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TA7733F/FG

更新时间：2025-07-13 05:56:29
品牌：TOSHIBA
描述：Functional Bridge Driver

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中文翻译

免费 PCB/SMT

TA7733F/FG 概述

Functional Bridge Driver 功能驱动桥

TA7733F/FG 数据手册

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TA7733F/FG  
TOSHIBA Bipolar Linear Integrated Circuit  
Silicon Monolithic  
TA7733F/FG  
Functional Bridge Driver  
The TA7733 is a low-voltage bridge driver IC offering four modes:  
forward rotation, reverse rotation, stop, and brake.  
Features  
z Wide operating supply voltage range:  
V
= 1.8~15 V  
CC (opr.)  
z Housed in a flat package (16-pin)  
z Forward and reverse rotation, stop and brake modes are  
available by means of rotation control signals.  
z High efficiency is obtained  
z Can be used as an interface driver.  
Weight: 0.14 g (typ.)  
Block Diagram  
The TA7733FG is a Pb-free product.  
The following conditions apply to solderability:  
*Solderability  
1. Use of Sn-37Pb solder bath  
*solder bath temperature = 230°C  
*dipping time = 5 seconds  
*number of times = once  
*use of R-type flux  
2. Use of Sn-3.0Ag-0.5Cu solder bath  
*solder bath temperature = 245°C  
*dipping time = 5 seconds  
*number of times = once  
*use of R-type flux  
1
2006-3-2  
TA7733F/FG  
Pin Description  
Pin No.  
Symbol  
Functional Description  
Power supply voltage terminal  
1
2
V
CC  
NC  
No connection  
3
IN  
IN  
IN  
IN  
Signal input terminal  
Signal input terminal  
Signal input terminal  
Signal input terminal  
No connection  
1
2
3
4
4
Truth table 1  
5
6
7
NC  
8
GND 2  
OUT a  
OUT A  
OUT A  
GND 1  
GND 1  
OUT B  
OUT B  
OUT b  
Logic GND  
9
Output A upper transistor drive terminal  
10  
11  
12  
13  
14  
15  
16  
Output A  
Power GND terminal  
Output B  
Output B upper transistor drive terminal  
Functions  
(1) Bridge driver (truth table 1)  
INPUT MODE  
OUTPUT  
OPERATING  
CONTROL  
NOTE  
MODE  
IN  
1
IN  
2
IN  
3
IN  
4
OUT A  
OUT B  
OUT a  
OUT b  
ON  
(−500 mA)  
ON  
(−25 mA)  
Forward  
rotation  
H
L
L
H
H
H
H
―
―
ON  
(−500 mA)  
ON  
(−25 mA)  
Reverse  
rotation  
H
―
―
2-input  
control  
ON  
(−500 mA)  
ON  
(−500 mA)  
H
L
H
L
L
H
H
L
H
H
H
―
―
―
―
―
Brake  
Stop  
―
―
―
―
ON  
(−500 mA)  
ON  
(−25 mA)  
H
A ON  
1-input  
control  
ON  
(−500 mA)  
ON  
(−25 mA)  
L
L
H
L
L
H
H
L
―
―
―
B ON  
ON  
(−500 mA)  
ON  
(−500 mA)  
HIGH  
≥ 1.2 V  
H / L  
―
―
AB ON  
LOW  
≤ 0.6 V  
―
―
―
―
―
―
INHIBIT  
2
2006-3-2  
TA7733F/FG  
(2) Interface driver application  
If IN and IN connect to “HIGH”, Out A and Out B can be used as interface driver outputs for each input.  
3
4
(Connect Out a and Out b to GND.)  
20 x 20 x 0.8 mm PCB mounting (at least  
60% of which is occupied by copper)  
Input-Output Circuit  
3
2006-3-2  
TA7733F/FG  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristic  
Peak supply voltage  
Symbol  
Rating  
Unit  
V
18  
V
A
CC  
Output current  
I
0.5  
O (AVE.)  
350 (Note 1)  
550 (Note 2)  
−30~75  
Power dissipation  
P
mW  
D
Operating temperature  
Storage temperature  
T
opr  
°C  
°C  
T
−55~150  
stg  
Note 1: No heat sink  
Note 2: This rating is obtained when the product is mounted on a 50 × 50 × 1.6 mm PCB of which 60% or more is  
occupied by copper.  
Electrical Characteristics (unless otherwise specified, Ta = 25°C, V = 5 V)  
CC  
Test  
Circuit  
Characteristic  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
I
I
I
I
1
1
1
1
Output open, CW / CCW mode  
Output open, stop mode  
Output open, brake mode  
Inhibit (INPUT4 = “L”)  
―
―
―
―
13  
7.2  
―
―
―
―
CC1  
CC2  
CC3  
CC4  
Supply current  
mA  
19.2  
2.4  
I
= 500 mA, lower side (Output A,  
O1  
B)  
V
V
2
―
0.4  
―
sat1  
sat2  
OUTPUT saturation voltage  
Output TR leakage current  
V
2
3
I
= 25 mA, upper side (Output a, b)  
―
―
0.5  
―
―
―
―
―
―
―
1
―
O2  
I
V
= 15 V  
C
50  
µA  
V
L
“H” level  
Input voltage  
V
―
―
4
―
1.2  
―
V
CC  
IN 1, 2 (H)  
“L” level  
V
―
0.3  
20  
IN 1, 2 (L)  
Input current  
Input voltage  
Input current  
“L” level  
“H” level  
“L” level  
“H” level  
I
Input “L” (source current)  
―
µA  
V
IN1, 2  
V
―
―
4
―
―
1.0  
―
V
IN 3, 4 (H)  
CC  
V
0.3  
IN 3, 4 (L)  
I
Input “H” (sink current) V = 1 V  
IN  
―
30  
µA  
V
IN3, 4  
Diode forward voltage  
V
5
I = 0.5 A, V = 0 V  
CC  
―
―
F
F
4
2006-3-2  
TA7733F/FG  
Tests Circuits  
1. ICC1, 2, 3, 4  
2. Vsat1, 2  
3. IL  
4.  
IIN  
5. VF  
5
2006-3-2  
TA7733F/FG  
Notes on Using the TA7733F/FG  
The TA7733F/FG functionable bridge driver is an IC specifically developed to control rotation switching in brush motors.  
This IC has been carefully designed and strengthened to withstand counter-electromotive force or startup rush current,  
which are problems often associated with driving brush motors.  
However, as with other power ICs, application circuits must be designed not to apply surge voltage or excess current that  
exceeds the standard values. In addition, when designing PCBs, make sure the wiring pattern does not cause oscillation,  
which can result in equipment malfunction or destruction of the IC.  
The following are notes on use of the TA7733F/FG. These should be reflected at the design stage.  
(1) Power supply voltage  
To avoid the motor current affecting the TA7733F/FG control-side power supply, we recommend you use two power  
supplies: an external transistor power supply, and a TA7733F/FG control-side power supply. However, when using  
a single power supply, connect as in the diagram below.  
(2) Maximum voltage and current  
The maximum supply voltage (pin 1) for the TA7733F/FG is 18 V. The operating supply voltage is in the range of  
1.8~15 V. No voltage exceeding this range should be applied to pin 1.  
The maximum current is 0.5 A (ave.) or 1.5 A (peak). The circuit should be designed so that rush current at startup  
does not exceed peak current, and average current during steady operation does not exceed 0.5 A.  
(3) External diodes  
As the block diagram shows, the TA7733F/FG has internal diodes.  
The lower two diodes, which are the IC’s internal parasitic diodes, have a relatively large capacitance. However,  
when a motor with a large reactance such as a core motor is driven, the upper two diodes may be damaged by the  
motor’s counter-electromotive force. In such a case, connect external diodes in parallel. The lower diodes should  
not be subjected to high current. For brake operation, therefore, external diodes should be connected.  
(4) PCB design  
The following points concern the TA7733F/FG pattern design around the power supply line (pin 1) and the pattern  
design of the GND (pin 8, pin 12 / 13).  
a) Ensure that the bypass capacitor between pin 1, and GND does not share impedance with other lines.  
b) The GND line should not be shared by other circuits.  
c) The capacitance of the bypass capacitor should be as large as possible.  
(5) Oscillation remedies  
To prevent noise from sparks when using brush motors, a capacitor may be connected between both pins.  
When using the TA7733F/FG, the capacitor is connected between outputs (pins 10 / 11, and pins 14 / 15). This may  
cause oscillation. Therefore avoid connecting the capacitor where possible. If connection is necessary to overcome  
noise, connect resistors in series as shown in the technical data.  
The values for the capacitor and resistors must be determined according to the motor.  
Note: Utmost care is necessary in the design of the output, V , V , and GND lines since the IC may be destroyed by  
CC  
M
short-circuiting between outputs, air contamination faults, or faults due to improper grounding, or by  
short-circuiting between contiguous pins.  
6
2006-3-2  
TA7733F/FG  
Package Dimensions  
SSOP16−P−225−1.00A  
Unit: mm  
Weight: 0.14 g (typ.)  
7
2006-3-2  
TA7733F/FG  
Notes on Contents  
1. Block Diagrams  
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified  
for explanatory purposes.  
2. Equivalent Circuits  
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for  
explanatory purposes.  
3. Timing Charts  
Timing charts may be simplified for explanatory purposes.  
4. Application Circuits  
The application circuits shown in this document are provided for reference purposes only. Thorough  
evaluation is required, especially at the mass production design stage.  
Toshiba does not grant any license to any industrial property rights by providing these examples of  
application circuits.  
5. Test Circuits  
Components in the test circuits are used only to obtain and confirm the device characteristics. These  
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the  
application equipment.  
IC Usage Considerations  
Notes on handling of ICs  
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be  
exceeded, even for a moment. Do not exceed any of these ratings.  
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result  
injury by explosion or combustion.  
[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in  
case of over current and/or IC failure. The IC will fully break down when used under conditions that  
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal  
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the  
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case  
of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location,  
are required.  
[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into  
the design to prevent device malfunction or breakdown caused by the current resulting from the  
inrush current at power ON or the negative current resulting from the back electromotive force at  
power OFF. IC breakdown may cause injury, smoke or ignition.  
Use a stable power supply with ICs with built-in protection functions. If the power supply is  
unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause  
injury, smoke or ignition.  
[4] Do not insert devices in the wrong orientation or incorrectly.  
Make sure that the positive and negative terminals of power supplies are connected properly.  
Otherwise, the current or power consumption may exceed the absolute maximum rating, and  
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result  
injury by explosion or combustion.  
In addition, do not use any device that is applied the current with inserting in the wrong orientation  
or incorrectly even just one time.  
8
2006-3-2  
TA7733F/FG  
Points to remember on handling of ICs  
(1) Heat Radiation Design  
In using an IC with large current flow such as power amp, regulator or driver, please design the  
device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ)  
at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat  
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown.  
In addition, please design the device taking into considerate the effect of IC heat radiation with  
peripheral components.  
(2) Back-EMF  
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s  
power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the  
device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid  
this problem, take the effect of back-EMF into consideration in system design.  
9
2006-3-2  
TA7733F/FG  
10  
2006-3-2  

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