications such as the r.f. stages in  
f.m. portables (BF510), car radios  
(BF511) and mains radios (BF512) or  
the mixer stage (BF513).  
3
handbook, halfpage  
d
s
g
PINNING - SOT23  
1
2
1
2
3
= gate  
Top view  
MAM385  
= drain  
= source  
Fig.1 Simplified outline and symbol.  
QUICK REFERENCE DATA  
Drain-source voltage  
VDS  
ID  
max.  
max.  
20  
30  
V
Drain current (DC or average)  
Total power dissipation  
up to Tamb = 40 °C  
mA  
Ptot  
IDSS  
yfs  
max.  
250  
mW  
BF510  
0.7  
511  
512  
6
513  
Drain current  
>
<
2.5  
7.0  
10 mA  
18 mA  
VDS = 10 V; VGS = 0  
3.0  
12  
Transfer admittance (common source)  
VDS = 10 V; VGS = 0; f = 1 kHz  
>
2.5  
4
6
7 mS  
Feedback capacitance  
V
DS = 10 V; VGS = 0  
Crs  
Crs  
typ.  
typ.  
0.3  
0.3  
pF  
VDS = 10 V; ID = 5 mA  
0.3  
0.3 pF  
Noise figure at optimum source admittance  
GS = 1 mS; BS = 3 mS; f = 100 MHz  
VDS = 10 V; VGS = 0  
F
F
typ.  
typ.  
1.5  
1.5  
dB  
V
DS = 10 V; ID = 5 mA  
1.5  
1.5 dB  
December 1997  
2
Philips Semiconductors  
Product specification  
N-channel silicon field-effect transistors  
BF510 to 513  
RATINGS  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
Drain-source voltage  
VDS  
VDGO  
ID  
max.  
20 V  
20 V  
Drain-gate voltage (open source)  
Drain current (DC or average)  
Gate current  
max.  
max.  
max.  
max.  
30 mA  
10 mA  
250 mW  
± IG  
Ptot  
Tstg  
Tj  
Total power dissipation up to Tamb = 40 °C (note 1)  
Storage temperature range  
Junction temperature  
65 to + 150 °C  
max.  
150 °C  
THERMAL RESISTANCE  
From junction to ambient (note 1)  
Rth j-a  
=
430 K/W  
Note  
1. Mounted on a ceramic substrate of 8 mm × 10 mm × 0.7 mm.  
STATIC CHARACTERISTICS  
Tamb = 25 °C  
BF510  
511  
512  
513  
Gate cut-off current  
VGS = 0.2 V; VDS = 0  
Gate-drain breakdown voltage  
IS = 0; ID = 10 µA  
IGSS  
<
>
10  
20  
10  
20  
10  
20  
10 nA  
20 V  
V(BR)GDO  
Drain current  
>
<
0.7  
3.0  
2.5  
7.0  
6
12  
10 mA  
18 mA  
VDS = 10 V; VGS = 0  
IDSS  
Gate-source cut-off voltage  
ID = 10 µA; VDS = 10 V  
V(P)GS  
typ.  
0.8  
1.5  
2.2  
3 V  
December 1997  
3
Philips Semiconductors  
Product specification  
N-channel silicon field-effect transistors  
BF510 to 513  
DYNAMIC CHARACTERISTICS  
Measuring conditions (common source):  
VDS = 10 V; VGS = 0; Tamb = 25 °C for BF510 and BF511  
VDS = 10 V; ID = 5 mA; Tamb = 25 °C for BF512 and BF513  
y-parameters (common source)  
Input capacitance at f = 1 MHz  
Input conductance at f = 100 MHz  
BF510  
5
511  
5
512  
5
513  
5 pF  
Cis  
gis  
<
typ.  
typ.  
<
100  
0.4  
0.5  
2.5  
90  
0.4  
0.5  
4.0  
60  
50 µS  
0.4 pF  
0.5 pF  
3.5 mS  
7.0 mS  
5.0 mS  
3 pF  
0.4  
0.5  
4.0  
6.0  
5.0  
3
Feedback capacitance at f = 1 MHz  
Transfer admittance at f = 1 kHz  
Crs  
yfs  
>
VGS = 0 instead of ID = 5 mA  
yfs  
yfs  
>
Transfer admittance at f = 100 MHz  
Output capacitance at f = 1 MHz  
Output conductance at f = 1 MHz  
Output conductance at f = 100 MHz  
typ.  
<
3.5  
3
5.5  
3
Cos  
gos  
gos  
<
60  
80  
55  
100  
70  
120 µS  
90 µS  
typ.  
35  
Noise figure at optimum source admittance  
GS = 1 mS; BS = 3 mS;  
f = 100 MHz  
F
typ.  
1.5  
1.5  
1.5  
1.5 dB  
MDA275  
MDA276  
1.5  
10  
handbook, halfpage  
handbook, halfpage  
|y  
|
fs  
BF513  
C
rs  
(mS)  
(pF)  
8
BF512  
BF511  
1
6
4
2
0
BF510  
0.5  
typ  
0
0
4
8
12  
16  
V
20  
(V)  
0
5
10  
15  
I
(mA)  
D
DS  
Fig.2 VGS = 0 for BF510 and BF511;  
ID = 5 mA for BF512 and BF513;  
f = 1 MHz; Tamb = 25 °C.  
Fig.3 VDS = 10 V; f = 1 kHz; Tamb = 25 °C; typical  
values.  
December 1997  
4
Philips Semiconductors  
Product specification  
N-channel silicon field-effect transistors  
BF510 to 513  
MDA245  
300  
handbook, halfpage  
P
tot  
(mW)  
200  
100  
0
0
40  
80  
120  
160  
T
200  
(°C)  
amb  
Fig.4 Power derating curve.  
December 1997  
5
Philips Semiconductors  
Product specification  
N-channel silicon field-effect transistors  
BF510 to 513  
PACKAGE OUTLINE  
Plastic surface mounted package; 3 leads  
SOT23  
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
c
1
2
e
1
b
p
w M  
B
L
p
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
UNIT  
b
c
D
E
e
e
H
L
Q
v
w
A
p
p
1
E
max.  
1.1  
0.9  
0.48  
0.38  
0.15  
0.09  
3.0  
2.8  
1.4  
1.2  
2.5  
2.1  
0.45  
0.15  
0.55  
0.45  
mm  
0.1  
1.9  
0.95  
0.2  
0.1  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
97-02-28  
SOT23  
December 1997  
6
Philips Semiconductors  
Product specification  
N-channel silicon field-effect transistors  
BF510 to 513  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
Short-form specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
The data in this specification is extracted from a full data sheet with the same type  
number and title. For detailed information see the relevant data sheet or data handbook.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
December 1997  
7

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