New
Subminiature Surface-Mount Package
SSS Mini 2-Pin Package Series
n Overview
The Subminiature Surface-Mount Package Series with 1.0 mm x 0.6 mm x 0.52 mm in external size allows high-
density mounting. In addition, the flat-lead structure of the package ensures stable mounting quality with less
mounting effort.
n Feature
l Allowing high-density mounting.
l Flat-lead structure supporting high-speed mounting.
n Applications
l Cellular phones, personal handy-phone system (PHS) sets, and VCO, VCXO, TCXO, and antenna switches for
cordless telephones
l A variety of portable products
n Package
PIN diode
Variable capacitance diode
+0.05
–0.02
0.12
+0.05
+0.10
0.16
Ð0.06
0.27
Ð0.02
0.60 0.05
K
1
2
0.60±0.05
A
+0.05
–0.02
0.27
5û
5˚
n Recommended Mounting Dimensions
n Packing Specification
1.3
10,000pcs
(4-mm pitch)
SSS Mini 2-Pin Package
0.3
0.3
The products and specification are subject to change without any notice. Please ask for the latest Product Standards to guarantee the satisfaction of your product requirements.
1.Kotari Yakemachi, Nagaokakyo, Kyoto, 617-8520 Japan
Tel. (075)951-8151
http://www.mec.panasonic.co.jp
M00429AE
New publication, effective from Sep.1 2000.