概述
规格参数
数据手册UC3724N 概述
Isolated Drive Transmitter 8-PDIP 0 to 70 MOSFET 驱动器
UC3724N 规格参数
| 是否无铅： | 含铅 | 是否Rohs认证： | 不符合 |
| 生命周期： | Obsolete | 零件包装代码： | DIP |
| 包装说明： | DIP, DIP8,.3 | 针数： | 8 |
| Reach Compliance Code： | not_compliant | ECCN代码： | EAR99 |
| HTS代码： | 8542.39.00.01 | 风险等级： | 5.86 |
| 高边驱动器： | YES | 接口集成电路类型： | BUFFER OR INVERTER BASED MOSFET DRIVER |
| JESD-30 代码： | R-PDIP-T8 | 长度： | 9.78 mm |
| 功能数量： | 1 | 端子数量： | 8 |
| 最高工作温度： | 70 °C | 最低工作温度： | |
| 标称输出峰值电流： | 0.5 A | 封装主体材料： | PLASTIC/EPOXY |
| 封装代码： | DIP | 封装等效代码： | DIP8,.3 |
| 封装形状： | RECTANGULAR | 封装形式： | IN-LINE |
| 峰值回流温度（摄氏度）： | NOT SPECIFIED | 电源： | 20 V |
| 认证状态： | Not Qualified | 座面最大高度： | 5.33 mm |
| 子类别： | Other Interface ICs | 最大供电电压： | 35 V |
| 最小供电电压： | 8 V | 标称供电电压： | 20 V |
| 表面贴装： | NO | 技术： | BIPOLAR |
| 温度等级： | COMMERCIAL | 端子形式： | THROUGH-HOLE |
| 端子节距： | 2.54 mm | 端子位置： | DUAL |
| 处于峰值回流温度下的最长时间： | NOT SPECIFIED | 断开时间： | 0.25 µs |
| 接通时间： | 0.25 µs | 宽度： | 7.62 mm |
| Base Number Matches： | 1 |
UC3724N 数据手册
通过下载UC3724N数据手册来全面了解它。这个PDF文档包含了所有必要的细节，如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载UC1724
UC2724
UC3724
Isolated Drive Transmitter
FEATURES
DESCRIPTION
• 500mA Output Drive, Source or Sink
The UC1724 family of Isolated Drive Transmitters, along with the UC1725
Isolated Drivers, provide a unique solution to driving isolated power
MOSFET gates. They are particularly suited to drive the high-side devices
on a high-voltage H-bridge. The UC1724 devices transmit drive logic, and
drive power, to the isolated gate circuit using a low cost pulse transformer.
• 8 to 35V Operation
• Transmits Logic Signal Instantly
• Programmable Operating Frequency
• Under-Voltage Lockout
This drive system utilizes a duty-cycle modulation technique that gives in-
stantaneous response to the drive control transistions, and reliably passes
steady-state, or DC, conditions. High frequency operation, up to 600kHz,
allows the cost and size of the coupling transformer to be minimized.
• Able To Pass DC Information Across
Transformer
These devices will operate over an 8 to 35 Volt supply range. The dual high
current totem pole outputs are disabled by an uder-voltage lockout circuit to
prevent spurious responses during startup or low voltage conditions.
• Up To 600kHz Operation
These devices are available in 8 pin plastic or ceramic dual-inline pack-
ages, as well as 16 pin SOIC package.
BLOCK DIAGRAM
UDG-92037
Note: Pin numbers refer to DIL-8 packages.
04/99
UC1724
UC2724
UC3724
CONNECTION DIAGRAMS
ABSOLUTE MAXIMUM RATINGS
Supply Voltage VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40V
Source/Sink Current (Pulsed) . . . . . . . . . . . . . . . . . . . . . . . . 1A
Source/Sink Current (Continuous) . . . . . . . . . . . . . . . . . . . 0.5A
DIL-8 (Top View)
J Or N Package
+
Ouput Voltage (Pins 4, 6). . . . . . . . . . . . . . . –0.3 to (VIN 0.3)V
PHI, RT, and CT inputs (Pins 1, 7, and 8) . . . . . . . . . –0.3 to 6V
Operating Junction Temperature (Note 2) . . . . . . . . . . . . 150°C
Storage Temperature Range . . . . . . . . . . . . . . –65°C to 150°C
Lead Temperature (Soldering, 10 Seconds) . . . . . . . . . . 300°C
Note 1: All voltages are with respect to GND (Pin 2); all cur-
rents are positive into, negative out of part.
Note 2: Consult Unitrode Integrated Circuit Databook for ther-
mal limitations and considerations of package.
Note 3: Pin numbers refer to DIL-8 packages.
SOIC-16 (Top View)
DW Package
RECOMMENDED OPERATION CONDITIONS
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +9V to +35V
Sink/Source Load Current (each output). . . . . . . . . 0 to 500mA
Timing Resistor. . . . . . . . . . . . . . . . . . . . . . . . . . . 2kW to 10kW
Timing Capacitor . . . . . . . . . . . . . . . . . . . . . . . . . 300pF to 3nF
Operating Temperature Range (UC1724) . . . –55°C<TA<125°C
Operating Temperature Range (UC3724) . . . . . . 0°C<TA<70°C
Note 4: Range over which the device is functional and
parameter limits are guaranteed.
ORDERING INFORMATION
TEMPERATURE RANGE
–55°C to +125°C
PACKAGE
CDIP
UC1724J
UC2724DW
UC2724N
UC3724DW
UC3724N
–25°C to +85°C
SOIC-Wide
PDIP
0°C to +70°C
SOIC-Wide
PDIP
ELECTRICAL CHARACTERISTICS: Unless otherwise stated, VCC = 20V, RT = 4.3kΩ, CT = 1000pF, no load on any
output and these specifications apply for: –55oC < TA < 125oC for the UC1724, –25oC < TA < 85oC for the UC2724, and
0oC < TA < 70oC for the UC3724. TA=TJ.
PARAMETER
Under-Voltage Lockout
TEST CONDITIONS
MIN
TYP
MAX UNITS
Start-Up Threshold
Threshold Hysteresis
Retriggerable One-Shot
Initial Accuracy
V
IN Rising
7.75
1.0
9.5
1.5
V
V
0.4
TJ = 25°C
1.54
1.0
1.9
2.25
2.9
µs
µs
Temperature Stability
Voltage Stability
Over Operating TJ
VIN = 10 to 35V
0.2
0.5
%/V
kHz
ns
Operating Frequency
Minimum Pulse Width
Operating Frequency
LLOAD = 1.4mH
100
100
500
150
500
750
200
1200
1100
RT = 2k CT = 300pF
RT = 2k CT = 300pF LLOAD = 1.4mH
kHz
2
UC1724
UC2724
UC3724
ELECTRICAL CHARACTERISTICS: Unless otherwise stated, VCC = 20V, RT = 4.3kΩ, CT = 1000pF, no load on any
output and these specifications apply for: –55oC < TA < 125oC for the UC1724, –25oC < TA < 85oC for the UC2724, and
0oC < TA < 70oC for the UC3724. TA=TJ.
PARAMETER
Phi Input (Control Input)
TEST CONDITIONS
MIN
TYP
MAX UNITS
HIGH Input Voltage
LOW Input Voltage
HIGH Input Current
LOW Input Current
Delay to One-Shot
Delay to Output
2.0
V
0.8
V
+
VIH = 2.4V
–220 –130
–600 –300
µA
µA
ns
ns
+
VIL = 0.4V
350
250
Output Drivers
Output Low Level
ISINK = 50mA
0.3
0.5
1.5
1.7
30
0.4
2.1
2.1
2.5
90
V
V
ISINK = 250mA
ISOURCE = 50 mA
ISOURCE = 250 mA
No load
Output High Level (Volts Below VCC
)
V
V
Rise/Fall Time
Total Supply Current
Supply Current
ns
CT = 1.4V
15
30
mA
Additional Information
Please refer to the following Unitrode application topics.
[1] Application Note U-127, Unique Chip Pair Simplified
Isolated High-Side Switch Drive by John A. O’Connor.
[2] Design Note DN-35, IGBT Drive Using MOSFET Gate
Drivers by John A. O’Conner.
UDG-92038
Figure 1. Typical application
UNITRODE CORPORATION
7 CONTINENTAL BLVD. • MERRIMACK, NH 03054
TEL. (603) 424-2410 FAX (603) 424-3460
3
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CDIP
PDIP
SOIC
SOIC
CDIP
PDIP
Drawing
UC1724J
UC2724J
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
J
J
8
8
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Call TI
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UC2724N
P
8
UC3724DW
UC3724DWTR
UC3724J
DW
DW
J
16
16
8
UC3724N
P
8
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
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information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
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UC3724N 相关器件
| 型号 | 制造商 | 描述 | 价格 | 文档 |
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