UCD7230RG
更新时间：2025-01-13 15:11:56
品牌：TI
描述：IC 0.02 A BUF OR INV BASED MOSFET DRIVER, QCC20, GREEN, QFN-20, MOSFET Driver
概述
规格参数
数据手册UCD7230RG 概述
IC 0.02 A BUF OR INV BASED MOSFET DRIVER, QCC20, GREEN, QFN-20, MOSFET Driver MOSFET 驱动器
UCD7230RG 规格参数
| 生命周期： | Obsolete | 零件包装代码： | QFN |
| 包装说明： | QCCN, | 针数： | 20 |
| Reach Compliance Code： | unknown | ECCN代码： | EAR99 |
| HTS代码： | 8542.39.00.01 | 风险等级： | 5.75 |
| 高边驱动器： | YES | 接口集成电路类型： | BUFFER OR INVERTER BASED MOSFET DRIVER |
| JESD-30 代码： | S-XQCC-N20 | JESD-609代码： | e4 |
| 功能数量： | 1 | 端子数量： | 20 |
| 最高工作温度： | 125 °C | 最低工作温度： | -40 °C |
| 标称输出峰值电流： | 0.02 A | 封装主体材料： | UNSPECIFIED |
| 封装代码： | QCCN | 封装形状： | SQUARE |
| 封装形式： | CHIP CARRIER | 认证状态： | Not Qualified |
| 最大供电电压： | 15.5 V | 最小供电电压： | 4.5 V |
| 标称供电电压： | 12 V | 表面贴装： | YES |
| 技术： | BICMOS | 温度等级： | AUTOMOTIVE |
| 端子面层： | NICKEL PALLADIUM GOLD | 端子形式： | NO LEAD |
| 端子位置： | QUAD | Base Number Matches： | 1 |
UCD7230RG 数据手册
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PDF下载UCD7230
www.ti.com
SLUS741D –NOVEMBER 2006–REVISED JANUARY 2010
Digital Control Compatible Synchronous Buck Gate Drivers with Current Sense
Conditioning Amplifier
Check for Samples: UCD7230
1
FEATURES
APPLICATIONS
•
Digitally-Controlled Synchronous-Buck Power
Stages for Single and Multi-Phase
Applications
Especially Suited for Use with UCD91xx or
UCD95xx Contollers
High-Current Multi-Phase VRM/EVRD
Regulators for Desktop, Server, Telecom and
Notebook Processors
Digitally-Controlled Synchronous-Buck Power
Supplies Using mCs or the TMS320TM DSP
Family
2
•
Input from Digital Controller Sets Operating
Frequency and Duty Cycle
•
•
Up to 2-MHz Switching Frequency
•
•
Dual Current Limit Protection with
Independently Adjustable Thresholds
•
Fast Current Sense Circuit with Adjustable
Blanking Interval Prevents Catastrophic
Current Levels
•
•
•
Digital Output Current Limit Flag
Low Offset, Gain of 48, Differential Current
Sense Amplifier
DESCRIPTION
•
•
•
3.3-V, 10-mA Internal Regulator
The UCD7230 is part of the UCD7K family of digital
control compatible drivers for applications utilizing
digital control techniques or applications requiring fast
local peak current limit protection.
Dual TrueDrive™ High-Current Drivers
10-ns Typical Rise/Fall Times with 2.2-nF
Loads
•
4.5-V to 15.5-V Supply Voltage Range
VIN
VOUT
CS
VDD
CS+
BST
OUT1
SW
PVDD
OUT2
PGND
BIAS
IO
+
0.6 V
+
UVLO
IDLY
POS
NEG
48x
Drive andDead-Time
ControlLogic
(D;1-D)
Enable
3V3
REG
3V3
BIAS
Blank
AGND
AO
IN
ILOAD
PWM
SRE
Over
Current
ILIM
CLF
SRE
DLY
IMAX
Current
Limit Logic
ILIM/10
IDLY
CLF
+
UCD7230
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
TrueDrive, PowerPAD are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2010, Texas Instruments Incorporated
UCD7230
SLUS741D –NOVEMBER 2006–REVISED JANUARY 2010
www.ti.com
The UCD7230 is a MOSFET gate driver specifically designed for synchronous buck applications. It is ideally
suited to provide the bridge between digital controllers such as the UCD91xx or the UCD95xx and the power
stage. With cycle-by-cycle current limit protection, the UCD7230 device protects the power stage from faulty
input signals or excessive load currents.
The UCD7230 includes high-side and low-side gate drivers which utilize Texas Instrument’s TrueDrive™ output
architecture. This architecture delivers rated current into the gate capacitance of a MOSFET during the Miller
plateau region of the switching. Furthermore, the UCD7230 offers a low offset differential amplifier with a fixed
gain of 48. This amplifier greatly simplifies the task of conditioning small current sense signals inherent in high
efficiency buck converters.
The UCD7230 includes a 3.3-V, 10-mA linear regulator to provide power to digital controllers such as the
UCD91xx. The UCD7230 is compatible with standard 3.3-V I/O ports of the UCD91xx, the TMS320TM family
DSPs, mCs, or ASICs.
The UCD7230 is offered in PowerPAD™ HTSSOP or space-saving QFN packages. Package pin out has been
carefully designed for optimal board layout
SIMPLIFIED APPLICATION DIAGRAMS
VIN
UCD7230
CS+ 20
1
2
3
VDD
SRE
IN
UCD9112
2
CSBIAS 19
RB0
ADC3
2
DPWMA0
18
SW
AD33
AVSS
VOUT
4
5
6
17
3V3
OUT1
AGND
DLY
16
BST
RPOS
GSENSE
1
2
PVDD 15
VD25
EAP
14
13
DPWMB0
7
8
9
OUT2
ILIM
CLF
I0
VOUT
RB1/TMRI1
PGND
1
RNEG
NEG 12
POS 11
EAM
GSENSE
ADC2
10 A0
RST
2
COMMUNICATION
(Programming&
StatusReporting)
Figure 1. Single-Phase Synchronous Buck Converter using UCD9112 and one UCD7230
2
Copyright © 2006–2010, Texas Instruments Incorporated
Product Folder Link(s): UCD7230
UCD7230
www.ti.com
SLUS741D –NOVEMBER 2006–REVISED JANUARY 2010
VIN
UCD7230
RB0
1
2
3
VDD
CS+ 20
UCD9112
2
RB0
SRE
IN
CSBIAS 19
ADC3
2
DPWMA0
18
SW
AD33
AVSS
VOUT
4
5
6
17
3V3
OUT1
RPOS1
AGND
DLY
16
BST
GSENSE
2
PVDD 15
VD25
EAP
1
14
13
DPWMB0
7
8
9
OUT2
PGND
ILIM
CLF
I0
VOUT
RB1/TMRI1
RNEG1
1
NEG 12
POS 11
EAM
GSENSE
ADC2
10 A0
RST
UCD7230
1
2
3
VDD
SRE
IN
CS+ 20
CSBIAS 19
SW 18
2
RB0
DPWMA1
2
COMMUNICATION
(Programming &
Status Reporting)
4
5
6
17
3V3
OUT1
RPOS2
AGND
DLY
16
BST
2
PVDD 15
14
7
8
9
DPWMB1
ILIM
CLF
I0
OUT2
13
PGND
RB3/TMRI0
RNEG2
1
NEG 12
POS 11
10 A0
ADC5
2
Figure 2. Multi-Phase Synchronous Buck Converter using UCD9112 and two UCD7230
Copyright © 2006–2010, Texas Instruments Incorporated
3
Product Folder Link(s): UCD7230
UCD7230
SLUS741D –NOVEMBER 2006–REVISED JANUARY 2010
www.ti.com
CONNECTION DIAGRAMS
20 19
18 17
16
3V3
AGND
DLY
1
2
3
15 SW
UCD7230
(QFN -
14 OUT1
13 BST
12 PVDD
11 OUT2
RGW)
(5x5, 0.65)
ILIM
CLF
4
5
6
7
8
9
10
ORDERING INFORMATION(1) (2)
PACKAGED DEVICES
TEMPERATURE RANGE
PowerPAD™ HTSSOP-20 (PWP)
QFN-20 (RGW)
-40°C to + 125°C
UCD7230PWP
UCD7230RGW
(1) These products are packaged in Pb-Free and green lead finish of Pd-Ni-Au which is compatible with MSL level 1 at 255-260°C peak
reflow temperature to be compatible with either lead free or Sn/Pb soldering operations.
(2) QFN-20 (RGW) package is available taped and reeled. Add T suffix to device type (e.g. UCD7230RGW) to order quantities of 1,000
devices per reel.
4
Copyright © 2006–2010, Texas Instruments Incorporated
Product Folder Link(s): UCD7230
UCD7230
www.ti.com
SLUS741D –NOVEMBER 2006–REVISED JANUARY 2010
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
CONDITION
VALUE
16
UNIT
VDD
Supply voltage
BST
V
SW + 16
20
IDD
Quiescent
Supply current
mA
V V
Switching, TA = 25°C, VDD = 12
V
200
VO
OUT1, BST
-1 V to 36
-1 V to VDD+0.3
4.0
Output gate drive voltage
OUT2
IOUT(sink)
OUT1
IOUT(source)
IOUT(sink)
OUT1
-2.0
Output gate drive current
A
OUT2
4.0
IOUT(source)
OUT2
-4.0
SW
-1 to 20
-0.3 to 20
-0.3 to 16
-0.3 to 5.6
-0.3 to 3.6
-0.3 to 3.6
-0.3 to 3.6
2.67
CS+
Analog inputs
CSBIAS
POS, NEG
V
ILIM, DLY, I0
Analog output
Digital I/O’s
A0
IN, SRE, CLF
TA = 25°C (PWP-20 package)
TA = 25°C (QFN-20 package)
Power dissipation
W
TJ
Junction operating temperature
Storage temperature
-55 to 150
-65 to 150
2000
°C
Tstg
HBM
CDM
Human body model
ESD rating
V
Charged device model
500
Lead temperature (soldering, 10 sec)
300
°C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other condition beyond those indicated is not implied. Exposure to absolute
maximum rated conditions for extended periods may affect device reliability. All voltages are with respect to GND. Currents are positive
into, negative out of the specified terminal. Consult company packaging information for thermal limitations and considerations of
packages.
Copyright © 2006–2010, Texas Instruments Incorporated
5
Product Folder Link(s): UCD7230
UCD7230
SLUS741D –NOVEMBER 2006–REVISED JANUARY 2010
www.ti.com
ELECTRICAL CHARACTERISTICS
VDD = PVDD = 12 V, 4.7-mF from VDD to AGND, 1 mF from PVDD to PGND, 0.1 mF from CSBIAS to AGND, 0.22 mF from BST to
SW, TA = TJ = -40°C to +125°C, RCS+ = 5 kΩ, RDLY = 50 kΩ over operating free-air temperature range (unless otherwise
noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY
Supply current, off
Supply current
VDD = 4.2 V
500
5
700
8
mA
Outputs not switching IN = LOW
mA
LOW-VOLTAGE UNDER-VOLTAGE LOCKOUT
VDD UVLO ON
VDD rising
VDD falling
4.25
4.00
100
4.50
4.25
250
4.75
4.50
400
V
VDD UVLO OFF
VDD UVLO hysteresis
REFERENCE / EXTERNAL BIAS SUPPLY
3V3 initial set point
mV
TA = 25°C
3.267
3.234
3.3
3.3
1
3.333
3.366
7
V
3V3 over temperature
3V3 load regulation
ILOAD = 1 mA to 10 mA, VDD = 5V
VDD = 4.75 V to 12 V, ILOAD = 10 mA
VDD = 4.75 V to 12 V
3.3 V rising
mV
mA
V
3V3 line regulation
3
10
Short circuit current
11
2.8
2.6
20
3
3V3 OK threshold, ON
3V3 OK threshold, OFF
INPUT SIGNAL (IN)
3.2
3.0
3.3 V falling
2.8
Positive-going input threshold
INHigh
voltage
1.6
1.0
0.4
1.9
1.3
2.2
1.6
Negative-going input threshold
voltage
INLow
V
INHigh –
Input voltage hysteresis
INLow
0.6
0.8
Input resistance to AGND
Frequency ceiling
50
2
100
150
kΩ
MHz
CURRENT LIMIT (ILIM)
ILIM internal voltage setpoint
ILIM input impedance
ILIM=OPEN
0.47
20
0.50
42
0.53
65
V
kΩ
CLF output high level
ILOAD = 4 mA
ILOAD = 4 mA
2.7
V
CLF output low level
0.6
35
Propagation delay from IN to reset
CLF
2nd IN rising to CLF falling after a
current limit event
15
ns
CURRENT SENSE COMPARATOR (OUTPUT SENSE)
ILIM = open
40
80
60
15
50
100
75
60
120
90
ILIM = 3.3 V
ILIM = 0.75 V
ILIM = 0.25 V
CS threshold (POS - NEG)
mV
ns
25
35
Propagation delay from POS to
OUT1 falling(1)
ILIM = open, CS = threshold + 60 mV
ILIM = open, CS = threshold + 60 mV
90
Propagation delay from POS to
CLF(1)
100
(1) As designed and characterized. Not 100% tested in production.
6
Copyright © 2006–2010, Texas Instruments Incorporated
Product Folder Link(s): UCD7230
UCD7230
www.ti.com
SLUS741D –NOVEMBER 2006–REVISED JANUARY 2010
ELECTRICAL CHARACTERISTICS (continued)
VDD = PVDD = 12 V, 4.7-mF from VDD to AGND, 1 mF from PVDD to PGND, 0.1 mF from CSBIAS to AGND, 0.22 mF from BST to
SW, TA = TJ = -40°C to +125°C, RCS+ = 5 kΩ, RDLY = 50 kΩ over operating free-air temperature range (unless otherwise
noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
CURRENT SENSE COMPARATOR (INPUT SENSE)
RDLY = 24.3 kΩ (CSBIAS-CS+)
RDLY = 49.9 kΩ (CSBIAS-CS+)
170
90
235
114
300
140
CS threshold
mV
RDLY = 24.3 kΩ , IN rising to OUT1,
IN falling to OUT2, VDD = 6 V
120
CS blanking time(2)
RDELAY range(2)
ns
kΩ
ns
RDLY = 49.9 kΩ , IN rising to OUT1,
IN falling to OUT2, VDD = 6 V
230
50.0
80
24.3
100.0
Propagation delay from CS+ to
OUT1(2)
CS = threshold + 60mV
Propagation delay from CS+ to
CLF(2)
70
CURRENT SENSE AMP
I0 = OPEN; POS = NEG = 1.25 V;
measure AO - IO
VOO
Output offset voltage
-100
46
0
48
100
50
mV
V/V
kΩ
V
I0 = FLOAT; VPOS = 1.26 V; VNEG
1.25 V, RPOS = RNEG = 0
=
Closed loop dc gain
POS = 1.25 V, NEG = 1.29 V,R =
Input impedance
5.5
0
8.3
12
(POS - NEG) / (IPOS - INEG
)
VCM(max) is limited to (VDD-1.2V),
RPOS = 0
VCM
Input Common Mode Voltage Range
Minimum Output Voltage
Maximum Output Voltage
Input Bias Current, POS or NEG
5.6
0.3
3.5
30
VPOS = 1.2 V; VNEG = 1.3 V;
A0_ISINK = 250 mA
A0_Vol
A0_Voh
0.15
3.1
V
VPOS =1.3 V; VNEG = 1.2 V; A0_
ISOURCE = 500 mA
3
I0 = FLOAT; VPOS = VNEG = 0.8 V to
5.0 V, RPOS = RNEG = 0
-2
mA
ZERO CURRENT REFERENCE (IO)
Reference voltage
Measured at I0
0.54
10
0.6
60
15
0.66
120
21
V
Input transition voltage
With respect to IO reference
IZERO = 0.6 V
mV
kΩ
IO
Output impedance
10
(2) As designed and characterized. Not 100% tested in production.
Copyright © 2006–2010, Texas Instruments Incorporated
7
Product Folder Link(s): UCD7230
UCD7230
SLUS741D –NOVEMBER 2006–REVISED JANUARY 2010
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
VDD = PVDD = 12 V, 4.7-mF from VDD to AGND, 1 mF from PVDD to PGND, 0.1 mF from CSBIAS to AGND, 0.22 mF from BST to
SW, TA = TJ = -40°C to +125°C, RCS+ = 5 kΩ, RDLY = 50 kΩ over operating free-air temperature range (unless otherwise
noted).
PARAMETER
LOW-SIDE OUTPUT DRIVER (OUT2)
Source current(3)
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VDD = 12 V, IN = high, OUT2 = 5 V
VDD = 12 V, IN = low, OUT2 = 5 V
VDD = 4.75 V, IN = high, OUT2 = 0
2.2
3.5
1.6
(3)
Sink current
Source current(3)
A
VDD = 4.75 V, IN = low, OUT2 =
4.75 V
(3)
Sink current
2
Rise time(3)
Fall time(3)
CLOAD = 2.2 nF, VDD = 12 V
CLOAD = 2.2 nF, VDD = 12 V
VDD = 1.0 V, Isink = 10 mA
15
15
ns
Output with VDD <UVLO
0.8
1.2
V
Propagation delay from IN to
OUT2(3)
CLOAD = 2.2 nF, IN rising, SW = 2.5
V, BST = PVDD = VDD = 12 V
30
ns
HIGH-SIDE OUTPUT DRIVER (OUT1)
VDD = 12 V, BST = 12 V IN = High,
OUT1 = 5 V
Source current(3)
1.7
3.5
1
VDD = 12 V, BST = 12 V IN = Low,
OUT1 = 5 V
(3)
Sink current
A
VDD = 4.75 V = BST = 4.75 V, IN =
High, OUT1 = 0
(3)
Source current
VDD = 4.75 V, BST = 4.75 V, IN =
Low, OUT1 = 4.75 V
(3)
Sink current
2.4
20
15
30
CLOAD = 2.2 nF OUT1 to SW, VDD =
12 V
Rise time(3)
CLOAD = 2.2 nF OUT1 to SW, VDD
12 V
=
(3)
Fall time
ns
Propagation delay from IN to
OUT1(3)
CLOAD = 2.2 nF, IN falling, SW = 2.5
V, BST = PVDD = VDD = 12 V
(3) As designed and characterized. Not 100% tested in production.
8
Copyright © 2006–2010, Texas Instruments Incorporated
Product Folder Link(s): UCD7230
UCD7230
www.ti.com
SLUS741D –NOVEMBER 2006–REVISED JANUARY 2010
DEVICE INFORMATION
TERMINAL FUNCTIONS
TERMINAL
NAME
UCD7230
I/O
DESCRIPTION
HTSSOP-
QFN-20
20
Supply input pin to power the internal circuitry except the driver outputs. The
UCD7230 accepts an input range of 4.5 V to 15.5 V.
VDD
SRE
1
18
-
I
Synchronous Rectifier Enable. The SRE pin is a high impedance digital input
capable of accepting 3.3-V logic level signals, used to disable the synchronous
rectifier switch. The synchronous rectifier is disabled when this signal is low. A
Schmitt trigger input comparator desensitizes this pin from external noise.
2
3
19
20
The IN pin is a high impedance digital input capable of accepting 3.3-V logic
level signals up to 2 MHz. A Schmitt trigger input comparator desensitizes this
pin from external noise.
IN
I
Regulated 3.3-V rail. The onboard linear voltage regulator is capable of
sourcing up to 10 mA of current. Bypass with 0.22-mF ceramic capacitance
from this pin to analog ground, AGND.
3V3
4
5
1
2
O
-
AGND
Analog ground return.
Requires a resistor to AGND for setting the current sense blanking time for
both the high-side and low-side current sense comparators. The value of this
resistor in conjunction with the resistor in series with the CS+ pin sets the high
side current sense threshold.
Output current limit threshold set pin. The output current threshold is 1/10th of
the value set on this pin. If left floating the voltage on this pin is 0.55 V. The
voltage on the ILIM pin can range from 0.25 V to 1V to set the threshold from
25 mV to 100 mV.
DLY
ILIM
6
7
3
4
I
I
Current Limit Flag. The CLF signal is a 3.3-V digital output which is latched
high after an over current event, triggered by either of the two current sense
comparators and reset after two rising edges received on the IN pin.
CLF
IO
8
9
5
6
7
O
I
Sets the current sense linear amplifier “Zero” output level. The default value is
0.6 V which allows negative current measurement.
Current sense linear amplifier output. The output voltage level on this pin
represents the average output current. Any value below the level on the I0 pin
represents negative output current.
AO
10
O
Non-inverting input of the output current sense amplifier and current limit
comparator.
POS
11
12
13
14
8
9
I
I
-
I
Inverting input of the output current sense amplifier and current limit
comparator.
NEG
Power ground return. This pin should be connected close to the source of the
low-side synchronous rectifier MOSFET.
PGND
OUT2
10
11
The low-side high-current TrueDrive™ driver output. Drives the gate of the
low-side synchronous MOSFET between PVDD and PGND.
Supply pin provides power for the output drivers. It is not connected internally
to the VDD supply rail. The bypass capacitor for this pin should be returned to
PGND.
PVDD
15
12
-
Floating OUT1 driver supply powered by an external Schottky diode from the
PVDD pin during the synchronous MOSFET on time.
BST
16
17
13
14
I
I
The high-side high-current TrueDrive™ driver output. Drives the gate of the
high-side buck MOSFET between SW and BST.
OUT1
SW
18
19
15
16
I/O
I
OUT1 gate drive return and square wave input to output inductor.
Supply pin for the high-side current sense comparator.
CSBIAS
Non-inverting Input for the high side current sense comparator. A resistor
connected between this pin and the high side MOSFET drain, in conjunction
with the DLY resistor sets the high-side current limit threshold.
CS+
20
17
I
Copyright © 2006–2010, Texas Instruments Incorporated
9
Product Folder Link(s): UCD7230
UCD7230
SLUS741D –NOVEMBER 2006–REVISED JANUARY 2010
www.ti.com
APPLICATION INFORMATION
Introduction
The UCD7230 is a synchronous buck driver with peak-current limiting. It is a member of the UCD7K family of
digital compatible drivers suitable either for applications utilizing digital control techniques or analog applications
that require local fast peak current limit protection.
In systems using the UCD7230, the feedback loop is closed externally and the IN signal represents the PWM
information required to regulate the output voltage. The PWM signal may be implemented by either a digital or
analog controller.
The UCD7230 has two over-current protection features, one that limits the peak current in the high-side switch
and one that limits the output current. Both limits are individually programmable. The internal current sense
blanking enables ease of design with real-world signals. In addition to over current limit protection, current sense
signals can be conditioned by the on board amplifier for use by the system controller.
Supply Requirements
The UCD7230 operates on a supply range of 4.5 V to 15.5 V. The supply voltage should be applied to three pins,
PVDD, VDD, and CSBIAS. PVDD is the supply pin for the lower driver, and has the greatest current demands.
The supply connection to PVDD is also the point where an external Schottky diode provides current to the high
side flying driver. PVDD should be bypassed to PGND with a low ESR ceramic capacitor. In the same fashion,
the flying driver should be bypassed between BST and SW.
VDD and CSBIAS are less demanding supply pins, and should be resistively coupled to the supply voltage for
isolation from noise generated by high current switching and parasitic board inductance. Use 33 Ω for CSBIAS
and 1 Ω for VDD. VDD should be bypassed to AGND with a 4.7-mF ceramic capacitor while CSBIAS should be
bypassed to AGND with 0.1 mF. Although the three supply pins are not internally connected, they must be biased
to the same voltage. It is important that all bypassing be done with low parasitic inductance techniques to good
ground planes.
PGND and AGND are the ground return connections to the chip. Ground plane construction should be used for
both pins. For a MOSFET driver operating at high frequency, it is critical to minimize the stray inductance to
minimize overshoot, undershoot, and ringing. The low output impedance of the drivers produces waveforms with
high di/dt. This induces ringing in the parasitic inductances. It is highly desirable that the UCD7230 and the
MOSFETs be collocated. PGND and the AGND pins should be connected to the PowerPAD™ of the package
with two thin traces. It is critical to ensure that the voltage potential between these two pins does not exceed 0.3
V.
Although quiescent VDD current is low, total supply current depends on the gate drive output current required for
the capacitive load and the switching frequency. Total supply current is the sum of quiescent VDD current and
the average OUT current. Knowing the operating frequency and the MOSFET gate charge (Qg), average OUT
current can be calculated from (IOUT = Qg x f), where f is the operating frequency.
Reference / External Bias Supply
The UCD7230 includes a series pass regulator to provide a regulated 3.3 V at the 3V3 pin that can be used to
power other circuits such as the UCD91xx, a microcontroller or an ASIC. 3V3 can source 10 mA of current. For
normal operation, place a 0.22-mF ceramic capacitor between 3V3 and AGND.
Control Inputs
IN and SRE are high impedance digital inputs designed for 3.3-V logic-level signals. They both have 100-kΩ
pull-down resistors. Schmitt Trigger input stage design immunizes the internal circuitry from external noise. IN is
the command input for the upper driver, OUT1, and can function up to 2 MHz. SRE controls the function of the
lower driver, OUT2. When SRE is false (low), OUT2 is held low. When SRE is true, OUT2 is inverted from OUT1
with appropriate delays that preclude cross conduction in the Buck MOSFETs.
10
Copyright © 2006–2010, Texas Instruments Incorporated
Product Folder Link(s): UCD7230
UCD7230
www.ti.com
SLUS741D –NOVEMBER 2006–REVISED JANUARY 2010
Driver Stages
The driver outputs utilize Texas Instruments’ TrueDrive™ architecture, which delivers rated current into the gate
of a MOSFET when it is most needed, during the Miller plateau region of the switching transition. This provides
best switching speeds and reduces switching losses. TrueDrive™ consists of pull-up/ pull-down circuits using
bipolar and MOSFET transistors in parallel. This hybrid output stage also allows relatively constant current
sourcing even at reduced supply voltages.
The low-side high-current output stage of the UCD7230 device is capable of sourcing 1.7-A and sinking 3.5-A
current pulses and swings from PVDD to PGND. The high-side floating output driver is capable of sourcing 2.2-A
and sinking 3.5-A peak-current pulses. This ratio of gate currents, common to synchronous buck applications,
minimizes the possibility of parasitic turn on of the low-side power MOSFET due to dv/dt currents during the
rising edge switching transition. See the typical curves of sink and source current in Figure 3 and Figure 4 below.
If further limiting of the rise or fall times to the power device is desired, an external resistance can be added
between the output of the driver and the power MOSFET gate. The external resistor also helps remove power
dissipation from the driver.
Driver outputs follow IN and SRE as previously described provided that VDD and 3V3 are above their respective
under-voltage lockout thresholds. When the supplies are insufficient, the chip holds both OUT1 and OUT2 low.
It is worth reiterating the need mentioned in the supply section for sound high frequency design techniques in the
circuit board layout and bypass capacitor selection and placement. Some applications may generate excessive
ringing at the switch-inductor node. This ringing can drag SW to negative voltages that might cause functional
irregularities. To prevent this, carefull board layout and appropriate snubbing are essential. In addition, it may be
appropriate to couple SW to the inductor with a 1-Ω resistor, and then bypass SW to PGND with a low
impedance Schottky diode.
OUT1 SOURCE/SINK CURRENT
vs
OUT1 VOLTAGE WITH RESPECT TO SW VOLTAGE
OUT2 SOURCE/SINK CURRENT
vs
OUT2 VOLTAGE
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
5.0
Source Current
VDD = 12 V
4.5
Sink Current
VDD = 12 V
Sink Current
VDD = 12 V
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
Source Current
VDD = 12 V
Sink Current
VDD = 5 V
Sink Current
VDD = 5 V
Source Current
VDD = 5 V
Source Current
VDD = 5 V
0
1
2
3
4
5
6
0
1
2
3
4
5
6
OUT2 - V
OUT1 - SW - V
Figure 3.
Figure 4.
Copyright © 2006–2010, Texas Instruments Incorporated
11
Product Folder Link(s): UCD7230
UCD7230
SLUS741D –NOVEMBER 2006–REVISED JANUARY 2010
www.ti.com
Current Sensing and Overload Protection
Since the UCD7230 is physically collocated with the high-current elements of the power converter, it is logical
that current be monitored by the chip. An internal instrumentation amplifier conditions current sense signals so
that they can be used by the control chip generating the PWM signal.
POS and NEG are inputs to an instrumentation amplifier circuit. This amplifier has a nominal gain of 48 and
presents its output at AO. This can be used to monitor either an external current sense shunt or a parallel RC
around the buck inductor shown in Figure 5. The shunt yields the highest accuracy and will be insensitive to
inductor core saturation effects. It comes with the price of added power dissipation. Using the shunt, AO is given
by:
AO = ( 48´ IOUT ´ RSHUNT )+ IO
(1)
The internal configuration of the instrumentation amplifier is such that AO is 0.6 V when POS – NEG = 0.
Because of this output offset, the amplifier can accurately pass information for both positive and negative load
current. The offset is controlled by IO. If IO is left to float, the offset is 0.6 V. 0.6 V is present at IO through an
internal 10-kΩ resistor and should be bypassed to AGND. If a higher value of offset is desired, a voltage in
excess of 0.66 V can be externally applied to IO. Once IO is forced above 0.66 V, the internal 10 kΩ is
disconnected, and the AO output offset is now equal to the voltage applied to IO.
+
I0
SW
SW
I0
+
IO Buffer
Amp
8.33kΩ
400kΩ
RPOS
POS
IO Buffer
Amp
L
8.33kΩ
400kΩ
CurrentSenseAmp
+
POS
L
+
R
C
CurrentSenseAmp
+
RNEG
8.33kΩ
400kΩ
RSHUNT
NEG
AO
8.33kΩ
400kΩ
NEG
AO
VOUT
COUT
VOUT
COUT
Figure 5. Current Sense Using External Shunt and Lossless Average Output Current Sensing Using DC
Resistance of the Output Inductor.
Figure 5 also shows lossless current sensing utilizing an RC across the buck inductor to generate an analog of
the IR drop on the copper of the inductor. As long as the RPOS x C time constant is the same as the L/R of the
inductor and its parasitic equivalent series resistance, then the voltage on C is the same as the IR drop on the
parasitic inductor resistance. A resistor, RNEG = RPOS is used for amplifier bias current cancellation. The transfer
function of the amplifier is given by:
AO = ( A´ IOUT ´ RCOPPER )+ IO
(2)
12
Copyright © 2006–2010, Texas Instruments Incorporated
Product Folder Link(s): UCD7230
UCD7230
www.ti.com
SLUS741D –NOVEMBER 2006–REVISED JANUARY 2010
With the addition of RPOS and RNEG, the natural gain, A, of the current sense is predictably decreased as:
48
A =
æ
ö
RPOS
1+
ç
è
÷
ø
8.33 kW
(3)
For RPOS << 8.33 kΩ, the gain is 48. While the 400 kΩ and 8.33 kΩ are well matched, it is important to keep
RPOS as small as possible since they have absolute variation from chip-to-chip and over temperature. The graph
in Figure 6 shows the band of expected gain for A as a function of RPOS. The gain variation at RPOS = 1 kΩ
results in around ±4% error. However, the tolerance of the value of R in the inductor has a more significant effect
on measurement accuracy as does the temperature coefficient of R. Copper has a temperature coefficient of
approximately 3800 ppm/°C. For a 100°C rise in winding temperature, the dc resistance of the inductor increases
by 38%. The worst case scenario would be a cracked core or under-designed inductor in which cases the core
could tend towards saturation. In that scenario, inductor current could change slope drastically and is not
correctly modeled by the capacitor voltage.
Note that inferring inductor current by use of a parallel RC has an additional caveat. As long as TRC = RPOS C is
the same as TLR = L/R, then the voltage across C is the same as the IR drop across the equivalent R of the
inductor. If the time constants don't match, the average voltage across C is still the same as the average voltage
across R, but the indication of ripple current amplitude will be off. Furthermore, load transients results in reported
current that appears to have overshoot or undershoot if TRC is respectively faster or slower than TLR
.
While the amp faithfully passes the sensed dc current signal, it should be noted that the amplifier is bandwidth
limited for normal switching frequencies. Therefore, AO represents a moving average of the sensed current.
Current Sense AMP Gain
vs
RPOS
49
48
47
46
45
44
43
Maximum Gain Corner
(minimum sheet and Cold
temperature)
42
41
40
Normal Gain
39
38
37
36
35
Minimum Gain Corner
(minimum sheet and hot
temperature)
0
500
1000
1500
2000
RPOS - W
Figure 6. Current Sense Amp Gain as a Function of RPOS
Copyright © 2006–2010, Texas Instruments Incorporated
13
Product Folder Link(s): UCD7230
UCD7230
SLUS741D –NOVEMBER 2006–REVISED JANUARY 2010
www.ti.com
The amp output can go up to 3.3 V, so reasonable designs limits full scale to 3.0 V. Should attenuation be
necessary, use a resistive divider between AO and the control chip A/D input as shown in Figure 7.
To
A/D
A0
Figure 7. Attenuating and Filtering the Voltage Representation of the Average Output Current
While the current sense amplifier is useful for accurate current monitoring or controlling overload conditions,
extreme overload conditions must be handled in timeframes that are generally much shorter than the A/D of a
control chip can achieve. Therefore, there are two comparators on the UCD7230 to sense extreme overload and
protect the driven power MOSFETs.
Extreme current overload is handled in two ways by the UCD7230. One is a comparator that monitors the
voltage between POS and NEG, or effectively the output current of the converter.. The other is a comparator that
monitors the voltage drop across the high-side MOSFET, or effectively the input current. Should either condition
exceed a preset value, OUT1 is immediately turned off for the remainder of the cycle.
To program the current limit, a value of resistance from DLY to AGND must first be chosen to establish a
blanking time during which the comparators will be blinded to switching noise. The blanking time starts with the
rising edge on IN for the input comparator and from both the rising and falling edge of IN for the output
comparator. Blanking time is given by:
tBLANK ( ns ) » 5RDLY ( kW )
(4)
where RDLY is the resistor from DLY to AGND. RDLY should be limited to a range of 25 kΩ to 100 kΩ.
Once RDLY has been chosen, the threshold for the input comparator, i.e., the drop allowed across the high-side
MOSFET, is given by:
æ
ç
è
ö
÷
ø
RCS+
RDLY
VCS( in ) =1.2´
(5)
Where VCS(in) is the threshold of allowed voltage across the high-side MOSFET and RCS+ is a resistor
connected from CS+ to the drain of the high-side MOSFET.
The blanking time for the output comparator is identical to the input comparator. The output comparator threshold
is given by:
ILIM
VCS( out )
=
10
(6)
where VCS(out) is the threshold of allowed voltage between the POS and NEG pins and ILIM is the voltage on the
ILIM pin. Note that the ILIM is internally connected to 0.5 V through a 42 kΩ resistor. Any voltage between 0.25
V and 1.0 V can be applied to ILIM. For voltages above 1.0 V, the maximum VCS(OUT) threshold is clamped to 0.1
V. Possible methods for setting ILIM are shown in Figure 8.
When using the output comparator to monitor the voltage on the parallel sensing capacitor across the inductor,
the same caveats apply as described for the current sense amplifier.
14
Copyright © 2006–2010, Texas Instruments Incorporated
Product Folder Link(s): UCD7230
UCD7230
www.ti.com
SLUS741D –NOVEMBER 2006–REVISED JANUARY 2010
A) GPIO Outputs
DIGITAL
CONTROLLER
UCD7230
3V3
VCC
GND
AGND
ILIM
40 kW
20 kW
10 kW
2.5 kW
GPIO1
GPIO2
GPIO3
GPIO4
ILIM SETPOINT
[Volts]
0.50
0.00
0.14
0.29
0.43
0.57
0.72
0.86
1.00
GPIO3
GPIO2
GPIO1
GPIO4
ILIM (open)
ILIM0
OPEN
OPEN
OPEN
OPEN
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
0
0
0
0
0
0
0
ILIM1
ILIM2
ILIM3
ILIM4
ILIM5
ILIM6
ILIM7
B) PWM Output
DIGITAL
CONTROLLER
UCD7230
VCC
3V3
GND
AGND
ILIM
Cf
Rf
PWM
Rf and Cf filter the PWM
output to generate a DC
input to the ILIM PIN
C) Resistor Divider
DIGITAL
CONTROLLER
UCD7230
3V3
VCC
GND
AGND
ILIM
R2
R1
UCD7230
3V3
D) Internal Set Point
AGND
ILIM
Cf
Figure 8. Setting the ILIM Voltage with: a) GPIO Outputs, b) PWM Output, c) Resistor Divider, d) Internal
Set Point
Copyright © 2006–2010, Texas Instruments Incorporated
15
Product Folder Link(s): UCD7230
UCD7230
SLUS741D –NOVEMBER 2006–REVISED JANUARY 2010
www.ti.com
If either comparator threshold is exceeded, OUT1 is immediately turned off for the remainder of the cycle and
CLF is asserted true. Upon the rising edge of IN, the switches resume normal operation, but the CLF assertion is
maintained. If a fault is not detected in this switching cycle, then the next rising edge of IN removes the CLF
assertion. However, if one of the comparators detects a fault, then CLF assertion continues. It is the privilege of
the control device to monitor CLF and decide how to handle the fault condition. In the mean while, the protection
comparators protect the power MOSFET switches on a cycle-by-cycle basis. If the output-sense comparator
(POS - NEG) detects continuous over-current, then the driver assumes 0% duty cycle until the current drops to a
safe value. Note that when a fault condition causes OUT1 to be driven low, OUT2 behaves as if the input pulse
had been terminated normally. In some fault conditions, it is advantageous to drive OUT2 low. SRE can be used
to cause OUT2 to remain low at the discretion of the control chip. This can be used to achieve faster discharge
of the inductor and also to fully disconnect the converter from the output voltage.
Startup Handshaking
The UCD7230 has a built-in handshaking feature to facilitate efficient start-up of the digitally controlled power
supply. At start-up the CLF flag is held high until all the internal and external supply voltages of the device are
within their operating range. Once the supply voltages are within acceptable limits, CLF goes low and the device
will process input commands. The digital controller should monitor CLF at start-up and wait for CLF to go low
before sending pwm information to the UCD7230.
Thermal Management
The usefulness of a driver is greatly affected by the drive power requirements of the load and the thermal
characteristics of the device package. In order for a power driver to be used over a particular temperature range,
the package must allow for the efficient removal of the heat while keeping the junction temperature within rated
limits. The UCD7230 is available in PowerPAD™ HTSSOP and QFN packages to cover a range of application
requirements. Both have the exposed pads to remove thermal energy from the semiconductor junction.
As illustrated in Reference [3 & 4], the PowerPAD™ packages offer a lead-frame die pad that is exposed at the
base of the package. This pad is soldered to the copper on the PC board (PCB) directly underneath the device
package, reducing the qJ A down to 38°C/W. The PC board must be designed with thermal lands and thermal
vias to complete the heat removal subsystem, as summarized in Reference [3].
Note that the PowerPAD™ is not directly connected to any leads of the package. However, it is electrically and
thermally connected to the substrate which is the ground of the device. The PowerPAD™ should be connected to
the quiet ground of the circuit.
16
Copyright © 2006–2010, Texas Instruments Incorporated
Product Folder Link(s): UCD7230
UCD7230
www.ti.com
SLUS741D –NOVEMBER 2006–REVISED JANUARY 2010
REFERENCES
1. Power Supply Seminar SEM-1600 Topic 6: A Practical Introduction to Digital Power Supply Control, by
Laszlo Balogh, Texas Instruments Literature No. SLUP224
2. Power Supply Seminar SEM–1400 Topic 2: Design and Application Guide for High Speed MOSFET Gate
Drive Circuits, by Laszlo Balogh, Texas Instruments Literature No. SLUP133.
3. Technical Brief, PowerPad Thermally Enhanced Package, Texas Instruments Literature No. SLMA002
4. Application Brief, PowerPAD™ Made Easy, Texas Instruments Literature No. SLMA004
RELATED PRODUCTS
Table 1. RELATED PRODUCTS
PRODUCT
UCD9501
UCD9111
UCD9112
DESCRIPTION
FEATURES
Digital power controller for high performance multi-loop applications
Digital power controller for power supply applications
Digital power controller for power supply applications
REVISION HISTORY
Changes from Revision C (march 2007) to Revision D
Page
•
•
•
•
Changed Figure 1 ................................................................................................................................................................. 2
Changed Figure 2 ................................................................................................................................................................. 3
Deleted PWP CONNECTION DIAGRAM ............................................................................................................................. 4
Changed HTSSOP-20 (PWP), and QFN-20 (RGW) packages are available taped and reeled. Add R suffix to device
type (e.g. UCD7230PWPR) to order quantities of 2,000 devices per reel for the PWP package and 1,000 devices
per reel for the RGW packages. ........................................................................................................................................... 4
•
Added QFN-20 (RGW) package is available taped and reeled. Add T suffix to device type (e.g. UCD7230RGW) to
order quantities of 1,000 devices per reel. ........................................................................................................................... 4
Copyright © 2006–2010, Texas Instruments Incorporated
17
Product Folder Link(s): UCD7230
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Oct-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
UCD7230PWPR
UCD7230RGWR
UCD7230RGWR
UCD7230RGWT
UCD7230RGWT
HTSSOP PWP
20
20
20
20
20
2000
3000
3000
250
330.0
330.0
330.0
180.0
180.0
16.4
12.4
12.4
12.4
12.4
6.95
5.25
5.3
7.1
5.25
5.3
1.6
1.1
1.5
1.5
1.1
8.0
8.0
8.0
8.0
8.0
16.0
12.0
12.0
12.0
12.0
Q1
Q2
Q2
Q2
Q2
VQFN
VQFN
VQFN
VQFN
RGW
RGW
RGW
RGW
5.3
5.3
250
5.25
5.25
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Oct-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
UCD7230PWPR
UCD7230RGWR
UCD7230RGWR
UCD7230RGWT
UCD7230RGWT
HTSSOP
VQFN
VQFN
VQFN
VQFN
PWP
RGW
RGW
RGW
RGW
20
20
20
20
20
2000
3000
3000
250
367.0
370.0
367.0
210.0
195.0
367.0
355.0
367.0
185.0
200.0
38.0
55.0
35.0
35.0
45.0
250
Pack Materials-Page 2
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UCD7230RG 相关器件
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