P0102BL
Fig. 1: Maximum average power dissipation
Fig. 2: Average and D.C. on-state current versus
versus average on-state current.
ambient temperature.
P(W)
IT(av)(A)
0.30
0.28
0.30
α = 180 °
D.C
0.26
0.24
0.22
0.20
0.18
0.16
0.14
0.12
0.10
0.25
0.20
α = 180°
0.15
0.10
360 °
0.08
0.06
0.04
0.05
Tamb(°C)
α
0.02
0.00
IT(av)(A)
0.00
0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18
0
25
50
75
100
125
Fig. 3: Relative variation of thermal impedance
junction to ambient versus pulse duration.
Fig. 4: Relative variation of gate trigger current,
holding current and latching current versus
junction temperature (typical values).
K=[Zth(j-a)/Rth(j-a)]
IGT, IH, IL[Tj] / IGT , IH, IL[Tj = 25 °C]
1.00
6
5
4
IGT
0.10
3
2
IH & IL
(Rgk = 1kΩ)
1
Tj(°C)
tp(s)
0
0.01
-40 -20
0
20
40
60
80 100 120 140
1E-2
1E-1
1E+0
1E+1
1E+2
Fig. 5: Relative variation of holding current
Fig. 6: Relative variation of dV/dt immunity
versus gate-cathode resistance (typical values).
versus gate-cathode resistance (typical values).
IH[Rgk] / IH[Rgk = 1kΩ]
dV/dt[Rgk] / dV/dt[Rgk = 1kΩ]
20
10.0
18
16
14
12
10
8
1.0
6
4
2
Rgk(kΩ)
Rgk(kΩ)
0.1
0
0
1E-2
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
1E-1
1E+0
1E+1
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