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R1170H451A-T1-FE

更新时间：2025-07-08 21:47:38
品牌：RICOH
描述：800mA LDO REGULATOR

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R1170H451A-T1-FE 概述

800mA LDO REGULATOR

R1170H451A-T1-FE 数据手册

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R1170x SERIES  
800mA LDO REGULATOR  
OUTLINE  
NO.EA-084-111027  
The R1170x Series are positive voltage regulator ICs by CMOS process. The R1170x Series have features of  
high ripple rejection, low dropout voltage, high output voltage accuracy, low consumption current. Each of these  
ICs consists of a voltage reference unit, an error amplifier, resistor net for setting output voltage, a current limit  
circuit at short mode, a chip enable circuit, and thermal-shunt circuit. Output Voltage of R1170 is fixed in the IC.  
Low consumption current by the merit of CMOS process and built-in transistors with low ON-resistance make  
low dropout voltage and chip enable function prolong the battery life. These regulators are remarkable  
improvement on the current regulators in terms of ripple rejection, input transient response, and load transient  
response.  
Maximum Output Current is large for its compact size.  
Thus, the R1170x Series are suitable for various power sources for portable appliances.  
Since the packages for these ICs are the SOT-89-5 package, HSON-6, or HSOP-6J, high density mounting of  
the ICs on boards is possible.  
FEATURES  
• Supply Current............................................................. Typ. 80μA  
• Standby Current........................................................... Typ. 0.1μA  
• Output Current ............................................................. Min. 800mA (VIN=VOUT+1.0V)  
• Dropout Voltage ........................................................... Typ. 0.12V (VOUT=3.0V, IOUT=300mA)  
• Output Voltage Accuracy.............................................. ±2.0%  
• Temperature-Drift Coefficient of Output Voltage.......... Typ.±100ppm/°C  
• Line Regulation............................................................ Typ. 0.05%/V  
• Output Voltage ............................................................. 1.5V to 5.0V (0.1V steps)  
(For other voltages, please refer to MARK INFORMATIONS.)  
• Packages ..................................................................... HSON-6, SOT-89-5, HSOP-6J  
• Built-in Current Limit Circuit  
• Built-in Thermal Shutdown Circuit  
• Ceramic capacitors are recommended to be used with this IC  
APPLICATIONS  
• Local Power source for Notebook PC.  
• Local Power source for portable appliances, cameras, and videos.  
• Local Power source for equipment of battery-use.  
• Local Power source for home appliances.  
1
R1170x  
BLOCK DIAGRAMS  
R1170xxx1A  
R1170Dxxx1B  
V
DD  
V
DD  
V
OUT  
V
OUT  
Vref  
Vref  
Current Limit  
Current Limit  
Thermal Shutdown  
Thermal Shutdown  
CE  
CE  
GND  
GND  
SELECTION GUIDE  
The output voltage, the chip-enable polarity, package for the ICs can be selected at the user’s request.  
Product Name  
R1170Dxx1∗-TR-FE  
R1170Hxx1∗-T1-FE  
R1170Sxx1∗-E2-FE  
Package  
HSON-6  
SOT-89-5  
HSOP-6J  
Quantity per Reel  
3,000 pcs  
Pb Free  
Yes  
Halogen Free  
Yes  
Yes  
Yes  
1,000 pcs  
Yes  
1,000 pcs  
Yes  
xx: The output voltage can be designated in the range from 1.5V(15) to 5.0V(50) in 0.1V steps.  
(For other voltages, please refer to MARK INFORMATIONS.)  
∗ : CE pin polarity are options as follows.  
(A) "L" active  
(B) "H" active  
2
R1170x  
PIN CONFIGURATION  
• HSON-6  
• SOT-89-5  
• HSOP-6J  
Top View  
Bottom View  
6
5
4
5
4
6
5
4
4
5
6
∗
∗
∗
1
2
3
1
2
3
1
2
3
3
2
1
PIN DESCRIPTION  
• HSON-6  
Pin No  
Symbol  
Description  
*1  
1
2
3
4
5
6
VOUT  
Voltage Regulator Output Pin  
Voltage Regulator Output Pin  
Chip Enable Pin  
Ground Pin  
*1  
VOUT  
CE  
or CE  
GND  
*1  
*1  
VDD  
VDD  
Input Pin  
Input Pin  
∗) Tab and tab suspension leads in the  
parts are GND level.  
(They are connected to the reverse side of the IC.)  
The tab is better to be connected to the GND, but leaving it open is also acceptable.  
The tab suspension leads should be open and do not connect to other wires or land patterns.  
∗1) The VOUT pin and VDD pin must be wired each other when it is mounted on board.  
• SOT-89-5  
Pin No  
Symbol  
CE  
Description  
1
2
3
4
5
Chip Enable Pin  
Ground Pin  
or CE  
GND  
NC  
VDD  
No Connection  
Input Pin  
VOUT  
Voltage Regulator Output Pin  
3
R1170x  
• HSOP-6J  
Pin No  
Symbol  
VOUT  
GND*1  
Description  
Voltage Regulator Output Pin  
1
2
3
4
5
6
Ground Pin  
Chip Enable Pin  
No Connection  
Ground Pin  
CE  
or CE  
NC  
GND*1  
VDD  
Input Pin  
∗1) The GND pin must be wired together when it is mounted on board.  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Item  
Rating  
7.0  
Unit  
V
VIN  
Input Voltage  
VCE  
V
−0.3 to VIN+0.3  
−0.3 to VIN+0.3  
900  
CE  
Input Voltage (  
Output Voltage  
or CE Input Pin)  
VOUT  
V
Power Dissipation (HSON-6)*  
Power Dissipation (SOT-89-5)*  
Power Dissipation (HSOP-6J)*  
Operating Temperature  
PD  
mW  
900  
1700  
Topt  
Tstg  
−40 to 85  
−55 to 125  
°C  
°C  
Storage Temperature  
∗) For Power Dissipation, please refer to PACKAGE INFORMATION.  
ABSOLUTE MAXIMUM RATINGS  
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the  
permanent damages and may degrade the life time and safety for both device and system using the device  
in the field.  
The functional operation at or over these absolute maximum ratings is not assured.  
RECOMMENDED OPERATING CONDITIONS (ELECTRICAL CHARACTERISTICS)  
All of electronic equipment should be designed that the mounted semiconductor devices operate within the  
recommended operating conditions. The semiconductor devices cannot operate normally over the  
recommended operating conditions, even if when they are used over such conditions by momentary  
electronic noise or surge. And the semiconductor devices may receive serious damage when they continue  
to operate over the recommended operating conditions.  
4
R1170x  
ELECTRICAL CHARACTERISTICS  
• R1170xxxxA  
Topt=25°C  
Symbol  
Item  
Conditions  
Min.  
Typ.  
Max. Unit  
VIN  
Input Voltage  
Supply Current  
6.0  
160  
V
μA  
μA  
V
VIN−VOUT=1.0V,  
VCE=GND  
ISS  
80  
Istandby Standby Current  
0.1  
1.0  
VIN=VCE=6.0V  
VIN−VOUT=1.0V  
IOUT=100mA  
VOUT  
Output voltage  
Load regulation  
×0.98  
×1.02  
ΔVOUT/  
ΔIOUT  
VIN−VOUT=1.0V  
30  
100  
mV  
1mA  
IOUT  
300mA  
=
=
0.35  
0.30  
0.25  
0.20  
0.15  
0.12  
0.45  
0.35  
0.30  
0.25  
0.20  
0.18  
VOUT=1.5V  
VOUT=1.6V  
VOUT=1.7V  
VDIF  
Dropout Voltage  
V
IOUT=300mA  
1.8V  
VOUT  
VOUT  
VOUT  
2.0V  
2.4V  
5.0V  
=
=
=
2.1V  
2.5V  
ΔVOUT/  
ΔVIN  
IOUT=100mA  
VOUT+0.5V VIN 6.0V  
=
Line regulation  
0.05  
50  
0.30  
%/V  
dB  
1.5V  
VOUT  
4.7V:  
=
=
f=1kHz, VIN−VOUT=1.0V  
Ripple 0.5Vp-p  
RR  
Ripple Rejection  
4.8V  
VOUT  
5.0V:  
=
=
50  
f=1kHz, VIN=5.7V  
Ripple 0.5Vp-p  
ppm/  
°C  
ΔVOUT/ Output Voltage  
ΔTopt  
IOUT=10mA, VIN−VOUT=1.0V  
−40°C Topt 85°C  
= =  
±100  
Temperature Coefficient  
ILIM  
Output Current  
800  
mA  
mA  
MΩ  
V
VIN−VOUT=1.0V  
VOUT=0V  
ISC  
Short Current Limit  
Pull-up resistancefor  
40  
RPU  
VCEH  
VCEL  
1.25  
1.50  
0
2.50  
5.00  
VIN  
CE  
pin  
CE  
CE  
Input Voltage "H"  
Input Voltage "L"  
0.25  
V
Thermal Shutdown  
Detector Threshold Temperature  
TTSD  
TTSR  
Junction Temperature  
Junction Temperature  
150  
120  
°C  
°C  
Thermal Shutdown  
Released Temperature  
5
R1170x  
• R1170xxxxB  
Topt=25°C  
Symbol  
Item  
Conditions  
Min.  
Typ.  
Max.  
Unit  
V
VIN  
ISS  
Input voltage  
Supply Current  
6.0  
160  
1.0  
80  
VIN−VOUT=1.0V,VCE=VIN  
VIN=6.0V,VCE=GND  
μA  
μA  
Istandby Standby Current  
0.1  
Reference Voltage for  
Adjustable Voltage Regulator  
VIN−VOUT=1.0V  
IOUT=100mA  
VOUT  
V
×0.98  
×1.02  
ΔVOUT/  
ΔIOUT  
VIN−VOUT=1.0V  
Load regulation  
30  
100  
mV  
1mA  
IOUT  
300mA  
=
=
0.35  
0.30  
0.25  
0.20  
0.15  
0.12  
0.45  
0.35  
0.30  
0.25  
0.20  
0.18  
VOUT=1.5V  
VOUT=1.6V  
VOUT=1.7V  
VDIF  
Dropout Voltage  
IOUT=300mA  
1.8V  
VOUT  
VOUT  
VOUT  
2.0V  
2.4V  
5.0V  
=
=
=
=
=
=
2.1V  
2.5V  
ΔVOUT/  
ΔVIN  
IOUT=100mA  
VOUT+0.5V VIN 6.0V  
=
Line regulation  
0.05  
50  
0.30  
%/V  
dB  
1.5V  
VOUT  
4.7V:  
=
=
f=1kHz, VIN−VOUT=1.0V  
Ripple 0.5Vp-p  
RR  
Ripple Rejection  
4.8V  
VOUT  
5.0V:  
=
=
50  
f=1kHz, VIN=5.7V  
Ripple 0.5Vp-p  
ppm/  
°C  
ΔVOUT/ Output Voltage  
ΔTopt  
IOUT=10mA, VIN−VOUT=1.0V  
±100  
Temperature Coefficient  
−40°C Topt 85°C  
=
ILIM  
Output Current  
800  
mA  
mA  
MΩ  
V
VIN−VOUT=1.0V  
VOUT=0V  
ISC  
Short Current Limit  
40  
RPD  
VCEH  
VCEL  
Pull-down resistance for CE pin  
CE Input Voltage "H"  
CE Input Voltage "L"  
1.25  
1.5  
0
2.50  
5.00  
VIN  
0.25  
V
Thermal Shutdown  
Detector Threshold Temperature  
TTSD  
TTSR  
Junction Temperature  
Junction Temperature  
150  
120  
°C  
°C  
Thermal Shutdown  
Released Temperature  
6
R1170x  
TEST CIRCUITS  
CE  
CE  
V
OUT  
VOUT  
VDD  
VDD  
IN  
OUT  
IN  
I
OUT  
SS  
I
OUT  
R1170xxx1B  
SERIES  
R1170xxx1B  
SERIES  
10  
μ
F
10μF  
10  
μ
F
10μF  
GND  
GND  
Standard Test Circuit  
Supply Current Test Circuit  
CE  
CE  
V
OUT  
V
OUT  
VDD  
VDD  
IN  
OUT  
IN  
OUT  
I
OUT  
R1170xxx1B  
SERIES  
R1170xxx1B  
SERIES  
10μF  
10μF  
10μF  
P.G.  
I1 I2  
GND  
GND  
Test Circuit for Ripple Rejection,  
Input Transient Response  
Test Circuit for Load Transient Response  
7
R1170x  
Technical Notes on External Components and Typical Application  
Phase Compensation  
In these ICs, phase compensation is made with the output capacitor for securing stable operation even if the  
load current is varied. For this purpose, use as much as 10µF Capacitor as CL.  
If you use a tantalum type capacitor and ESR value of the capacitor is large, output might be unstable.  
Evaluate your circuit with considering frequency characteristics. Further, refer to the Typical Characteristics No.  
12.  
Mounting on PCB  
Make VDD and GND lines sufficient. If their impedance is high, a current flows, the noise picked up or unstable  
operation may result. Further use as much as 10µF capacitor between VDD pin and GND pin as close as  
possible.  
Set an Output capacitor between VOUT pin and GND pin for phase compensation as close as possible.  
(Refer to the example of typical application)  
CE  
IN  
V
DD  
VOUT  
OUT  
R1170xxx1B  
GND  
CL  
CI  
CI=10μF(Ceramic), CL=10μF(Ceramic)  
Example of the typical application of R1170xxxxB  
8
R1170x  
TYPICAL CHARACTERISTICS  
1) Output Voltage vs. Output Current (Topt=25°C)  
R1170x151B  
R1170x301B  
1.8  
3.5  
3
V
IN=5V  
VIN=2.5V  
1.6  
1.4  
1.2  
1
V
IN=4V  
IN=3.5V  
2.5  
2
V
V
IN=2V  
0.8  
0.6  
0.4  
0.2  
0
1.5  
1
V
IN=3.5V  
0.5  
0
0
250 500 750 1000 1250 1500  
Output Current IOUT(mA)  
0
250 500 750 1000 1250 1500  
Output Current IOUT(mA)  
R1170x501B  
6
5
4
3
2
1
0
V
IN=6V  
V
IN=5.5V  
0
250 500 750 1000 1250 1500  
Output Current IOUT(mA)  
2) Output Voltage vs. Input Voltage (Topt=25°C)  
R1170x151B  
R1170x201B  
1.7  
2.2  
2.1  
I
OUT=1mA  
1.6  
I
OUT=1mA  
IOUT=10mA  
IOUT=10mA  
2
1.5  
1.4  
1.3  
1.2  
1.1  
1.9  
1.8  
1.7  
I
OUT=100mA  
I
OUT=100mA  
OUT=300mA  
I
OUT=300mA  
I
1.6  
1.5  
1.4  
1
2
3
4
5
6
1
2
3
4
5
6
Input Voltage VIN(V)  
Input Voltage VIN(V)  
9
R1170x  
R1170x301B  
R1170x401B  
3.2  
3.1  
3.0  
2.9  
2.8  
2.7  
2.6  
2.5  
4.2  
4.1  
4.0  
3.9  
3.8  
3.7  
3.6  
3.5  
3.4  
I
OUT=10mA  
I
OUT=1mA  
I
OUT=1mA  
I
OUT=10mA  
I
OUT=100mA  
IOUT=100mA  
I
OUT=300mA  
I
OUT=300mA  
2
3
4
5
6
3.5  
4
4.5  
5
5.5  
6
Input Voltage VIN(V)  
Input Voltage VIN(V)  
R1170x501B  
5.2  
5.0  
4.8  
4.6  
4.4  
4.2  
4.0  
3.8  
I
OUT=1mA  
IOUT=10mA  
I
OUT=100mA  
IOUT=300mA  
4.0  
4.5  
5.0  
5.5  
6.0  
Input Voltage VIN(V)  
3) Dropout Voltage vs. Output Current  
R1170x151B  
R1170x201B  
0.8  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
0.7  
25°C  
0.6  
25°C  
0.5  
0.4  
0.3  
0.2  
0.1  
0
85°C  
85°C  
-40°C  
-40°C  
0
100 200 300 400 500 600 700 800  
Output Current IOUT(mA)  
0
100 200 300 400 500 600 700 800  
Output Current IOUT(mA)  
10  
R1170x  
R1170x301B  
R1170x401B  
0.50  
0.45  
0.40  
0.35  
0.30  
0.25  
0.20  
0.15  
0.10  
0.05  
0.00  
0.45  
0.40  
0.35  
0.30  
0.25  
0.20  
0.15  
0.10  
0.05  
0.00  
25°C  
25°C  
85°C  
85°C  
-40°C  
-40°C  
0
100 200 300 400 500 600 700 800  
Output Current IOUT(mA)  
0
100 200 300 400 500 600 700 800  
Output Current IOUT(mA)  
R1170x501B  
0.35  
0.30  
0.25  
0.20  
0.15  
0.10  
0.05  
0.00  
25°C  
85°C  
-40°C  
0
100 200 300 400 500 600 700 800  
Output Current IOUT(mA)  
4) Output Voltage vs. Temperature  
R1170x151B  
R1170x201B  
VIN=3V, IOUT=10mA  
V
IN=2.5V, IOUT=10mA  
2.10  
2.08  
2.05  
2.03  
2.00  
1.98  
1.95  
1.93  
1.90  
1.60  
1.58  
1.55  
1.53  
1.50  
1.48  
1.45  
1.43  
1.40  
-50  
-25  
0
25  
50  
75  
100  
-50  
-25  
0
25  
50  
75  
100  
Temperature Topt(°C)  
Temperature Topt(°C)  
11  
R1170x  
R1170x301B  
R1170x401B  
V
IN=4V, IOUT=10mA  
V
IN=5V, IOUT=10mA  
3.20  
4.20  
4.15  
4.10  
4.05  
4.00  
3.95  
3.90  
3.85  
3.80  
3.15  
3.10  
3.05  
3.00  
2.95  
2.90  
2.85  
2.80  
-50  
-25  
0
25  
50  
75  
100  
-50  
-25  
0
25  
50  
75  
100  
Temperature Topt(°C)  
Temperature Topt(°C)  
R1170x501B  
V
IN=6V, IOUT=10mA  
5.20  
5.15  
5.10  
5.05  
5.00  
4.95  
4.90  
4.85  
4.80  
-50  
-25  
0
25  
50  
75  
100  
Temperature Topt(°C)  
5) Supply Current vs. Input Voltage (Topt=25°C)  
R1170x151B  
R1170x201B  
120  
120  
100  
80  
60  
40  
20  
0
100  
80  
60  
40  
20  
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Input Voltage VIN(V)  
Input Voltage VIN(V)  
12  
R1170x  
R1170x301B  
R1170x401B  
120  
100  
80  
60  
40  
20  
0
120  
100  
80  
60  
40  
20  
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Input Voltage VIN(V)  
Input Voltage VIN(V)  
R1170x501B  
120  
100  
80  
60  
40  
20  
0
0
1
2
3
4
5
6
Input Voltage VIN(V)  
6) Supply Current vs. Temperature  
R1170x151B  
R1170x201B  
V
IN=3V  
VIN=2.5V  
160  
140  
120  
100  
80  
160  
140  
120  
100  
80  
60  
60  
40  
40  
20  
-50  
20  
-50  
25  
Temperature Topt(  
25  
Temperature Topt(°C)  
-25  
0
50  
75  
100  
-25  
0
50  
75  
100  
°C)  
13  
R1170x  
R1170x301B  
R1170x401B  
V
IN=4V  
VIN=5V  
160  
140  
120  
100  
80  
160  
140  
120  
100  
80  
60  
60  
40  
40  
20  
-50  
20  
-50  
25  
25  
Temperature Topt(°C)  
-25  
0
50  
75  
100  
-25  
0
50  
75  
100  
Temperature Topt(  
°
C)  
R1170x501B  
V
IN=6V  
160  
140  
120  
100  
80  
60  
40  
20  
-50  
25  
Temperature Topt(°C)  
-25  
0
50  
75  
100  
7) Dropout Voltage vs. Set Output Voltage (Topt=25°C)  
R1170x  
0.7  
I
OUT=400mA  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
IOUT=600mA  
I
OUT=800mA  
I
OUT=100mA  
1
2
3
4
5
Set Output Voltage VSET(V)  
14  
R1170x  
8) Ripple Rejection vs. Frequency  
R1170x151B  
R1170x201B  
V
IN=2.5V+0.5Vp-p, IOUT=100mA  
VIN=3V+0.5Vp-p, IOUT=100mA  
80  
70  
60  
50  
40  
30  
20  
10  
0
80  
70  
60  
50  
40  
30  
20  
10  
0
0.01  
0.1  
1
10  
100  
0.01  
0.1  
1
10  
100  
Ripple Frequency f (kHz)  
Ripple Frequency f (kHz)  
R1170x301B  
R1170x401B  
V
IN=4V+0.5Vp-p, IOUT=100mA  
VIN=5V+0.5Vp-p, IOUT=100mA  
80  
70  
60  
50  
40  
30  
20  
10  
0
80  
70  
60  
50  
40  
30  
20  
10  
0
0.01  
0.1  
1
10  
100  
0.01  
0.1  
1
10  
100  
Ripple Frequency f (kHz)  
Ripple Frequency f (kHz)  
R1170x501B  
V
IN=5.75+0.5Vp-p, IOUT=100mA  
80  
70  
60  
50  
40  
30  
20  
10  
0
0.01  
0.1  
1
10  
100  
Ripple Frequency f (kHz)  
15  
R1170x  
9) Ripple Rejection vs. Input Voltage  
R1170x301B  
R1170x301B  
I
OUT=1mA, COUT=10  
μF  
IOUT=10mA, COUT=10  
μF  
60  
50  
60  
50  
f=400Hz  
f=400Hz  
f=1kHz  
f=1kHz  
40  
30  
40  
30  
f=10kHz  
f=10kHz  
20  
20  
10  
0
10  
0
3
3.2  
3.4  
3.6  
F
3
3.2  
3.4  
3.6  
Input Voltage VIN(V)  
Input Voltage VIN(V)  
R1170x301B  
I
OUT=100mA, COUT=10μ  
60  
50  
f=400Hz  
f=1kHz  
40  
30  
f=10kHz  
20  
10  
0
3
3.2  
3.4  
3.6  
Input Voltage VIN(V)  
10) Input Transient Response (Topt=25°C)  
R1170x151B  
tr=tf=10μs, IOUT=100mA, COUT=Ceramic 10  
μF  
1.8  
1.75  
1.7  
4
3.5  
3
Input Voltage  
1.65  
1.6  
2.5  
2
1.55  
1.5  
1.5  
1
Output Voltage  
1.45  
1.4  
0.5  
0
0
20  
40  
60  
80  
100  
Time T(μs)  
120  
140  
160  
180  
200  
16  
R1170x  
R1170x301B  
tr=tf=10μs, IOUT=100mA, COUT=Ceramic 10  
μF  
3.4  
3.3  
3.2  
3.1  
3.0  
2.9  
2.8  
6
5
4
3
2
1
0
Input Voltage  
Output Voltage  
0
0
0
20  
20  
20  
40  
40  
40  
60  
60  
60  
80  
100  
120  
140  
160  
180  
200  
Time T(μs)  
R1170x301B  
tr=tf=10  
μ
s, IOUT=100mA, COUT=Ceramic 4.7  
μF  
3.4  
3.3  
3.2  
3.1  
3.0  
2.9  
2.8  
6
5
4
3
2
1
0
Input Voltage  
Output Voltage  
80  
100  
Time T(μs)  
120  
140  
160  
180  
200  
R1170x501B  
tr=tf=10  
μ
s, IOUT=100mA, COUT=Ceramic 10  
μF  
5.20  
5.15  
5.10  
5.05  
5.00  
4.95  
4.90  
6.5  
6.0  
5.5  
5.0  
4.5  
4.0  
3.5  
Input Voltage  
Output Voltage  
80  
100  
Time T(μs)  
120  
140  
160  
180  
200  
17  
R1170x  
R1170x501B  
tr=tf=10μs, IOUT=100mA, COUT=Ceramic 4.7  
μF  
5.20  
5.15  
5.10  
5.05  
5.00  
4.95  
4.90  
6.5  
6.0  
5.5  
5.0  
4.5  
4.0  
3.5  
Input Voltage  
Output Voltage  
0
20  
40  
60  
80  
100  
Time T(μs)  
120  
140  
160  
180  
200  
11) Load Transient Response (Topt=25°C)  
R1170x151B  
tr=tf=3μs, CIN=Ceramic 10  
μF, VIN=2.5V, COUT=Ceramic 10  
μF  
2.0  
1.9  
1.8  
1.7  
1.6  
1.5  
1.4  
120  
100  
80  
60  
40  
20  
0
Output Current  
Output Voltage  
0
20  
40  
60  
80  
100  
120  
140  
160  
180  
200  
Time T(μs)  
R1170x301B  
tr=tf=3μs, CIN=Ceramic 10  
μF, VIN=4V, COUT=Ceramic 10  
μF  
3.5  
3.4  
3.3  
3.2  
3.1  
3.0  
2.9  
120  
100  
80  
60  
40  
20  
0
Output Current  
Output Voltage  
0
20  
40  
60  
80  
100  
120  
140  
160  
180  
200  
Time T(μs)  
18  
R1170x  
R1170x301B  
tr=tf=3  
μ
s, CIN=Ceramic 10  
μ
F, VIN=4V, COUT=Ceramic 4.7μF  
3.5  
3.4  
3.3  
3.2  
3.1  
3.0  
2.9  
120  
100  
80  
60  
40  
20  
0
Output Current  
Output Voltage  
0
0
0
20  
20  
20  
40  
40  
40  
60  
80  
100  
120  
140  
160  
180  
200  
Time T(μs)  
R1170x501B  
tr=tf=3  
μ
s, CIN=Ceramic 10  
μ
F, COUT=Ceramic 10  
Output Current  
μ
F
5.20  
5.15  
5.10  
5.05  
5.00  
4.95  
4.90  
150  
100  
50  
0
Output Voltage  
60  
80  
100  
Time T(μs)  
120  
140  
160  
180  
200  
R1170x501B  
tr=tf=3  
μ
s, CIN=Ceramic 10  
μ
F, COUT=Ceramic 4.7  
Output Current  
μF  
5.20  
5.15  
5.10  
5.05  
5.00  
4.95  
4.90  
150  
100  
50  
0
Output Voltage  
60  
80  
100  
Time T(μs)  
120  
140  
160  
180  
200  
19  
R1170x  
12) Stable Area (Topt=25°C, VIN = Set Output Voltage+1V, CIN = Ceramic 10μF)  
CE  
VOUT  
Ceramic  
Capacitor  
R1170xxxxB  
Spectrum  
Analyzer  
S.A.  
V
IN  
GND  
ESR  
Ceramic  
Capacitor  
V
IN  
I
OUT  
As an output capacitor for this IC, Ceramic capacitor is recommendable. However, other low ESR type  
capacitor can be used with this IC.  
For your reference, noise level is tested with the circuit as shown above, and if the noise level is 40μV or less  
than 40μV, the ESR values are plotted as stable area. Upper limit is described in the next four graphs, or ESR vs.  
Output Current. (Hatched area is the stable area.)  
R1170x151B  
R1170x151B  
C
OUT=Ceramic 10  
μ
F
COUT=Ceramic 4.7μF  
100  
10  
1
100  
10  
1
0.1  
0.1  
0
200  
400  
600  
800  
0
200  
400  
600  
800  
Output Current IOUT(mA)  
Output Current IOUT(mA)  
R1170x301B  
R1170x301B  
COUT=Ceramic 10  
μ
F
COUT=Ceramic 4.7  
μ
F
100  
10  
1
100  
10  
1
0.1  
0.1  
0
200  
400  
600  
800  
0
200  
400  
600  
800  
Output Current IOUT(mA)  
Output Current IOUT(mA)  
20  
R1170x  
R1170x501B  
R1170x501B  
COUT=Ceramic 10  
μ
F
COUT=Ceramic 4.7μF  
100  
10  
100  
10  
1
1
0.1  
0.01  
0.1  
0.01  
0
100 200 300 400 500 600 700 800  
Output Current IOUT(mA)  
0
100 200 300 400 500 600 700 800  
Output Current IOUT(mA)  
21  
1.The products and the product specifications described in this document are subject to change or  
discontinuation of production without notice for reasons such as improvement. Therefore, before  
deciding to use the products, please refer to Ricoh sales representatives for the latest information  
thereon.  
2.The materials in this document may not be copied or otherwise reproduced in whole or in part without  
prior written consent of Ricoh.  
3.Please be sure to take any necessary formalities under relevant laws or regulations before exporting or  
otherwise taking out of your country the products or the technical information described herein.  
4.The technical information described in this document shows typical characteristics of and example  
application circuits for the products. The release of such information is not to be construed as a  
warranty of or a grant of license under Ricoh's or any third party's intellectual property rights or any  
other rights.  
5.The products listed in this document are intended and designed for use as general electronic  
components in standard applications (office equipment, telecommunication equipment, measuring  
instruments, consumer electronic products, amusement equipment etc.). Those customers intending to  
use a product in an application requiring extreme quality and reliability, for example, in a highly specific  
application where the failure or misoperation of the product could result in human injury or death  
(aircraft, spacevehicle, nuclear reactor control system, traffic control system, automotive and  
transportation equipment, combustion equipment, safety devices, life support system etc.) should first  
contact us.  
6.We are making our continuous effort to improve the quality and reliability of our products, but  
semiconductor products are likely to fail with certain probability. In order to prevent any injury to  
persons or damages to property resulting from such failure, customers should be careful enough to  
incorporate safety measures in their design, such as redundancy feature, fire containment feature and  
fail-safe feature. We do not assume any liability or responsibility for any loss or damage arising from  
misuse or inappropriate use of the products.  
7.Anti-radiation design is not implemented in the products described in this document.  
8.Please contact Ricoh sales representatives should you have any questions or comments concerning  
the products or the technical information.  
Ricoh is committed to reducing the environmental loading materials in electrical devices  
with a view to contributing to the protection of human health and the environment.  
Ricoh has been providing RoHS compliant products since April 1, 2006 and Halogen-free products since  
Halogen Free  
April 1, 2012.  
http://www.e-devices.ricoh.co.jp/en/  
Sales & Support Offices  
RICOH ELECTRONIC DEVICES CO., LTD.  
Higashi-Shinagawa Office (International Sales)  
3-32-3, Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-8655, Japan  
Phone: +81-3-5479-2857 Fax: +81-3-5479-0502  
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Semiconductor Support Centre  
Prof. W.H. Keesomlaan 1, 1183 DJ Amstelveen, The Netherlands  
Phone: +31-20-5474-309  
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Phone: +82-2-2135-5700 Fax: +82-2-2051-5713  
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Room 403, No.2 Building, No.690 Bibo Road, Pu Dong New District, Shanghai 201203,  
People's Republic of China  
Phone: +86-21-5027-3200 Fax: +86-21-5027-3299  
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Room 109, 10F-1, No.51, Hengyang Rd., Taipei City, Taiwan (R.O.C.)  
Phone: +886-2-2313-1621/1622 Fax: +886-2-2313-1623  

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