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WBCT0303AG0150R1BB

更新时间：2025-06-17 21:28:56

品牌：TTELEC

描述：Wire Bondable Chip Resistors

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WBCT0303AG0150R1BB 概述

Wire Bondable Chip Resistors

WBCT0303AG0150R1BB 数据手册

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Resistors

Wire Bondable

Chip Resistors

WBC Series

ꢀ Discreteꢀorꢀtappedꢀschemaꢁcs

ꢀ MILꢀinspecꢁonꢀavailable

High resistor density

AllꢀpartsꢀareꢀPb-freeꢀandꢀcomplyꢀwithꢀEUꢀDirecꢁveꢀ2011/65/EUꢀ(RoHS2)

The WBC combines IRC’s TaNSil^®tantalum nitride thin ﬁlm technology with silicon substrate processing to

produce an extremely small tantalum nitride thin ﬁlm technology with silicon substrate processing to produce

an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil^®

resistor ﬁlm.

Available in a wide range of tolerances and temperature coefﬁcients to ﬁt a variety of hybrid circuit applica-

tions. Custom resistance values, sizes and schematics are available on request from the factory.

Electrical Data

Physical Data

R0202 - Discrete

Absolute Tolerance

to ±±.ꢀ1

to ±ꢁ2ppmꢂ/C

ꢁ2±mW

Absolute TCR

Package Power Rating

(@ 70°C)

0.004˝ min bond pad size

0.020˝ 0.001

Rated Operating Voltage

(0.508mm 0.025)

ꢀ±±V

-22/C to +ꢀ2±/C

<-3±dB

√

(not to exceed P x R )

B0202 - Discrete back contact¹

Operating Temperature

Noise

Back contact

Oxidized Silicon

(ꢀ±KÅ SiO_ꢁmin)

Top contact

pad chamfered

Substrate Material

Top contact

0.004˝ min bond pad size

0.020˝ 0.001

±.±ꢀ±˝ ±±.±±ꢀ

(±.ꢁ24mm ±±.±ꢁ2)

(0.508mm 0.025)

Substrate Thickness

T0303 - Tapped network ½R + ½R

Aluminum

ꢀ±KÅ minimum

ꢀ2KÅ minimum

Bond Pad

Metallization

Gold¹

R±ꢁ±ꢁ and

Silicon

½R

T±3±3

(Al ꢂ Au optional)

Backside

3KÅ Au minimum

ꢀ±KÅ Al minimum

B±ꢁ±ꢁ^ꢀ

0.030˝ 0.001

Silicon Dioxide or

Silicon Nitride

0.004˝ min bond pad size

Passivation

(0.762mm 0.025)

Note 1: Not recommended for new designs

General Note

BI Technologies IRC Welwyn

TT Electronics reserves the right to make changes in product speciﬁcation without notice or liability.

All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.

http://www.ttelectronics.com/resistors

05.17

Wire Bondable

Chip Resistors

WBC Series

Power Derating Data

TCRmInspection Code Table

Commercial

Code

MIL Inspection

Absolute TCR

Code*

±±33ppꢀm/C

±ꢁ33ppꢀm/C

±53ppꢀm/C

±25ppꢀm/C

3ꢁ

3±

*Notes: Product supplied to Class H of MIL-PRF 38534 includes 100% visual inspection

Manufacturing Capabilities Data

AvailableꢀAbsꢀ

Tolerances

AvailableꢀRaꢁoꢀTolꢀ

(T0303ꢀonly)

BestꢀAbsoluteꢀ

TCR

TrackingꢀTCRꢀ

(T0303ꢀonly)

ResistanceꢀRangeꢀ

Package

10Ωꢀ-ꢀ20Ω

21Ωꢀ-ꢀ50Ω

0202ꢀonly

G J K

N/A

+-100ppm/C

+-50ppm/C

+-25ppm/C

N/A

0202ꢀandꢀ0303

0303ꢀonly

F G J K

F G J

+-50ppm/C

+-25ppm/C

+-10ppm/C

+-5ppm/C

+-2ppm/C

51Ωꢀ-ꢀ100Ω

C D F G J K

B C D F G J K

C D F G J

101Ωꢀ-ꢀ200Ω

201Ωꢀ-ꢀ500Ω

501Ωꢀ-ꢀ999Ω

1.0KΩꢀ-ꢀ400KΩ

401KΩꢀ-ꢀ800KΩ

C D F G J

B C D F G J

A B C D F G J

General Note

BI Technologies IRC Welwyn

TT Electronics reserves the right to make changes in product speciﬁcation without notice or liability.

All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.

http://www.ttelectronics.com/resistors

05.17

Wire Bondable

Chip Resistors

WBC Series

Environmental Data

Test

Method

Max

Typical

MIL-STD-202

Method 107

Thermal Shock

0.1ꢀ

0.02ꢀ

Test condition F

MIL-STD-883

Method 1008

150°C, 1000 hours

HighTemperature Exposure

LowTemperature Storage

Life

0.1ꢀ

0.03ꢀ

0.5ꢀ

0.05ꢀ

0.01ꢀ

0.05ꢀ

-55°C, 1000 hours

MIL-STD-202

Method 108

70°C, 1000 hours

MIL-STD-202

Method 108

Life at ElevatedTemperature

125°C, 1000 hours

Ordering Data

WBC

R0202

1002

Prefix

Style

R0202 = Discrete Element

B0202 = Discrete Element with Back Contact

T0303 = Tapped Network

Bonding pads

A = Aluminum; G = Gold

Backside

A = Aluminum; G = Gold; S = Silicon

TCR/Inspection Code

Reference TCR/Inspection Code Table

Total Resistance (R)

4-Digit Resistance Code Ex: 1002 = 10K

; 50R1 = 50.1

AbsoluteTolerance Code

K = 10ꢀ; J = 5ꢀ; G = 2ꢀ; F = 1ꢀ; D = 0.5ꢀ; C = 0.25ꢀ; B = 0.1ꢀ

RatioTolerance Code (T0303 Only)

J = 5ꢀ; G = 2ꢀ; F = 1ꢀ; D = 0.5ꢀ; C = 0.25ꢀ; B = 0.1ꢀ; A = 0.05ꢀ

Packaging

Standard packaging is 2˝ x 2˝ chip tray. For additional information or to discuss your

speciﬁc requirements, please contact our Applications Team using the contact details below.

Note 1: Not recommended for new designs

General Note

BI Technologies IRC Welwyn

TT Electronics reserves the right to make changes in product speciﬁcation without notice or liability.

All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.

http://www.ttelectronics.com/resistors

05.17

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