BU2727AF

更新时间:2025-06-10 02:14:47
品牌:NXP
描述:Silicon Diffused Power Transistor

BU2727AF 概述

Silicon Diffused Power Transistor 硅扩散型功率晶体管

BU2727AF 数据手册

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Philips Semiconductors  
Product specification  
Silicon Diffused Power Transistor  
BU2727AF  
GENERAL DESCRIPTION  
High voltage, high-speed switching npn transistor in a plastic full-pack envelope intended for use in horizontal  
deflection circuits of high resolution monitors. Designed to withstand VCES pulses up to 1700V.  
QUICK REFERENCE DATA  
SYMBOL PARAMETER  
CONDITIONS  
TYP. MAX. UNIT  
VCESM  
VCEO  
IC  
Collector-emitter voltage peak value  
VBE = 0 V  
-
1700  
825  
12  
V
V
Collector-emitter voltage (open base)  
Collector current (DC)  
-
-
-
A
ICM  
Collector current peak value  
Total power dissipation  
Collector-emitter saturation voltage  
Collector saturation current  
Storage time  
30  
A
Ptot  
Ths 25 ˚C  
-
45  
W
V
VCEsat  
ICsat  
ts  
IC = 5.0 A; IB = 0.91 A  
f = 64 kHz  
-
1.0  
-
5.0  
2.5  
A
ICsat = 5.0 A; f = 64 kHz  
3.0  
µs  
PINNING - SOT199  
PIN CONFIGURATION  
SYMBOL  
PIN  
1
DESCRIPTION  
c
case  
base  
2
collector  
emitter  
b
3
case isolated  
1
2
3
e
LIMITING VALUES  
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)  
SYMBOL PARAMETER  
CONDITIONS  
MIN. MAX. UNIT  
VCESM  
VCEO  
IC  
Collector-emitter voltage peak value  
VBE = 0 V  
-
1700  
825  
12  
V
V
Collector-emitter voltage (open base)  
Collector current (DC)  
-
-
A
ICM  
Collector current peak value  
Base current (DC)  
-
30  
A
IB  
IBM  
-IB(AV)  
-IBM  
Ptot  
Tstg  
Tj  
-
12  
25  
A
Base current peak value  
Reverse base current  
-
A
average over any 20 ms period  
-
200  
25  
mA  
A
Reverse base current peak value 1  
Total power dissipation  
Storage temperature  
-
-
Ths 25 ˚C  
45  
W
˚C  
˚C  
-65  
-
150  
150  
Junction temperature  
ESD LIMITING VALUES  
SYMBOL PARAMETER  
CONDITIONS  
MIN. MAX. UNIT  
VC  
Electrostatic discharge capacitor voltage Human body model (250 pF,  
-
10  
kV  
1.5 k)  
1 Turn-off current.  
September 1997  
1
Rev 1.100  
Philips Semiconductors  
Product specification  
Silicon Diffused Power Transistor  
BU2727AF  
THERMAL RESISTANCES  
SYMBOL PARAMETER  
CONDITIONS  
TYP. MAX. UNIT  
Rth j-hs  
Rth j-hs  
Rth j-a  
Junction to heatsink  
Junction to heatsink  
Junction to ambient  
without heatsink compound  
with heatsink compound  
in free air  
-
-
3.7  
2.8  
-
K/W  
K/W  
K/W  
35  
ISOLATION LIMITING VALUE & CHARACTERISTIC  
Ths = 25 ˚C unless otherwise specified  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
Visol  
Cisol  
Repetitive peak voltage from all R.H. 65 % ; clean and dustfree  
-
2500  
V
three terminals to external  
heatsink  
Capacitance from T2 to external f = 1 MHz  
heatsink  
-
22  
-
pF  
STATIC CHARACTERISTICS  
Ths = 25 ˚C unless otherwise specified  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
ICES  
ICES  
Collector cut-off current 2  
VBE = 0 V; VCE = VCESMmax  
VBE = 0 V; VCE = VCESMmax  
Tj = 125 ˚C  
-
-
-
-
1.0  
2.0  
mA  
mA  
;
IEBO  
BVEBO  
VCEOsust  
Emitter cut-off current  
Emitter-base breakdown voltage  
VEB = 7.5 V; IC = 0 A  
IB = 1 mA  
-
-
13.5  
-
1.0  
-
-
mA  
V
V
7.5  
825  
Collector-emitter sustaining voltage IB = 0 A; IC = 100 mA;  
L = 25 mH  
VCEsat  
VBEsat  
hFE  
Collector-emitter saturation voltage IC = 5.0 A; IB = 0.91 A  
-
-
-
-
-
22  
8
1.0  
1.0  
-
V
V
Base-emitter saturation voltage  
DC current gain  
IC = 5.0 A; IB = 0.91 A  
IC = 0.1 A; VCE = 5 V  
IC = 5 A; VCE = 1 V  
hFE  
5.5  
11  
DYNAMIC CHARACTERISTICS  
Ths = 25 ˚C unless otherwise specified  
SYMBOL PARAMETER  
CONDITIONS  
TYP. MAX. UNIT  
Switching times (64 kHz line  
deflection circuit)  
ICsat = 5.0 A; LC = 260 µH;  
Cfb = 4.8 nF; VCC = 180 V;  
IB(end) = 0.9 A; LB = 0.6 µH; -VBB = 2 V;  
(-dIB/dt = 3.33 A/µs)  
ts  
tf  
Turn-off storage time  
Turn-off fall time  
2.5  
0.30  
3.0  
0.39  
µs  
µs  
2 Measured with half sine-wave voltage (curve tracer).  
September 1997  
2
Rev 1.100  
Philips Semiconductors  
Product specification  
Silicon Diffused Power Transistor  
BU2727AF  
ICsat  
90 %  
+ 50v  
100-200R  
IC  
IB  
10 %  
Horizontal  
tf  
t
Oscilloscope  
ts  
IBend  
Vertical  
1R  
t
100R  
6V  
30-60 Hz  
- IBM  
Fig.1. Test circuit for VCEOsust  
.
Fig.4. Switching times definitions.  
IC / mA  
+ 150 v nominal  
adjust for ICsat  
Lc  
250  
200  
LB  
T.U.T.  
IBend  
-VBB  
100  
0
Cfb  
min  
VCE / V  
VCEOsust  
Fig.2. Oscilloscope display for VCEOsust  
.
Fig.5. Switching times test circuit.  
ICsat  
hFE  
TRANSISTOR  
100  
I
C
B
VCE = 5 V  
DIODE  
Ths = 25 C  
Ths = 85 C  
t
t
I
I
end  
B
10  
5 us  
6.5 us  
16 us  
V
CE  
1
0.01  
0.1  
1
10  
100  
t
IC / A  
Fig.3. Switching times waveforms (64 kHz).  
Fig.6. DC current gain. hFE = f (IC)  
Parameter Ths  
(Low and high gain)  
September 1997  
3
Rev 1.100  
Philips Semiconductors  
Product specification  
Silicon Diffused Power Transistor  
BU2727AF  
Normalised Power Derating  
with heatsink compound  
hFE  
PD%  
120  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
100  
10  
1
VCE = 1 V  
Ths = 25 C  
Ths = 85 C  
0
20  
40  
60  
80  
Ths /  
100  
120  
140  
0.01  
0.1  
1
10  
100  
C
IC / A  
Fig.7. DC current gain. hFE = f (IC)  
Parameter Ths  
Fig.10. Normalised power dissipation.  
PD% = 100 PD/PD 25˚C = f (Ths)  
(Low and high gain)  
Zth / (K/W)  
0.5  
VCEsat / V  
10  
10  
1
Ths = 85 C  
Ths = 25 C  
1
0.1  
0.2  
0.1  
0.05  
0.02  
IC/IB = 12  
t
T
p
IC/IB = 5  
t
p
P
D =  
D
0.1  
0.01  
0.01  
0.001  
t
D = 0  
T
1E-06  
1E-04  
1E-02  
t / s  
1E+00  
0.1  
1
10  
100  
IC / A  
Fig.11. Transient thermal impedance.  
Fig.8. Typical collector-emitter saturation voltage.  
Z
th j-hs = f(t); parameter D = tp/T  
V
CEsat = f (IC); parameter IC/IB  
VCC  
VBEsat / V  
1
0.9  
0.8  
0.7  
0.6  
IC = 6 A  
LC  
VCL  
IBend  
-VBB  
LB  
CFB  
T.U.T.  
4 A  
Ths = 85 C  
Ths = 25 C  
Fig.12. Test Circuit RBSOA.  
VCC = 150 V; -VBB = 1 - 4 V;  
0
1
2
3
4
IB / A  
Fig.9. Typical base-emitter saturation voltage.  
VBEsat = f (IB); parameter IC  
LC = 1 mH; VCL = 1500 V; LB = 0.5 - 2 µH;  
CFB = 1 - 3 nF; IB(end) = 0.8 - 4 A  
September 1997  
4
Rev 1.100  
Philips Semiconductors  
Product specification  
Silicon Diffused Power Transistor  
BU2727AF  
IC / A  
35  
30  
25  
20  
15  
10  
5
Area where  
fails occur  
0
100  
1000  
1700  
VCE / V  
Fig.13. Reverse bias safe operating area. Tj Tjmax  
September 1997  
5
Rev 1.100  
Philips Semiconductors  
Product specification  
Silicon Diffused Power Transistor  
BU2727AF  
MECHANICAL DATA  
Dimensions in mm  
15.3 max  
5.2 max  
Net Mass: 5.5 g  
3.1  
3.3  
0.7  
7.3  
3.2  
o
45  
6.2  
5.8  
21.5  
max  
seating  
plane  
3.5 max  
not tinned  
3.5  
15.7  
min  
1
2
3
1.2  
1.0  
0.7 max  
2.0  
2.1 max  
M
0.4  
5.45  
5.45  
Fig.14. SOT199; The seating plane is electrically isolated from all terminals.  
Notes  
1. Refer to mounting instructions for F-pack envelopes.  
2. Epoxy meets UL94 V0 at 1/8".  
September 1997  
6
Rev 1.100  
Philips Semiconductors  
Product specification  
Silicon Diffused Power Transistor  
BU2727AF  
DEFINITIONS  
Data sheet status  
Objective specification  
This data sheet contains target or goal specifications for product development.  
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.  
Product specification  
This data sheet contains final product specifications.  
Limiting values  
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one  
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and  
operation of the device at these or at any other conditions above those given in the Characteristics sections of  
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
Philips Electronics N.V. 1997  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the  
copyright owner.  
The information presented in this document does not form part of any quotation or contract, it is believed to be  
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any  
consequence of its use. Publication thereof does not convey nor imply any license under patent or other  
industrial or intellectual property rights.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices or systems where malfunction of these  
products can be reasonably expected to result in personal injury. Philips customers using or selling these products  
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting  
from such improper use or sale.  
September 1997  
7
Rev 1.100  

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