SN74AHCT273DBLE
更新时间:2025-02-07 13:10:20
品牌:TI
描述:AHCT/VHCT SERIES, OCTAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO20, PLASTIC, SSOP-20
SN74AHCT273DBLE 概述
AHCT/VHCT SERIES, OCTAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO20, PLASTIC, SSOP-20 触发器/锁存器
SN74AHCT273DBLE 规格参数
是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | SSOP | 包装说明: | PLASTIC, SSOP-20 |
针数: | 20 | Reach Compliance Code: | not_compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.37 |
Is Samacsys: | N | 系列: | AHCT/VHCT |
JESD-30 代码: | R-PDSO-G20 | 长度: | 7.2 mm |
负载电容(CL): | 50 pF | 逻辑集成电路类型: | D FLIP-FLOP |
最大频率@ Nom-Sup: | 45000000 Hz | 最大I(ol): | 0.008 A |
位数: | 8 | 功能数量: | 1 |
端子数量: | 20 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 输出极性: | TRUE |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SSOP |
封装等效代码: | SSOP20,.3 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, SHRINK PITCH | 包装方法: | TAPE AND REEL |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 5 V |
传播延迟(tpd): | 11 ns | 认证状态: | Not Qualified |
座面最大高度: | 2 mm | 子类别: | FF/Latches |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 4.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
触发器类型: | POSITIVE EDGE | 宽度: | 5.3 mm |
最小 fmax: | 65 MHz | Base Number Matches: | 1 |
SN74AHCT273DBLE 数据手册
通过下载SN74AHCT273DBLE数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载SN54AHCT273, SN74AHCT273
OCTAL D-TYPE FLIP-FLOPS
WITH CLEAR
SCLS375E – JUNE 1997 – REVISED APRIL 2002
SN54AHCT273 . . . J OR W PACKAGE
SN74AHCT273 . . . DB, DGV, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
Inputs Are TTL-Voltage Compatible
Contain Eight Flip-Flops With Single-Rail
Outputs
CLR
1Q
1D
2D
2Q
3Q
3D
4D
4Q
V
CC
Direct Clear Input
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
8Q
8D
7D
7Q
6Q
6D
Individual Data Input to Each Flip-Flop
Applications Include:
– Buffer/Storage Registers
– Shift Registers
– Pattern Generators
Latch-Up Performance Exceeds 250 mA Per
JESD 17
13 5D
12 5Q
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
11
GND
CLK
SN54AHCT273 . . . FK PACKAGE
(TOP VIEW)
– 1000-V Charged-Device Model (C101)
description
Thesedevicesarepositive-edge-triggeredD-type
flip-flops with a direct clear (CLR) input.
3
2
1
20 19
18
2D
2Q
3Q
3D
4D
8D
17 7D
4
5
6
7
8
Information at the data (D) inputs meeting the
setup time requirements is transferred to the
Q outputs on the positive-going edge of the clock
(CLK) pulse. Clock triggering occurs at a
particular voltage level and is not directly related
to the transition time of the positive-going pulse.
When CLK is at either the high or low level, the
D input has no effect at the output.
16
15
14
7Q
6Q
6D
9 10 11 12 13
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP – N
Tube
SN74AHCT273N
SN74AHCT273N
Tube
SN74AHCT273DW
SN74AHCT273DWR
SN74AHCT273NSR
SN74AHCT273DBR
SN74AHCT273PWR
SOIC – DW
AHCT273
Tape and reel
Tape and reel
Tape and reel
Tape and reel
Tape and reel
Tube
–40°C to 85°C
SOP – NS
AHCT273
HB273
SSOP – DB
TSSOP – PW
TVSOP – DGV
CDIP – J
HB273
SN74AHCT273DGVR HB273
SNJ54AHCT273J
SNJ54AHCT273W
SNJ54AHCT273FK
SNJ54AHCT273J
–55°C to 125°C
CFP – W
Tube
SNJ54AHCT273W
SNJ54AHCT273FK
LCCC – FK
Tube
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2002, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHCT273, SN74AHCT273
OCTAL D-TYPE FLIP-FLOPS
WITH CLEAR
SCLS375E – JUNE 1997 – REVISED APRIL 2002
FUNCTION TABLE
(each flip-flop)
INPUTS
OUTPUT
Q
CLK
D
X
H
L
CLR
L
X
↑
L
H
L
H
H
↑
H
L
X
Q
0
logic diagram (positive logic)
1D
2D
3D
4D
5D
13
6D
14
7D
17
8D
18
3
4
7
8
11
CLK
1D
C1
1D
C1
1D
1D
C1
1D
C1
1D
C1
1D
C1
1D
C1
C1
R
R
R
R
R
R
R
R
1
CLR
2
5
6
9
12
5Q
15
6Q
16
7Q
19
8Q
1Q
2Q
3Q
4Q
logic diagram, each flip-flop (positive logic)
C
C
D
TG
C
TG
C
Q
C
C
TG
CLK(I)
TG
C
C
C
C
R
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHCT273, SN74AHCT273
OCTAL D-TYPE FLIP-FLOPS
WITH CLEAR
SCLS375E – JUNE 1997 – REVISED APRIL 2002
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
I
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V
+ 0.5 V
O
CC
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 mA
IK
I
Output clamp current, I
(V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through V
Package thermal impedance, θ (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±75 mA
JA
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54AHCT273 SN74AHCT273
UNIT
MIN
4.5
2
MAX
MIN
4.5
2
MAX
V
V
V
V
V
Supply voltage
5.5
5.5
V
V
CC
IH
IL
High-level input voltage
Low-level input voltage
Input voltage
0.8
5.5
0.8
5.5
V
0
0
0
0
V
I
Output voltage
V
V
V
O
CC
CC
I
I
High-level output current
Low-level output current
Input transition rise or fall time
Operating free-air temperature
–8
–8
mA
mA
ns/V
°C
OH
OL
8
8
20
85
∆t/∆v
20
T
–55
125
–40
A
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHCT273, SN74AHCT273
OCTAL D-TYPE FLIP-FLOPS
WITH CLEAR
SCLS375E – JUNE 1997 – REVISED APRIL 2002
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
A
= 25°C
TYP
SN54AHCT273 SN74AHCT273
PARAMETER
TEST CONDITIONS
= –50
V
UNIT
CC
MIN
4.4
MAX
MIN
4.4
MAX
MIN
4.4
MAX
I
A
4.5
OH
V
4.5 V
4.5 V
V
OH
OL
3.94
3.8
3.8
I
= –8 mA
OH
OL
I
= 50
A
0.1
0.36
±0.1
4
0.1
0.44
±1*
40
0.1
0.44
±1
V
V
I
= 8 mA
OL
I
I
V = 5.5 V or GND
0 V to 5.5 V
5.5 V
A
A
I
I
V = V
or GND,
I = 0
O
40
CC
I
CC
One input at 3.4 V,
Other inputs at V
†
5.5 V
5 V
1.35
10
1.5
1.5
10
A
∆I
CC
or GND
CC
V = V or GND
CC
C
2.5
pF
i
I
* On products compliant to MIL-PRF-38535, this parameter is not production tested at V
This is the increase in supply current for each input at one of the specified TTL voltage levels rather than 0 V or V
CC
= 0 V.
CC
†
.
timing requirements over recommended operating free-air temperature range, V
(unless otherwise noted) (see Figure 1)
= 5 V ± 0.5 V
CC
T
= 25°C
SN54AHCT273 SN74AHCT273
A
UNIT
MIN
5
MAX
MIN
6
MAX
MIN
6
MAX
CLR low
t
Pulse duration
ns
w
CLK high or low
Data before CLK↑
CLR before CLK↑
5
6.5
5
6.5
5
5
t
t
ns
ns
Setup time
su
2.5
0
2.5
0
2.5
0
Hold time, data after CLK↑
h
switching characteristics over recommended operating free-air temperature range,
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
V
CC
T = 25°C
A
SN54AHCT273 SN74AHCT273
FROM
(INPUT)
TO
LOAD
PARAMETER
UNIT
(OUTPUT) CAPACITANCE
MIN
TYP
MAX
MIN
65**
45
MAX
MIN
65
45
1
MAX
C
C
C
= 15 pF
= 50 pF
= 15 pF
75** 120**
L
L
L
f
MHz
ns
max
50
75
7.5**
5.5**
5.8**
8.5
t
t
t
t
t
t
t
10**
7.5**
8.2**
11
1** 11.6**
11.6
8.8
10
CLR
CLK
Q
Q
Q
Q
PHL
PLH
PHL
PHL
PLH
PHL
sk(o)
1**
1**
1
8.8**
10**
12.6
9.8
1
C
C
C
C
= 15 pF
= 50 pF
= 50 pF
= 50 pF
ns
L
L
L
L
1
1
12.6
9.8
11
ns
CLR
CLK
6.5
8.5
1
1
ns
6.8
9.2
1
11
1
1***
1
ns
** On products compliant to MIL-PRF-38535, this parameter is not production tested.
*** On products compliant to MIL-PRF-38535, this parameter does not apply.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHCT273, SN74AHCT273
OCTAL D-TYPE FLIP-FLOPS
WITH CLEAR
SCLS375E – JUNE 1997 – REVISED APRIL 2002
noise characteristics, V
= 5 V, C = 50 pF, T = 25°C (see Note 4)
CC
L
A
SN74AHCT273
UNIT
PARAMETER
MIN
TYP
MAX
V
V
V
V
V
Quiet output, maximum dynamic V
0.76
V
V
V
V
V
OL(P)
OL(V)
OH(V)
IH(D)
IL(D)
OL
Quiet output, minimum dynamic V
Quiet output, minimum dynamic V
High-level dynamic input voltage
Low-level dynamic input voltage
–0.48
OL
4.4
2
OH
0.8
NOTE 4: Characteristics are for surface-mount packages only.
operating characteristics, T = 25°C
A
PARAMETER
TEST CONDITIONS
No load, f = 1 MHz
TYP
UNIT
C
Power dissipation capacitance
27
pF
pd
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHCT273, SN74AHCT273
OCTAL D-TYPE FLIP-FLOPS
WITH CLEAR
SCLS375E – JUNE 1997 – REVISED APRIL 2002
PARAMETER MEASUREMENT INFORMATION
V
CC
Open
GND
S1
R
= 1 kΩ
L
TEST
S1
From Output
Under Test
Test
Point
From Output
Under Test
t
t
/t
Open
PLH PHL
/t
C
C
L
t
V
CC
L
PLZ PZL
/t
(see Note A)
(see Note A)
GND
PHZ PZH
Open Drain
V
CC
LOAD CIRCUIT FOR
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
3-STATE AND OPEN-DRAIN OUTPUTS
3 V
1.5 V
Timing Input
0 V
t
w
t
h
3 V
t
su
3 V
0 V
1.5 V
1.5 V
Input
Input
1.5 V
1.5 V
Data Input
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3 V
0 V
3 V
0 V
Output
Control
1.5 V
1.5 V
1.5 V
1.5 V
t
t
t
t
t
PZL
PLZ
PLH
PHL
Output
Waveform 1
V
≈V
OH
CC
In-Phase
Output
50% V
50% V
50% V
CC
50% V
CC
CC
V
S1 at V
(see Note B)
CC
V
V
+ 0.3 V
OL
V
OL
OL
t
t
t
PHL
PLH
PZH
PHZ
Output
Waveform 2
S1 at GND
V
OH
V
OH
Out-of-Phase
Output
– 0.3 V
OH
50% V
50% V
CC
CC
CC
V
≈0 V
(see Note B)
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. includes probe and jig capacitance.
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t ≤ 3 ns, t ≤ 3 ns.
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
SN74AHCT273DBR
SN74AHCT273DBRE4
SN74AHCT273DBRG4
SN74AHCT273DGVR
SN74AHCT273DGVRE4
SN74AHCT273DGVRG4
SN74AHCT273DW
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP
DB
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
SSOP
TVSOP
TVSOP
TVSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
DB
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DGV
DGV
DGV
DW
DW
DW
DW
DW
DW
N
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74AHCT273DWE4
SN74AHCT273DWG4
SN74AHCT273DWR
SN74AHCT273DWRE4
SN74AHCT273DWRG4
SN74AHCT273N
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74AHCT273NE4
PDIP
N
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74AHCT273NSR
SN74AHCT273NSRE4
SN74AHCT273NSRG4
SN74AHCT273PWR
SN74AHCT273PWRE4
SN74AHCT273PWRG4
SO
NS
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
NS
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
NS
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
PW
PW
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74AHCT273DBR
SN74AHCT273DGVR
SN74AHCT273DWR
SN74AHCT273NSR
SN74AHCT273PWR
SSOP
TVSOP
SOIC
DB
DGV
DW
NS
20
20
20
20
20
2000
2000
2000
2000
2000
330.0
330.0
330.0
330.0
330.0
16.4
12.4
24.4
24.4
16.4
8.2
6.9
7.5
5.6
2.5
1.6
2.7
2.5
1.6
12.0
8.0
16.0
12.0
24.0
24.0
16.0
Q1
Q1
Q1
Q1
Q1
10.8
8.2
13.0
13.0
7.1
12.0
12.0
8.0
SO
TSSOP
PW
6.95
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74AHCT273DBR
SN74AHCT273DGVR
SN74AHCT273DWR
SN74AHCT273NSR
SN74AHCT273PWR
SSOP
TVSOP
SOIC
DB
DGV
DW
NS
20
20
20
20
20
2000
2000
2000
2000
2000
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
38.0
35.0
45.0
45.0
38.0
SO
TSSOP
PW
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,23
0,13
M
0,07
0,40
24
13
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–ā8°
0,75
1
12
0,50
A
Seating Plane
0,08
0,15
0,05
1,20 MAX
PINS **
14
16
20
24
38
48
56
DIM
A MAX
A MIN
3,70
3,50
3,70
3,50
5,10
4,90
5,10
4,90
7,90
7,70
9,80
9,60
11,40
11,20
4073251/E 08/00
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Audio
Applications
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
www.ti.com/security
Medical
Logic
Security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense www.ti.com/space-avionics-defense
microcontroller.ti.com
www.ti-rfid.com
Video and Imaging
www.ti.com/video
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
SN74AHCT273DBLE 相关器件
型号 | 制造商 | 描述 | 价格 | 文档 |
SN74AHCT273DBR | TI | OCTAL D-TYPE FLIP-FLOPS WITH CLEAR | 获取价格 |
![]() |
SN74AHCT273DBRE4 | TI | OCTAL D-TYPE FLIP-FLOPS WITH CLEAR | 获取价格 |
![]() |
SN74AHCT273DBRG4 | TI | OCTAL D-TYPE FLIP-FLOPS WITH CLEAR | 获取价格 |
![]() |
SN74AHCT273DGV | TI | OCTAL D-TYPE FLIP-FLOPS WITH CLEAR | 获取价格 |
![]() |
SN74AHCT273DGVR | TI | OCTAL D-TYPE FLIP-FLOPS WITH CLEAR | 获取价格 |
![]() |
SN74AHCT273DGVRE4 | TI | OCTAL D-TYPE FLIP-FLOPS WITH CLEAR | 获取价格 |
![]() |
SN74AHCT273DGVRG4 | TI | OCTAL D-TYPE FLIP-FLOPS WITH CLEAR | 获取价格 |
![]() |
SN74AHCT273DW | TI | OCTAL D-TYPE FLIP-FLOPS WITH CLEAR | 获取价格 |
![]() |
SN74AHCT273DWE4 | TI | OCTAL D-TYPE FLIP-FLOPS WITH CLEAR | 获取价格 |
![]() |
SN74AHCT273DWG4 | TI | OCTAL D-TYPE FLIP-FLOPS WITH CLEAR | 获取价格 |
![]() |
SN74AHCT273DBLE 相关文章

- 2025-02-10
- 2


- 2025-02-08
- 14


- 2025-02-08
- 13


- 2025-02-08
- 18
