CR05AS-8_05

更新时间:2025-01-11 08:21:26
品牌:RENESAS
描述:Thyristor Low Power Use

CR05AS-8_05 概述

Thyristor Low Power Use 晶闸管的低功耗应用

CR05AS-8_05 数据手册

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CR05AS-8  
Thyristor  
Low Power Use  
REJ03G0543-0100  
Rev.1.00  
Mar.01.2005  
Features  
IT (AV) : 0.5 A  
VDRM : 400 V  
Non-Insulated Type  
Planar Passivation Type  
I
GT : 100 µA  
Outline  
PLZZ0004CA-A  
(Package name: UPAK)  
2, 4  
3
1. Cathode  
2
1
2. Anode  
3. Gate  
3
4. Anode  
4
1
Applications  
Solid state relay, strobe flasher, igniter, and hybrid IC  
Maximum Ratings  
Voltage class  
Parameter  
Symbol  
Unit  
8 (Mark CD)  
400  
Repetitive peak reverse voltage  
Non-repetitive peak reverse voltage  
DC reverse voltage  
Repetitive peak off-state voltageNote1  
DC off-state voltageNote1  
VRRM  
VRSM  
V
V
V
V
V
500  
VR (DC)  
VDRM  
320  
400  
VD (DC)  
320  
Rev.1.00, Mar.01.2005, page 1 of 7  
CR05AS-8  
Parameter  
Symbol  
IT (RMS)  
IT (AV)  
Ratings  
0.79  
Unit  
A
Conditions  
RMS on-state current  
Average on-state current  
0.5  
A
Commercial frequency, sine half wave  
180° conduction, Ta = 57°CNote2  
Surge on-state current  
I2t for fusing  
ITSM  
I2t  
10  
A
60Hz sine half wave 1 full cycle,  
peak value, non-repetitive  
0.4  
A2s  
Value corresponding to 1 cycle of half  
wave 60Hz, surge on-state current  
Peak gate power dissipation  
Average gate power dissipation  
Peak gate forward voltage  
Peak gate reverse voltage  
Peak gate forward current  
Junction temperature  
Storage temperature  
PGM  
PG (AV)  
VFGM  
VRGM  
IFGM  
Tj  
0.1  
W
W
V
0.01  
6
6
0.1  
V
A
– 40 to +125  
– 40 to +125  
50  
°C  
°C  
mg  
Tstg  
Mass  
Typical value  
Notes: 1. With gate to cathode resistance RGK = 1 k.  
Electrical Characteristics  
Rated value  
Parameter  
Symbol  
Unit  
Test conditions  
Min.  
Typ.  
Max.  
0.1  
Repetitive peak reverse current  
Repetitive peak off-state current  
IRRM  
IDRM  
mA  
mA  
Tj = 125°C, VRRM applied  
0.1  
Tj = 125°C, VDRM applied,  
RGK = 1 kΩ  
On-state voltage  
VTM  
VGT  
VGD  
IGT  
1.9  
0.8  
V
V
Ta = 25°C, ITM = 1.5 A,  
instantaneous value  
Gate trigger voltage  
Gate non-trigger voltage  
Gate trigger current  
Holding current  
Tj = 25°C, VD = 6 V,  
IT = 0.1 ANote4  
0.2  
20  
V
Tj = 125°C, VD = 1/2 VDRM,  
RGK = 1 kΩ  
100Note3  
3
µA  
mA  
Tj = 25°C, VD = 6 V,  
IT = 0.1 ANote4  
IH  
Tj = 25°C, VD = 12 V,  
RGK = 1 kΩ  
Thermal resistance  
Rth (j-a)  
70  
°C/W Junction to ambientNote2  
Notes: 2. Soldering with ceramic plate (25 mm × 25 mm × t0.7 mm).  
3. If special values of IGT are required, choose item E from those listed in the table below if possible.  
Item  
B
E
IGT (µA)  
20 to 50  
20 to 100  
The above values do not include the current flowing through the 1 kresistance between the gate and  
cathode.  
4. IGT, VGT measurement circuit.  
60Ω  
A1  
I
I
GS  
GT  
TUT  
A3  
A2  
6V  
DC  
3V  
DC  
V1  
R
GK  
1
2
V
1kΩ  
GT  
Switch  
Switch 1 : I  
Switch 2 : V  
GT  
measurement  
measurement  
(Inner resistance of voltage meter is about 1k)  
GT  
Rev.1.00, Mar.01.2005, page 2 of 7  
CR05AS-8  
Performance Curves  
Maximum On-State Characteristics  
Rated Surge On-State Current  
102  
7
10  
9
8
7
6
5
4
3
2
1
0
Ta = 25°C  
5
3
2
101  
7
5
3
2
100  
7
5
3
2
10–1  
0
1
2
3
4
5
100  
2
3 4 5 7 101  
2
3 4 5 7 102  
On-State Voltage (V)  
Conduction Time (Cycles at 60Hz)  
Gate Trigger Current vs.  
Junction Temperature  
Gate Characteristics  
103  
7
102  
7
Typical Example  
5
5
3
2
3
2
V
P
= 6V  
P
= 0.1W  
GM  
FGM  
101  
7
102  
7
5
3
2
5
3
2
= 0.01W  
G(AV)  
V
GT  
= 0.8V  
100  
7
I
= 100µA  
GT  
(Tj = 25°C)  
5
3
2
101  
7
5
3
2
100  
10–1  
7
5
V
= 0.2V  
I
= 0.1A  
FGM  
GD  
3
2
10–2  
1022 3 5710–12 3 571002 3 571012 3 57102  
–60 –4020  
0 20 40 60 80 100 120140  
Gate Current (mA)  
Junction Temperature (°C)  
Gate Trigger Voltage vs.  
Junction Temperature  
Maximum Transient Thermal Impedance  
Characteristics (Junction to ambient)  
100 2 3 5 7 101 2 3 5 7 102 2 3 5 7 103  
103  
7
5
1.0  
25  
×25×t0.7  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
Aluminum Board  
3
2
Distribution  
102  
7
5
3
2
Typical Example  
101  
7
5
3
2
100  
10–3 2 3 5 710–2 2 3 5 710–1 2 3 5 7 100  
Time (s)  
–4020 0 20 40 60 80 100120140160  
Junction Temperature (°C)  
Rev.1.00, Mar.01.2005, page 3 of 7  
CR05AS-8  
Allowable Ambient Temperature vs.  
Average On-State Current  
Maximum Average Power Dissipation  
(Single-Phase Half Wave)  
(Single-Phase Half Wave)  
1.5  
160  
140  
120  
100  
80  
25×25×t0.7  
Aluminum Board  
θ = 30° 60° 90°120°  
180°  
θ
360°  
1.0  
0.5  
Resistive,  
inductive loads  
Natural convection  
60  
θ
θ = 30°  
90°  
180°  
40  
360°  
60° 120°  
20  
Resistive,  
inductive loads  
0
0
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8  
0
0.2  
0.4  
0.6  
0.8  
Average On-State Current (A)  
Average On-State Current (A)  
Allowable Ambient Temperature vs.  
Average On-State Current  
Maximum Average Power Dissipation  
(Single-Phase Full Wave)  
(Single-Phase Full Wave)  
160  
140  
120  
100  
80  
25×25×t0.7  
1.5  
90°  
Aluminum Board  
θ = 30° 60° 120°  
θ
θ
360°  
180°  
Resistive loads  
Natural convection  
1.0  
0.5  
0
60  
40  
θ
θ
60°  
120°  
0.6  
360°  
Resistive loads  
θ = 30°  
90°  
180°  
20  
0
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8  
0
0.2  
0.4  
0.8  
Average On-State Current (A)  
Average On-State Current (A)  
Allowable Ambient Temperature vs.  
Average On-State Current  
(Rectangular Wave)  
Maximum Average Power Dissipation  
(Rectangular Wave)  
160  
140  
120  
100  
80  
90° 180°  
25×25×t0.7  
1.5  
θ = 30° 60° 120° 270°  
Aluminum Board  
θ
DC  
360°  
Resistive, inductive loads  
Natural convection  
1.0  
0.5  
0
60  
DC  
θ
40  
θ = 30° 60°  
120°  
270°  
360°  
20  
Resistive,  
inductive loads  
90°  
0.4  
180°  
0.6  
0
0
0.2  
0.8  
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8  
Average On-State Current (A)  
Average On-State Current (A)  
Rev.1.00, Mar.01.2005, page 4 of 7  
CR05AS-8  
Breakover Voltage vs.  
Junction Temperature  
Breakover Voltage vs.  
Gate to Cathode Resistance  
160  
140  
120  
100  
80  
120  
100  
80  
60  
40  
20  
0
Typical Example  
Typical Example  
Tj = 125°C  
R
GK  
= 1kΩ  
60  
40  
20  
0
10–1 2 3 5 7100 2 3 5 7101 2 3 5 7102  
–4020 0 20 40 60 80 100120140160  
Junction Temperature (°C)  
Gate to Cathode Resistance (k)  
Breakover Voltage vs.  
Holding Current vs.  
Rate of Rise of Off-State Voltage  
Junction Temperature  
120  
102  
7
Tj = 25°C  
5
I
I
(25°C) = 1mA  
H
100  
80  
60  
40  
20  
0
3
2
(25°C) = 25µA  
GT  
101  
7
Distribution  
5
# 2  
# 1  
3
2
Typical Example  
100  
7
5
Typical Example  
# 1 I (25°C = 10µA)  
GT  
3
2
# 2 I (25°C = 66µA)  
GT  
Tj = 125°C, R  
= 1kΩ  
GK  
10–1  
100 2 3 5 7101 2 3 5 7 102 2 3 5 7 10 3  
–604020 0 20 40 60 80 100120140  
Rate of Rise of Off-State Voltage (V/µs)  
Junction Temperature (°C)  
Holding Current vs.  
Gate to Cathode Resistance  
Repetitive Peak Reverse Voltage vs.  
Junction Temperature  
500  
160  
Typical Example  
(25°C) I (1k)  
Typical Example  
I
GT  
13µA  
59µA  
H
140  
120  
100  
80  
# 1  
# 2  
1.6mA  
1.8mA  
400  
300  
200  
# 1  
# 2  
60  
40  
100  
0
20  
Tj = 25°C  
0
10–1 2 3 5 7100 2 3 5 7101 2 3 5 7102  
–4020 0 20 40 60 80 100120140160  
Junction Temperature (°C)  
Gate to Cathode Resistance (k)  
Rev.1.00, Mar.01.2005, page 5 of 7  
CR05AS-8  
Gate Trigger Current vs.  
Gate Current Pulse Width  
103  
7
5
4
3
2
Typical Example  
(25°C)  
# 1  
# 2  
I
GT  
# 1  
# 2  
10µA  
66µA  
102  
7
5
4
3
2
Tj = 25°C  
101  
100  
2
3 4 5 7 101  
102  
2 3 4 5 7  
Gate Current Pulse Width (µs)  
Rev.1.00, Mar.01.2005, page 6 of 7  
CR05AS-8  
Package Dimensions  
JEITA Package Code  
SC-62  
RENESAS Code  
Package Name  
UPAK / UPAKV  
MASS[Typ.]  
0.050g  
Unit: mm  
PLZZ0004CA-A  
4.5 ± 0.1  
1.8 Max  
1.5 ± 0.1  
0.44 Max  
(1.5)  
φ
1
0.53 Max  
0.48 Max  
0.44 Max  
1.5  
1.5  
3.0  
Order Code  
Standard order  
code example  
Lead form  
Standard packing  
Quantity  
Standard order code  
Surface-mounted type Taping  
4000 Type name – ET +Direction (1 or 2) + 4 CR05AS-8-ET14  
Note : Please confirm the specification about the shipping in detail.  
Rev.1.00, Mar.01.2005, page 7 of 7  
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
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Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits,  
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