SN74LV8T594BQBR

更新时间:2024-12-04 10:02:38
品牌:TI
描述:具有逻辑电平转换器的 1.65V 至 5V 八通道移位寄存器 | BQB | 16 | -40 to 125

SN74LV8T594BQBR 概述

具有逻辑电平转换器的 1.65V 至 5V 八通道移位寄存器 | BQB | 16 | -40 to 125

SN74LV8T594BQBR 数据手册

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TPD4F003, TPD6F003, TPD8F003  
www.ti.com  
SLLS907D AUGUST 2008REVISED JANUARY 2010  
FOUR-, SIX-, AND EIGHT-CHANNEL EMI FILTERS WITH INTEGRATED ESD PROTECTION  
Check for Samples: TPD4F003, TPD6F003, TPD8F003  
1
FEATURES  
Four-, Six-, and Eight-Channel EMI Filtering for  
Data Ports  
Space-Saving DQD Packages and  
Flow-Through Pin Mapping Provide Optimum  
Filter Performance  
–3 dB Bandwidth 200 MHz  
Greater than 25dB attenuation at 1 GHz  
APPLICATIONS  
Robust ESD Protection Exceeds IEC61000-4-2  
(Level 4)  
LCD Display Interfaces  
Cell Phones  
SVGA Video Connections  
Personal Digital Assistants (PDAs)  
±15-kV Human-Body Model (HBM)  
±12-kV IEC 61000-4-2 Contact Discharge  
±20-kV IEC 61000-4-2 Air-Gap Discharge  
Pi-Style (C-R-C) Filter Configuration  
(R = 100 , CTOTAL = 17 pF)  
Low 10-nA Leakage Current  
DQD PACKAGE  
(TOP VIEW)  
TPD4F003  
TPD6F003  
TPD8F003  
Ch1_In  
Ch2_In  
Ch3_In  
Ch4_In  
Ch1_Out  
Ch2_Out  
Ch3_Out  
Ch4_Out  
Ch1_In  
Ch2_In  
Ch3_In  
Ch4_In  
Ch5_In  
Ch6_In  
Ch1_Out  
Ch2_Out  
Ch3_Out  
Ch4_Out  
Ch5_Out  
Ch6_Out  
Ch1_In  
Ch2_In  
Ch3_In  
Ch4_In  
Ch5_In  
Ch6_In  
Ch7_In  
Ch8_In  
Ch1_Out  
Ch2_Out  
Ch3_Out  
Ch4_Out  
Ch5_Out  
Ch6_Out  
Ch7_Out  
Ch8_Out  
1
2
3
4
8
7
6
5
1
2
3
4
5
6
12  
11  
10  
9
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
8
1.7 mm x 1.35 mm x 0.75 mm  
(0.4-mm pitch)  
7
2.5 mm x 1.35 mm x 0.75 mm  
(0.4-mm pitch)  
3.3 mm x 1.35 mm x 0.75 mm  
(0.4-mm pitch)  
DESCRIPTION/ORDERING INFORMATION  
The TPD4F003, TPD6F003, and TPD8F003 are 4-, 6-, and 8-channel EMI filters in space-saving 0.4-mm pitch  
DQD packages. The low-pass filter arrays reduce EMI emissions and provide system level ESD protection.  
Because of its small package and easy-to-use pin assignments, the TPDxF003 filters ar suitable for a wide array  
of applications such as mobile handsets, PDAs, video consoles, notebook computers, etc. In particular, these  
filters are ideal for EMI filtering and protecting data lines from ESD at the LCD display, keypad, and memory  
interfaces.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2008–2010, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
TPD4F003, TPD6F003, TPD8F003  
SLLS907D AUGUST 2008REVISED JANUARY 2010  
www.ti.com  
The TPDxF003 are highly integrated device designed to suppress EMI/RFI noise in all systems subjected to  
electromagnetic interferences. These filter series include an ESD protection circuitry which prevents damage to  
the application when subjected to ESD stress far exceeding IEC 61000-4-2 (Level 4).  
The TPDxF003 is specified for –40°C to 85°C operation.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TA  
PACKAGE(1) (2)  
PACKAGE DIMENSION  
TOP-SIDE MARKING  
Length = 1.7 mm, Width = 1.35 mm,  
Pitch = 0.4 mm, Height = 0.75 mm  
TPD4F003DQDR  
5RS  
47S  
5US  
Length = 2.5 mm, Width = 1.35 mm,  
Pitch = 0.4 mm, Height = 0.75 mm  
–40°C to 85°C  
0.4-mm pitch SON  
TPD6F003DQDR  
TPD8F003DQDR  
Length = 3.3 mm, Width = 1.35 mm,  
Pitch = 0.4 mm, Height = 0.75 mm  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
EQUIVALENT SCHEMATIC REPRESENTATION  
100 Ω  
Ch_Out  
Ch_In  
8.5 pF  
8.5 pF  
GND  
ABSOLUTE MAXIMUM RATINGS(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
MAX UNIT  
VIO  
Tstg  
TJ  
IO to GND  
6
150  
150  
V
Storage temperature range  
Junction temperature  
–65  
°C  
°C  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the  
specifications is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.  
ELECTRICAL CHARACTERISTICS  
TA = –40°C to 85°C (unless otherwise noted)  
PARAMETER  
DC breakdown voltage  
Resistance  
TEST CONDITIONS  
MIN  
6
TYP(1)  
MAX UNIT  
VBR  
R
IIO = 10 mA  
V
85  
100  
8.5  
10  
115  
pF  
C
Capacitance (C1 or C2)  
Channel leakage current  
Cut-off frequency  
VIO = 2.5 V  
VIO = 3.3 V  
IIO  
fC  
nA  
ZSOURCE = 50 , ZLOAD = 50 Ω  
200  
MHz  
(1) Typical values are at TA = 25°C.  
2
Submit Documentation Feedback  
Copyright © 2008–2010, Texas Instruments Incorporated  
Product Folder Link(s): TPD4F003 TPD6F003 TPD8F003  
TPD4F003, TPD6F003, TPD8F003  
www.ti.com  
SLLS907D AUGUST 2008REVISED JANUARY 2010  
ESD PROTECTION  
TYP UNIT  
Human-Body Model (HBM)  
±15  
±12  
±20  
kV  
kV  
kV  
IEC 61000-4-2 Contact Discharge  
IEC 61000-4-2 Air-Gap Discharge  
TYPICAL CHARACTERISTCS  
IEC Clamping Waveforms  
(clamp voltage measured both at Ch_Out and Ch_In)  
140  
120  
100  
80  
140  
120  
100  
80  
Ch_In  
Ch_Out  
Ch_In  
Ch_Out  
60  
60  
40  
40  
20  
20  
0
0
-20  
-40  
-20  
-40  
0
25  
50  
75  
100  
125  
150  
175  
200  
0
25  
50  
75  
100  
Time (ns)  
125  
150  
175  
200  
Time (ns)  
Figure 1. With 8 kV Contact ESD Stress at Ch_Out  
Figure 2. With 12 kV Contact ESD Stress at Ch_Out  
40  
40  
20  
0
20  
0
Ch_In  
Ch_Out  
Ch_In  
Ch_Out  
-20  
-20  
-40  
-40  
-60  
-60  
-80  
-80  
-100  
-120  
-140  
-100  
-120  
-140  
0
25  
50  
75  
100  
Time (ns)  
125  
150  
175  
200  
0
25  
50  
75  
100  
Time (ns)  
125  
150  
175  
200  
Figure 3. With -8 kV Contact ESD Stress at Ch_Out  
Figure 4. With -12 kV Contact ESD Stress at Ch_Out  
Copyright © 2008–2010, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Link(s): TPD4F003 TPD6F003 TPD8F003  
TPD4F003, TPD6F003, TPD8F003  
SLLS907D AUGUST 2008REVISED JANUARY 2010  
www.ti.com  
0
0.001  
0.0008  
0.0006  
0.0004  
0.0002  
0
-5  
TPD8F003  
TPD6F003  
TPD4F003  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
-45  
TPD8F003  
3dB drop/Bias of 0.0V  
-3dB = 198MHz  
Peak/Freq/Db  
= 2.57/45 GHz/dB  
TPD6F003  
3dB drop/Bias of 0.0V  
-3dB = 197MHz  
Peak/Freq/Db  
= 2.30/47 GHz/dB  
TPD4F003  
3dB drop/Bias of 0.0V  
-3dB = 197MHz  
Peak/Freq/Db  
= 2.25/45 GHz/dB  
-0.0002  
-0.0004  
-0.0006  
-0.0008  
-0.001  
-50  
1.00E+06  
1.00E+07  
1.00E+08  
1.00E+09  
1.00E+10  
Frequency (Hz)  
-4  
-2  
0
2
4
6
8
Voltage (V)  
Figure 5. Frequency Response  
Figure 6. DC Voltage-Current Sweep Across Input/Output Pins  
Channel-to-Channel Crosstalk  
0
0
-5  
-5  
Adjacent Signal Pair  
Farthest Signal Pair  
Adjacent Signal Pair  
Farthest Signal Pair  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
-45  
-50  
-55  
-60  
-65  
-70  
-75  
-80  
-85  
-90  
-95  
-100  
-105  
-110  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
-45  
-50  
-55  
-60  
-65  
-70  
-75  
-80  
-85  
-90  
-95  
-100  
-105  
-110  
1.00E+05  
1.00E+06  
1.00E+07  
1.00E+08  
1.00E+09  
1.00E+10  
1.00E+05  
1.00E+06  
1.00E+07  
1.00E+08  
1.00E+09  
1.00E+10  
Frequency (Hz)  
Frequency (Hz)  
Figure 7. TPD4F003  
Figure 8. TPD6F003  
0
-5  
Adjacent Signal pair  
Farthest Signal Pair  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
-45  
-50  
-55  
-60  
-65  
-70  
-75  
-80  
-85  
-90  
-95  
-100  
-105  
-110  
1.00E+05  
1.00E+06  
1.00E+07  
1.00E+08  
1.00E+09  
1.00E+10  
Frequency (Hz)  
Figure 9. TPD8F003  
4
Submit Documentation Feedback  
Copyright © 2008–2010, Texas Instruments Incorporated  
Product Folder Link(s): TPD4F003 TPD6F003 TPD8F003  
PACKAGE OPTION ADDENDUM  
www.ti.com  
19-Feb-2010  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
TPD4F003DQDR  
TPD6F003DQDR  
TPD8F003DQDR  
ACTIVE  
ACTIVE  
ACTIVE  
WSON  
WSON  
WSON  
DQD  
8
3000  
3000  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
DQD  
12  
16  
DQD  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
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