DCM342L01

更新时间:2025-07-06 11:25:35
品牌:TOSHIBA
描述:HIGH SPEED QUAD CHANNEL DIGITAL ISOLATORS, High-spped, 50Mbps, 5000Vrms, 16pin SOIC Wide body

DCM342L01 概述

HIGH SPEED QUAD CHANNEL DIGITAL ISOLATORS, High-spped, 50Mbps, 5000Vrms, 16pin SOIC Wide body

DCM342L01 数据手册

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DCM342L01  
Standard Digital Isolators  
DCM342L01  
Quad - channel High speed Logic for Automotive equipment, Output Enable control, Default  
Low output  
1. Description  
The DCM342L01 is a 16-pin SOIC Wide package default  
low-output, quad-channel high-speed digital isolator with the  
primary and secondary sides insulated and coupled by a  
magnetic coupling structure.  
With a high isolation voltage of 5000 Vrms, it is suitable for  
control applications such as in-vehicle communication line  
insulation.  
16pin SOIC Wide body  
Weight: 0.426 g (typ.)  
2. Applications  
Battery Control in Automotive Equipment  
Fuel Battery Control in Automotive Equipment  
Application for Electrical Vehicle  
Date Converter Isolation  
(Serial Peripheral Interface (SPI), etc.)  
3. Features  
Data rate  
Default Output  
Control type  
Number of channels  
Suitable operating voltage  
Isolation voltage  
Common-Mode Transient Immunity : ±100 kV/μs (Typ)  
Safety standards  
:
:
:
:
:
:
50 Mbps (Max)  
Low  
Output Enable  
4 channels (Forward 2 : Revers 2)  
3.3 V or 5 V  
5000 Vrms  
AEC-Q100 (Grade1 qualified)  
UL : UL1577 , File No. E519997  
cUL: CSA Component Acceptance Service Notice No. E519997  
Note: Typical test conditions: VDD1 =VDD2 = 3.3V or 5V, Ta = 25°C; unless otherwise specified.  
4. Mechanical Parameters  
Table 4.1 Mechanical parameters  
Characteristics  
Symbol  
unit  
Unit  
Creepage distances  
Clearance distances  
CPG  
CLR  
7.6 (Min)  
8 (Min)  
mm  
mm  
Distance Through the  
Insulation  
DTI  
17  
µm  
Start of commercial production  
2024-11  
© 2024  
Toshiba Electronic Devices & Storage Corporation  
1
2025-03-06  
Rev.1.1  
DCM342L01  
5. Block Diagram  
DCM342L01  
VI1 to VI2  
VO1 to VO2  
VO3 to VO4  
EN1  
VI3 to VO4  
EN2  
Note: Some of the functional blocks, circuits or constants labels in the block  
diagram may have been omitted or simplified for clarity.  
Figure 5.1 Block Diagram  
© 2024  
Toshiba Electronic Devices & Storage Corporation  
2
2025-03-06  
Rev.1.1  
DCM342L01  
6. Pin Assignments  
Figure 6.1 Pin Assignments (top view)  
7. Pin Description  
Table 7.1 Pin Description  
Pin No  
Pin name  
I/O  
Description  
1
2
Power Supply, side 1  
GND connection for VDD1 , side 1  
Logic Input, Channel1  
VDD1  
GND1  
VI1  
3
IN  
4
IN  
Logic Input, Channel2  
VI2  
5
OUT  
OUT  
IN  
Logic Output, Channel3  
Logic Output, Channel4  
VO3  
VO4  
EN1  
GND1  
GND2  
EN2  
VI4  
6
7
Ch3 to Ch4 Output Enable control pin  
GND connection for VDD1, side 1  
GND connection for VDD2, side 2  
Ch1 to Ch2 Output Enable control pin  
Logic Input, Channel4  
8
9
10  
11  
12  
13  
14  
15  
16  
IN  
IN  
IN  
Logic Input, Channel3  
VI3  
OUT  
OUT  
Logic Output, Channel2  
VO2  
VO1  
GND2  
VDD2  
Logic Output, Channel1  
GND connection for VDD2, side 2  
Power Supply, side 2  
© 2024  
Toshiba Electronic Devices & Storage Corporation  
3
2025-03-06  
Rev.1.1  
DCM342L01  
8. Functional Description  
8.1. Specifications of External Components  
VDD1  
VDD2  
C1  
C2  
GND1  
GND2  
VO1  
VI1  
VI2  
VO2  
VI3  
VO3  
VO4  
EN1  
GND1  
VI4  
EN2  
GND2  
Figure 8.1 Pin Assignments (top view)  
Table 8.1 External component specification (Note)  
Component  
Name  
Recommended  
Pin  
Description  
Value  
C1  
C2  
VDD1  
VDD2  
0.1μF  
0.1μF  
Note: Use Ceramic capacitors (C1,C2) with good high frequency characteristics.  
Note: Ceramic capacitors (C1,C2) should be connected between pin 1 (VDD1) and pin 2  
(GND1) for VDD1 and between pin 16 (VDD2) and pin 15 (GND2) for VDD2, and should  
be the layout on the IC as close as possible (less than 10mm).  
Otherwise, the IC may not switch properly.  
© 2024  
Toshiba Electronic Devices & Storage Corporation  
4
2025-03-06  
Rev.1.1  
DCM342L01  
8.2. IC Startup Procedure  
8.2.1. Output Enable Function  
Output signal Enable / Disable control is possible by controlling pin 7 (EN1 pin) and pin 10 (EN2 pin) to  
High or Low.  
To enable output, set pin 7 (EN1 pin) and pin 10 (EN2 pin) to High or OPEN.  
By setting pin 7 (EN1 pin) to Low, VO1 to VO3 can be disabled, and by setting pin 10 (EN2 pin) to Low,  
VO4 can be disabled.  
Table 8.2 Output Enable control pin Functional Description (Note)  
VDDI  
VDDO  
EN Pin  
Input  
Output  
State Description  
Input side  
VDD  
Output  
side VDD  
(EN1, EN2)  
(VI1 to VI4)  
(VO1 to VO4)  
1
2
3
4
5
Low  
High  
OPEN  
Low  
High  
Low  
Z
High  
or  
OPEN  
Normal Operation  
PU  
PU  
PD  
PD  
PU  
PD  
PU  
PD  
Default mode  
Output Disable mode  
When VDD2 is unpowered,  
channel output is undetermined.  
Low  
Undetermined  
a
a
Undetermined Undetermined  
Undetermined  
6
High  
or  
OPEN  
Low  
Low  
Default mode  
Undetermined  
7
8
Z
Output Disable mode  
When VDD2 is unpowered,  
channel output is undetermined.  
Undetermined Undetermined  
Undetermined  
Note: PU = Powered Up (VDD ≥ 2.25 V) , PD = Powered Down (V ≤1.7 V)  
DD  
Z = High Impedance  
Note: VDDI = Input-sideVDD, VDDO = Output-side VDD  
Figure 8.2 Enable Propagation Delay Diagram  
© 2024  
Toshiba Electronic Devices & Storage Corporation  
5
2025-03-06  
Rev.1.1  
DCM342L01  
9. Absolute Maximum Ratings (Note)  
Table 9.1 Absolute Maximum Ratings (Note)  
(Ta = 25°C unless otherwise specified)  
Characteristics  
Condition  
Symbol  
Rating  
Unit  
Junction temperature  
T
-40 to 150  
-65 to 150  
°C  
°C  
J
Storage temperature  
range  
T
stg  
Operation temperature  
range  
-40 to 125  
T
°C  
opr  
Soldering temperature  
Supply voltage (DC)  
10s  
T
260  
°C  
V
sol  
V
,V  
-0.5 to 6.0  
DD1 DD2  
-0.5 to V  
+ 0.5  
DDX  
VI(1 to 4)  
VO(1 to 4)  
EN1,EN2  
V
V
V
(Note 1)  
0.5 to V  
+ 0.5  
DDX  
(Note 1)  
-0.5 to V  
+ 0.5  
DDX  
(Note 1)  
Output Current  
Isolation voltage  
Output current  
I
±15  
5000  
284  
mA  
O
1min  
BV  
I
Vrms  
S
V
= V  
= 5.5 V,  
DD2  
DD1  
S1  
mA  
Tj = 150 °C, Ta = 25 °C  
V
= V = 3.6 V,  
I
434  
DD1  
DD2  
S2  
mA  
Tj = 150 °C, Ta = 25 °C  
Tj = 150 °C, Ta = 25 °C  
Power dissipation  
P
1562  
mW  
d Max  
Note: The absolute maximum ratings of a semiconductor device are a set of specified parameter  
values, which must not be exceeded during operation, even for an instant.  
If any of these rating would be exceeded during operation, the device electrical  
characteristics may be irreparably altered, and the reliability and lifetime of the device can  
no longer be guaranteed. Moreover, these operations with exceeded ratings may cause  
break down, damage, and/or degradation to any other equipment. Applications using the  
device should be designed such that each maximum rating will never be exceeded in any  
operating conditions.  
Before using, creating, and/or producing designs, refer to and comply with the precautions  
and conditions set forth in this document.  
Note 1: Maximum voltage must not exceed 6V  
© 2024  
Toshiba Electronic Devices & Storage Corporation  
6
2025-03-06  
Rev.1.1  
DCM342L01  
9.1. Power Dissipation  
VDD1 = VDD2 = 3.6 V  
VDD1 = VDD2 = 5.5 V  
Ambient temperature Ta ( °C )  
Figure 9.1 Thermal derating curve for safety limiting current  
10. Recommended operating conditions  
Table 10.1 Recommended Operating Ranges (Note)  
Characteristics  
Symbol  
, V  
DD2  
Min  
Max  
Unit  
V
3.0  
-40  
-40  
5.5  
150  
125  
V
Operation voltage  
DD1  
T
°C  
°C  
Junction temperature  
Operating temperature  
J
Topr  
Note: The recommended operating conditions are given as a design guide necessary to  
obtain the intended performance of the device. Each parameter is an independent value.  
When creating a system design using this device, the electrical characteristics specified  
in this data sheet should also be considered.  
© 2024  
Toshiba Electronic Devices & Storage Corporation  
7
2025-03-06  
Rev.1.1  
DCM342L01  
11. Electrical Characteristics  
DC characteristics 5V Supply  
Table 11.1 DC characteristics – 5V Supply (Note)  
(VDD1 = VDD2 =4.5 V to 5.5 V over recommended operating conditions unless otherwise noted)  
Characteristics  
Symbol  
Test condition  
Min  
Typ  
Max  
Unit  
VDDxUV+  
VDDxUV-  
VDDxUVH  
Positive VDDx Threshold  
Negative VDDx Threshold  
VDDx Hysteresis  
2.1  
1.9  
0.2  
2.25  
VDD Under Voltage  
Lockout threshold  
Voltage  
1.7  
0.1  
V
VIx = High , IOH = -20 μA  
VIx = High , IOH = -4 mA  
VIx = High , IOL = 20 μA  
VIx = High , IOL = 4 mA  
V
- 0.1  
V
DDO  
DDO  
Logic High-level  
output voltage  
VOH  
V
V
V
- 0.4  
V
-0.2  
DDO  
DDO  
0
0.1  
0.4  
Logic Low-level  
output voltage  
VOL  
0.2  
50  
Output Impedance  
ZO  
Ω
V
Logic High-level input  
Threshold voltage  
VIH  
0.7 x V  
DDI  
Logic Low-level input  
Threshold voltage  
VIL  
0.3 x V  
V
V
V
V
DDI  
Logic Input threshold  
voltage hysteresis  
VHYS  
VENIH  
VENIL  
0.37  
EN pin input  
Threshold voltage  
0.7 x V  
DDI  
EN pin Low-level input  
Threshold voltage  
0.3 x V  
DDI  
EN pin Input threshold  
voltage hysteresis  
VENHYS  
II  
0.37  
V
Input current  
VI = VDDI or 0 V  
±10  
µA  
Note: VDDI = Input-sideVDD, VDDO = Output-side VDD  
© 2024  
Toshiba Electronic Devices & Storage Corporation  
8
2025-03-06  
Rev.1.1  
DCM342L01  
Switching Characteristics 5 V Supply  
Table 11.2 Switching Characteristics – 5 V Supply  
(VDD1 = VDD2 =4.5 V to 5.5 V over recommended operating conditions unless otherwise noted)  
Characteristics  
Data Rate  
Symbol  
Test condition  
Min  
20  
Typ  
Max  
50  
Unit  
Mbps  
ns  
tbps  
50 kHz, Duty = 50 %,  
CL = 15 pF  
tPHL  
,
Propagation Delay  
10.9  
0.8  
18.4  
5.1  
tPLH  
Pulse Width Distortion  
PWD  
|tPHL – tPLH  
|
ns  
Propagation Delay Skew  
(Between any two units)  
tPSK  
(Note1)  
13.0  
ns  
Codirectional  
Channel  
tskCD  
tskOD  
4.4  
4.5  
ns  
ns  
Opposing  
Matching  
Direction  
Output signal  
rise time  
tr  
tf  
10% to 90%  
90% to 10%  
0.9  
0.9  
ns  
ns  
Output signal  
fall time  
tpZL , tpZH  
tpLZ , tpHZ  
15.0  
18.0  
ns  
ns  
50 kHz, Duty = 50 %,  
CL = 15 pF  
Enable control pin  
Propagation delay  
Common-Mode  
Transient Immunity  
CMTI  
VI= VDDI or 0 V, VCM = 1500 V  
100  
kV/µs  
Note1: The Propagation delay skew, tPSK , is equal to the magnitude of the difference in  
propagation delay.  
That will be seen between units at the same given conditions (supply voltage, input  
current, temperature, etc.).  
Supply Current Characteristics 5 V Supply  
Table 11.3 Supply Current Characteristics – 5 V Supply  
(VDD1 = VDD2 =4.5 V to 5.5 V over recommended operating conditions unless otherwise noted)  
Characteristics  
Symbol  
Test condition  
Min  
Typ  
Max  
Unit  
IDDQ1(0)5  
IDDQ1(1)5  
IDDQ2(0)5  
IDDQ2(1)5  
IDD1(1)5  
VI = Low  
VI = High  
VI = Low  
VI = High  
3.8  
13.4  
3.8  
5.5  
Primary side  
mA  
18.3  
5.5  
DC Supply Current  
Secondary side  
Primary side  
mA  
mA  
mA  
mA  
13.4  
8.8  
18.3  
12.9  
12.9  
16.8  
16.8  
21.2  
21.2  
tbps  
=
fCLK = 500 kHz, Duty = 50 %  
square wave, CL = 15 pF  
1 Mbps  
Secondary side IDD2(1)5  
Primary side IDD1(25)5  
Secondary side IDD2(25)5  
Primary side IDD1(50)5  
Secondary side IDD2(50)5  
8.8  
Supply  
Current  
(AC signal)  
tbps  
25 Mbps  
=
11.4  
11.4  
14.3  
14.3  
fCLK = 12.5 MHz, Duty = 50 %  
square wave, CL = 15 pF  
tbps  
=
fCLK = 25 MHz, Duty = 50 %  
square wave, CL = 15 pF  
50 Mbps  
© 2024  
9
2025-03-06  
Rev.1.1  
Toshiba Electronic Devices & Storage Corporation  
DCM342L01  
DC characteristics 3.3 V Supply  
Table 11.4 DC characteristics – 3.3V Supply (Note)  
(VDD1 = VDD2 = 3.0 V to 3.6 V over recommended operating conditions unless otherwise noted)  
Characteristics  
Symbol  
Test condition  
Min  
Typ  
Max  
Unit  
VDDxUV+  
VDDxUV-  
VDDxUVH  
Positive VDDx Threshold  
Negative VDDx Threshold  
VDDx Hysteresis  
2.1  
1.9  
0.2  
2.25  
VDD Under Voltage  
Lockout threshold  
Voltage  
1.7  
0.1  
V
VIx = High , IOH = -20 μA  
VIx = High , IOH = -4 mA  
VIx = High , IOL = -20 μA  
VIx = High , IOL = 4 mA  
V
- 0.1  
V
DDO  
DDO  
Logic High-level  
output voltage  
VOH  
V
V
V
- 0.4  
V
-0.2  
DDO  
DDO  
0
0.1  
0.4  
Logic Low-level  
output voltage  
VOL  
0.2  
50  
Output Impedance  
ZO  
Ω
V
Logic High-level input  
Threshold voltage  
VIH  
0.7 x V  
DDI  
Logic Low-level input  
Threshold voltage  
VIL  
0.3 x V  
V
V
V
V
DDI  
Logic Input threshold  
voltage hysteresis  
VHYS  
VENIH  
VENIL  
0.32  
EN pin input  
Threshold voltage  
0.7 x V  
DDI  
EN pin Low-level input  
Threshold voltage  
0.3 x V  
DDI  
EN pin Input threshold  
voltage hysteresis  
VENHYS  
II  
0.32  
V
Input current  
VI = VDDI or 0 V  
±10  
µA  
Note: VDDI = Input-sideVDD, VDDO = Output-side VDD  
© 2024  
Toshiba Electronic Devices & Storage Corporation  
10  
2025-03-06  
Rev.1.1  
DCM342L01  
Switching Characteristics 3.3 V Supply  
Table 11.5 Switching Characteristics – 3.3 V Supply  
(VDD1 = VDD2 = 3.0 V to 3.6 V over recommended operating conditions unless otherwise noted)  
Characteristics  
Data Rate  
Symbol  
Test condition  
Min  
20  
Typ  
Max  
50  
Unit  
Mbps  
ns  
tbps  
50 kHz, Duty = 50 %,  
CL = 15 pF  
tPHL  
,
Propagation Delay  
11.6  
0.8  
19.2  
5.1  
tPLH  
Pulse Width Distortion  
PWD  
|tPHL – tPLH  
|
ns  
Propagation Delay Skew  
(Between any two units)  
tPSK  
(Note1)  
13.0  
ns  
Codirectional  
Channel  
tskCD  
tskOD  
4.4  
4.5  
ns  
ns  
Opposing  
Matching  
Direction  
Output signal  
rise time  
tr  
tf  
10% to 90%  
90% to 10%  
0.9  
0.9  
ns  
ns  
Output signal  
fall time  
tpZL , tpZH  
tpLZ , tpHZ  
15.0  
18.0  
ns  
ns  
50 kHz, Duty = 50 %,  
CL = 15 pF  
Enable control pin  
Propagation delay  
Common-Mode  
Transient Immunity  
CMTI  
VI= VDDI or 0 V, VCM = 1500 V  
100  
kV/µs  
Note1: The Propagation delay skew, tPSK , is equal to the magnitude of the difference in  
propagation delay.  
That will be seen between units at the same given conditions (supply voltage, input  
current, temperature, etc.).  
Supply Current Characteristics 3.3 V Supply  
Table 11.6 Supply Current Characteristics – 3.3 V Supply  
(VDD1 = VDD2 = 3.0 V to 3.6 V over recommended operating conditions unless otherwise noted)  
Characteristics  
Symbol  
Test condition  
Min  
Typ  
Max  
Unit  
IDDQ1(0)5  
IDDQ1(1)5  
IDDQ2(0)5  
IDDQ2(1)5  
IDD1(1)5  
VI = Low  
VI = High  
VI = Low  
VI = High  
3.7  
13.3  
3.7  
5.3  
Primary side  
mA  
18.2  
5.3  
DC Supply Current  
Secondary side  
Primary side  
mA  
mA  
mA  
mA  
13.3  
8.7  
18.2  
12.2  
12.2  
14.7  
14.7  
17.5  
17.5  
tbps  
=
fCLK = 500 kHz, Duty = 50 %  
square wave, CL = 15 pF  
1 Mbps  
Secondary side IDD2(1)5  
Primary side IDD1(25)5  
Secondary side IDD2(25)5  
Primary side IDD1(50)5  
Secondary side IDD2(50)5  
8.7  
Supply  
Current  
(AC signal)  
tbps  
25 Mbps  
=
10.3  
10.3  
12.1  
12.1  
fCLK = 12.5 MHz, Duty = 50 %  
square wave, CL = 15 pF  
tbps  
=
fCLK = 25 MHz, Duty = 50 %  
square wave, CL = 15 pF  
50 Mbps  
© 2024  
11  
2025-03-06  
Rev.1.1  
Toshiba Electronic Devices & Storage Corporation  
DCM342L01  
12. Characteristic Chart (Note)  
Supply Current vs Data rate  
IDD1 - tbps  
IDD2 - tbps  
VDD1 = VDD2 = 5 V or 3.3 V  
CL = 15pF  
VDD1 = VDD2 = 5 V or 3.3 V  
CL = 15pF  
Duty = 50%  
Duty = 50%  
VDD1 = VDD2 = 5 V  
VDD1 = VDD2 = 5 V  
VDD1 = VDD2 = 3.3 V  
VDD1 = VDD2 = 3.3 V  
Data rate ( Mbps )  
Data rate ( Mbps )  
Figure12.1 Supply Current – Data rate  
Output Voltage vs Output Current  
VOH - IOH  
VOL - IOL  
1
0.8  
0.6  
0.4  
0.2  
0
VDD1 = VDD2 = 5 V or 3.3 V  
VDD1 = VDD2 = 5 V or 3.3 V  
VDD1 = VDD2 = 5 V  
VDD1 = VDD2 = 5 V  
VDD1 = VDD2 = 3.3 V  
VDD1 = VDD2 = 3.3 V  
0
5
10  
15  
Low - level output current IOH ( mA )  
High- level output current IOH ( mA )  
Figure12.2 Output Voltage – Output Current  
Note: The following characteristics curves are presented for reference only and not  
guaranteed by production test, unless otherwise noted.  
© 2024  
Toshiba Electronic Devices & Storage Corporation  
12  
2025-03-06  
Rev.1.1  
DCM342L01  
Propagation Delay Time vs Ambient Temperature  
tpHL - Ta  
tpLH - Ta  
VDD1 = VDD2 = 5 V or 3.3 V  
f = 50kHz Duty = 50%  
CL = 15pF  
VDD1 = VDD2 = 5 V or 3.3 V  
f = 50kHz Duty = 50%  
CL = 15pF  
VDD1 = VDD2 = 3.3 V  
VDD1 = VDD2 = 3.3 V  
VDD1 = VDD2 = 5 V  
VDD1 = VDD2 = 5 V  
Ambient temperature ta ( °C )  
Ambient temperature ta ( °C )  
Figure12.3 Propagation Delay Time vs Ambient Temperature  
Figure12.4 Switching Waveforms  
Note: The following characteristics curves are presented for reference only and not  
guaranteed by production test, unless otherwise noted.  
© 2024  
Toshiba Electronic Devices & Storage Corporation  
13  
2025-03-06  
Rev.1.1  
DCM342L01  
13. Package Information  
Table 13.1 Insulation Related Specifications (Note)  
Parameters  
Minimum clearance  
Symbol  
DCM342L01  
Unit  
CLR  
CPG  
DTI  
8.0  
7.6  
17  
mm  
mm  
µm  
V
Minimum creepage distance  
Minimum insulation thickness  
Comparative tracking index  
CTI  
550  
Note: If a printed circuit is incorporated, the creepage distance and clearance may be  
reduced below this value. (e.g., at a standard distance between soldering eye  
centers of 7.5 mm). If this is not permissible, the user shall take suitable measures.  
Note: This photocoupler is suitable for safe electrical isolation only within the safety  
limit data. Maintenance of the safety data shall be ensured by means of protective  
circuits.  
© 2024  
Toshiba Electronic Devices & Storage Corporation  
14  
2025-03-06  
Rev.1.1  
DCM342L01  
14. Package Information  
Package dimensions  
16pin SOIC Wide body  
( P-SOP16-0811-1.27-002 )  
Unit: mm  
Weight: 0.426 g (typ.)  
Figure 14.1 Package Dimensions  
© 2024  
Toshiba Electronic Devices & Storage Corporation  
15  
2025-03-06  
Rev.1.1  
DCM342L01  
Land Pattern Dimensions for Reference only  
16pin SOIC Wide body  
( P-SOP16-0811-1.27-002 )  
Unit: mm  
Complies with JEITA ET-7501  
Level 3 Normal  
Isolation option  
Creepage distance: ≥8mm  
Creepage distance: 7.6 mm  
Figure 14.2 Land Pattern Dimensions for Reference only  
Notes.  
Unless otherwise indicated, dimensions are given in millimeters.  
This document is a reference drawing in accordance with JEITA ET-7501 Level 3. The Company does not  
guarantee the accuracy or completeness of the diagrams and information.  
The customer should fully evaluate the various conditions (soldering conditions, etc.) and adjust at their  
own risk.  
The diagrams in this document do not accurately show the actual shape and dimensions. Do not use the  
dimensions of the actual product as a basis for designing the product.  
When designing and using the product, check the latest information on the product and the operating  
instructions of the equipment in which the product is to be used, and follow these instructions.  
© 2024  
Toshiba Electronic Devices & Storage Corporation  
16  
2025-03-06  
Rev.1.1  
DCM342L01  
RESTRICTIONS ON PRODUCT USE  
Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”.  
Hardware, software and systems described in this document are collectively referred to as “Product”.  
TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.  
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's  
written permission, reproduction is permissible only if reproduction is without alteration/omission.  
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for  
complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which  
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to  
property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the  
Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information,  
including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and  
conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product  
will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited  
to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the  
applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any  
other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO  
LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.  
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE  
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY  
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT  
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation,  
equipment used in nuclear facilities, equipment used in the aerospace industry, lifesaving and/or life supporting medical equipment,  
equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or  
explosions, safety devices, elevators and escalators, and devices related to power plant. IF YOU USE PRODUCT FOR UNINTENDED USE,  
TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative or contact us via our  
website.  
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.  
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any  
applicable laws or regulations.  
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any  
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any  
intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.  
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR  
PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,  
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING  
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2)  
DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR  
INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE,  
ACCURACY OF INFORMATION, OR NONINFRINGEMENT.  
Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for  
the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass  
destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations  
including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export  
and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and  
regulations.  
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please  
use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including  
without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT  
OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.  
https://toshiba.semicon-storage.com/  
© 2024  
17  
2025-03-06  
Rev.1.1  
Toshiba Electronic Devices & Storage Corporation  

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