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Lead (Pb)-free Thick Film, Rectangular,
Precision Chip Resistors
Vishay
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
REQUIREMENTS
PERMISSIBLE CHANGE (ΔR/R)
TEST (clause)
CONDITIONS OF TEST
STABILITY CLASS 1
OR BETTER
stability for product types:
10R to 10M
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Resistance (4.5)
-
1ꢀ 0.5 ꢀ 0.25
20/- 55/20 °C and
20/125/20 °C
Temperature coefficient (4.8.4.2)
100 ppm/Kꢀ 50 ppm/Kꢀ 25 ppm/K
U = 2.5 × (P70 × R)1/2
Overload (4.13)
≤ 2 × Umax
ꢀ
(0.25 % R + 0.05 Ω)
Duration: according the style
Aging 4 h at 155 °C, dryheat
Solder bath methodꢀ 235 °Cꢀ 2 s
Visual examination
Good tinning (≥ 95 % covered)
Solderability (4.17.5)
no visible damage
Resistance to soldering heat
(4.18.2)
Solder bath methodꢀ
(260 5) °Cꢀ (10 1) s
(0.25 % R + 0.05 Ω)
(0.25 % R + 0.05 Ω)
(1 % R + 0.05 Ω)
Rapid change of temperature
(4.19)
30 min. at LCT = - 55 °Cꢀ
30 min. at UCT = 125 °Cꢀ 5 cycles
(40 2) °Cꢀ 56 daysꢀ
(93 3) % RH
Damp heat, steady state (4.24)
Climatic sequence (4.23)
16 h at UCT = 125 °Cꢀ 1 cycle at 55 °Cꢀ
2 h at LCT = - 55 °Cꢀ
1 h/1 kPa at 15 °C to 35 °Cꢀ
5 cycles at 55 °C
U = (P70 × R)1/2
(1 % R + 0.05 Ω)
U = Umaxꢀ whichever is less severe
U = (P70 × R)1/2
U = Umaxꢀ whichever is less severe
1.5 h onꢀ 0.5 h offꢀ
Endurance at 70 °C (4.25.1)
(1 % R + 0.05 Ω)
70 °Cꢀ 1000 h
Extended endurance (4.25.1.8)
Duration extended to 8000 hours
UCT = 125 °Cꢀ 1000 h
(2 % R + 0.1 Ω)
(1 % R + 0.05 Ω)
Endurance at upper category
temperature (4.25.3)
APPLICABLE SPECIFICATIONS
•
•
•
•
•
EN 60115-1
Generic Specification
EN 140400
Sectional Specification
EN 140401-802
IEC 60068-2-X
IEC 60286-3
Detail Specification
Variety of environmental test procedures
Packaging of SMD components
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For technical questions in Europe, contact: ff1aresistors@vishay.com
For technical questions in Americas/Asia, contact: ff2aresistors@vishay.com
Document Number: 20036
Revision: 20-Feb-07