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TNPU12061K43BZEN00

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品牌：VISHAY

描述：RES SMD 1.43K OHM 0.1% 1/4W 1206

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TNPU12061K43BZEN00 概述

RES SMD 1.43K OHM 0.1% 1/4W 1206

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TNPU e3

Vishay Draloric

www.vishay.com

Ultra Precision Thin Film Chip Resistors

FEATURES

• Low temperature coefficients and tight

tolerances

• Sulfur resistance verified according to

ASTM B 809

• Superior moisture resistivity (85 °C; 85 % RH)

• Excellent overall stability at different

environmental conditions, e.g.  0.05 % (1000 h rated

power at 70 °C)

• AEC-Q200 qualified

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

APPLICATIONS

• Automotive

TNPU e3 ultra precision thin film flat chip resistors combine

the proven reliability of TNPW e3 products with a most

advanced level of precision and stability. This unique

combination makes the product perfectly suited for all

applications with outstanding requirements towards size,

reliable precision and stability.

• Industrial equipment

• Test and measuring equipment

• Medical equipment

• Telecommunication

• Instrumentation

TECHNICAL SPECIFICATIONS

DESCRIPTION

TNPU0402 e3

0402

TNPU0603 e3

0603

TNPU0805 e3

0805

TNPU1206 e3

1206

Imperial size

Metric size code

Resistance range

Resistance tolerance

Temperature coefficient

RR1005M

RR1608M

RR2012M

RR3216M

100  to 100 k

0.1 %; 0.05 %

10 ppm/K; 5 ppm/K

0.063 W

100  to 100 k

100  to 332 k

0.1 %; 0.05 %; 0.02 %

100  to 511 k

10 ppm/K; 5 ppm/K; 2 ppm/K

(1)

Rated dissipation, P₇₀

0.1 W

75 V

0.125 W

150 V

0.25 W

200 V

Operating voltage, U_max.AC_RMS/DC

Permissible film temperature, _{F max.}

Operating temperature range

Internal thermal resistance ⁽¹⁾

50 V

(1)

125 °C

-55 °C to 125 °C

90 K/W

75 V

63 K/W

100 V

38 K/W

32 K/W

300 V

Permissible voltage against ambient

(insulation):

1 min; U_ins

200 V

FIT_observed

Note

 0.1 x 10^-9/h

(1)

Please refer to APPLICATION INFORMATION, see below

APPLICATION INFORMATION

When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal

resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted

film temperature is not exceeded.

Please consider the application note “Thermal Management in Surface-Mounted Resistor Applications”

(www.vishay.com/doc?28844) for information on the general nature of thermal resistance.

These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift

increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a

functional lifetime.

Revision: 09-Jan-2020

Document Number: 28779

For technical questions, contact: thinfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TNPU e3

Vishay Draloric

www.vishay.com

MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION

OPERATION MODE

STANDARD

TNPU0402 e3

0.063 W

0.100 W

TNPU0603 e3

Rated dissipation, P₇₀

TNPU0805 e3

0.125 W

TNPU1206 e3

0.250 W

Operating temperature range

Permissible film temperature, _{F max.}

TNPU0402 e3

-55 °C to 125 °C

125 °C

100  to 100 k

100  to 332 k

100  to 511 k

 0.05 %

TNPU0603 e3

TNPU0805 e3

Max. resistance change at P₇₀for resistance range,

|R/R| after:

TNPU1206 e3

1000 h

8000 h

 0.1 %

225 000 h

 0.3 %

TEMPERATURE COEFFICIENT AND RESISTANCE RANGE

TYPE / SIZE

TCR

TOLERANCE

0.05 %

0.1 %

RESISTANCE

E-SERIES

10 ppm/K

TNPU0402 e3

100  to 100 k

500  to 20 k

5 ppm/K

0.05 %

0.1 %

10 ppm/K

5 ppm/K

0.05 %

0.02 %

0.1 %

TNPU0603 e3

2 ppm/K

10 ppm/K

5 ppm/K

0.05 %

0.02 %

0.05 %

0.1 %

100  to 332 k

100  to 200 k

500  to 20 k

E24; E192

0.05 %

0.02 %

0.1 %

TNPU0805 e3

2 ppm/K

10 ppm/K

5 ppm/K

0.05 %

0.02 %

0.05 %

0.1 %

100  to 511 k

100  to 200 k

500  to 20 k

0.05 %

0.02 %

0.1 %

TNPU1206 e3

2 ppm/K

0.05 %

0.02 %

Revision: 09-Jan-2020

Document Number: 28779

For technical questions, contact: thinfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TNPU e3

Vishay Draloric

www.vishay.com

PACKAGING

DIMENSIONS

TYPE / SIZE

CODE

QUANTITY

PACKAGING STYLE

WIDTH

PITCH

EP1 = EP

ET2 = EI

1000

5000

TNPU0402 e3

2 mm

Paper tape according

IEC 60286-3,

type 1a

8 mm

Ø 180 mm / 7"

E52 = EN

ET1 = EA

1000

5000

TNPU0603 e3

TNPU0805 e3

TNPU1206 e3

4 mm

PART NUMBER AND PRODUCT DESCRIPTION

Part Number: TNPU12061K32AZEA00

TYPE / SIZE

RESISTANCE

TOLERANCE

TCR

PACKAGING

TNPU0402

TNPU0603

TNPU0805

TNPU1206

R = decimal

K = thousand

M = million

(4 digits)

B = 0.1 %

A = 0.05 %

H = 0.02 %

Y = 10 ppm/K

Z = 5 ppm/K

W = 2 ppm/K

Product Description: TNPU1206 1K32 0.05 % T-16 ET1 e3

TNPU1206

1K32

0.05 %

T-16

ET1

TYPE / SIZE

RESISTANCE

TOLERANCE

TCR

PACKAGING

LEAD (Pb)-FREE

TNPU0402

TNPU0603

TNPU0805

TNPU1206

1K32 = 1320 

0.02 %

0.05 %

0.1 %

T-13 = 10 ppm/K

T-16 = 5 ppm/K

T-20 = 2 ppm/K

EP1

ET2

E52

ET1

e3 = pure tin

termination finish

Note

Products can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION

•

Revision: 09-Jan-2020

Document Number: 28779

For technical questions, contact: thinfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TNPU e3

Vishay Draloric

www.vishay.com

DESCRIPTION

Production is strictly controlled and follows an extensive

set of instructions established for reproducibility.

MATERIALS

Vishay acknowledges the following systems for the

regulation of hazardous substances:

homogeneous film of metal alloy is deposited on a high

grade ceramic substrate (Al₂O₃) and conditioned to achieve

the desired temperature coefficient. Specially designed

inner contacts are deposited on both sides. A special laser

is used to achieve the target value by smoothly fine trimming

the resistive layer without damaging the ceramics. A further

conditioning is applied in order to stabilize the trimming

result. The resistor elements are covered by a protective

coating designed for electrical, mechanical and climatic

protection. The terminations receive a final pure matte tin on

nickel plating. The result of the determined production is

verified by an extensive testing procedure on 100 % of the

individual chip resistors. Only accepted products are laid

directly into the tape in accordance with IEC 60286-3 Type

• IEC 62474, Material Declaration for Products of and for the

Electrotechnical Industry, with the list of declarable

substances given therein ⁽²⁾

• The Global Automotive Declarable Substance List

(GADSL) ⁽³⁾

• The REACH regulation (1907/2006/EC) and the related list

(4)

of substances with very high concern (SVHC)

supply chain

for its

The products do not contain any of the banned substances

as per IEC 62474, GADSL, or the SVHC list, see

www.vishay.com/how/leadfree.

Hence the products fully comply with the following

directives:

1a ⁽¹⁾

• 2000/53/EC End-of-Life Vehicle Directive (ELV) and

Annex II (ELV II)

ASSEMBLY

• 2011/65/EU Restriction of the Use of Hazardous

Substances Directive (RoHS) with amendment

2015/863/EU

The resistors are suitable for processing on automatic

SMD assembly systems. They are suitable for automatic

soldering using wave, reflow or vapor phase as shown in

IEC 61760-1 ⁽¹⁾. The encapsulation is resistant to all

cleaning solvents commonly used in the electronics

industry, including alcohols, esters and aqueous solutions.

The suitability of conformal coatings, potting compounds

and their processes, if applied, shall be qualified by

appropriate means to ensure the long-term stability of the

whole system.

• 2012/19/EU Waste Electrical and Electronic Equipment

Directive (WEEE)

Vishay pursues the elimination of conflict minerals from its

supply chain, see the Conflict Minerals Policy at

www.vishay.com/doc?49037.

RELATED PRODUCTS

The resistors are RoHS compliant, the pure matte tin plating

provides compatibility with lead (Pb)-free and

lead-containing soldering processes. The immunity of the

plating against tin whisker growth has been proven under

extensive testing.

For products with precision specification see the datasheet:

• TNPW e3 - High Stability Thin Film Flat Chip Resistors

(www.vishay.com/doc?28758)

Notes

(1)

The quoted IEC standards are also released as EN standards with the same number and identical contents

(2)

(3)

(4)

The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474

The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org

The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table

Revision: 09-Jan-2020

Document Number: 28779

For technical questions, contact: thinfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TNPU e3

Vishay Draloric

www.vishay.com

FUNCTIONAL PERFORMANCE

120

100

-55

-25

100

150

175

125

Ambient Temperature in °C

Derating

TNPU1206 e3

TNPU0805 e3

TNPU0603 e3

110

100

10K

100K

Resistance Value in Ω

Non-Linearity

TNPU0805 e3

TNPU1206 e3

TNPU0603 e3

0.1

0.01

100

10K

100K

Resistance Value in Ω

Current Noise

Revision: 09-Jan-2020

Document Number: 28779

For technical questions, contact: thinfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TNPU e3

Vishay Draloric

www.vishay.com

TEST AND REQUIREMENTS

All tests are carried out in accordance with the following

specifications:

The tests are carried out under standard atmospheric

conditions in accordance with IEC 60068-1, 4.3, whereupon

the following values are applied:

EN 60115-1, generic specification

Temperature: 15 °C to 35 °C

EN 60115-8 (successor of EN 140400),

sectional specification

Relative humidity: 25 % to 75 %

EN 140401-801, detail specification

IEC 60068-2-xx, test methods

Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)

A climatic category LCT / UCT / 56 is applied, defined by the

lower category temperature (LCT), the upper category

temperature (UCT), and the duration of exposure in the

damp heat, steady state test (56 days).

The parameters stated in the Test Procedures and

Requirements table are based on the required tests and

permitted limits of EN 140401-801. The table presents only

the most important tests, for the full test schedule refer to

the documents listed above. However, some additional

tests and a number of improvements against those

minimum requirements have been included.

The components are mounted for testing on printed circuit

boards in accordance with EN 60115-8, 2.4.2, unless

otherwise specified.

The testing also covers most of the requirements specified

by EIA / ECA-703 and JIS-C-5201-1.

TEST PROCEDURES AND REQUIREMENTS

EN 60115-1 IEC 60068-2 ⁽¹⁾

REQUIREMENTS

PERMISSIBLE CHANGE (R)

TEST

PROCEDURE

CLAUSE

TEST METHOD

Stability for product types:

TNPU0402 e3

100  to 100 k

TNPU0603 e3

TNPU0805 e3

100  to 332 k

TNPU1206 e3

100  to 511 k

4.5

Resistance

0.1 %; 0.05 %; 0.02 %

Temperature

coefficient

At (20 / -55 / 20) °C

and (20 / 125 / 20) °C

4.8

10 ppm/K; 5 ppm/K; 2 ppm/K

U = P₇₀x R or U = U_max.

;

whichever is the less severe;

1.5 h on; 0.5 h off;

70 °C; 1000 h

4.25.1

Endurance at 70 °C

(0.05 % R + 0.01 )

(0.1 % R + 0.02 )

(0.05 % R + 0.01 )

(0.1 % R + 0.02 )

70 °C; 8000 h

125 °C; 1000 h

Endurance at upper

category temperature

4.25.3

4.24

125 °C; 8000 h

Damp heat,

steady state

(40 2) °C; 56 days;

(93 3) % RH

78 (Cab)

(0.1 % R + 0.01 )

4.23

Climatic sequence:

Dry heat

4.23.2

2 (Bb)

UCT; 16 h

55 °C; 24 h;

> 90 % RH;

5 cycle

4.23.3

30 (Db)

Damp heat, cyclic

4.23.4

4.23.5

1 (Ab)

13 (M)

Cold

LCT; 2 h

(0.1 % R + 0.02 )

Low air pressure

8.5 kPa; 2 h; (25 10) °C

55 °C; 24 h;

> 90 % RH;

5 cycles

4.23.6

30 (Db)

Damp heat, cyclic

U = P₇₀x R U_max.; 1 min

LCT = -55 °C

4.23.7

D.c. load

Cold

UCT = 125 °C

1 (Aa)

-55 °C; 2 h

(0.05 % R + 0.01 )

Revision: 09-Jan-2020

Document Number: 28779

For technical questions, contact: thinfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TNPU e3

Vishay Draloric

www.vishay.com

TEST PROCEDURES AND REQUIREMENTS

EN 60115-1 IEC 60068-2 ⁽¹⁾

REQUIREMENTS

PERMISSIBLE CHANGE (R)

TEST

PROCEDURE

CLAUSE

TEST METHOD

Stability for product types:

TNPU0402 e3

100  to 100 k

100  to 332 k

100  to 511 k

TNPU0603 e3

TNPU0805 e3

TNPU1206 e3

30 min at LCT and

30 min at UCT;

LCT = -55 °C;

UCT = 125 °C;

1000 cycles

Rapid change

of temperature

4.19

14 (Na)

(0.1 % R + 0.01 )

(0.05 % R + 0.01 )

U = 2.5 x P₇₀x R

or U = 2 x U_max.;

whichever is the less severe;

5 s

Short time

overload

4.13

4.22

Endurance by sweeping;

10 Hz to 2000 Hz;

no resonance;

(0.05 % R + 0.01 )

no visible damage

6 (Fc)

Vibration

amplitude  1.5 mm or

 200 m/s²; 6 h

Solder bath method;

SnPb40; non-activated flux

(215 3) °C; (3 0.3) s

Good tinning ( 95 % covered);

4.17

58 (Td)

Solderability

Solder bath method;

SnAg3Cu0,5 or SnAg3,5;

non-activated flux

no visible damage

(235 3) °C; (2 0.2) s

Resistance to

soldering heat

Solder bath method;

(260 5) °C; (10 1) s

4.18

4.29

58 (Td)

45 (XA)

(0.02 % R + 0.01)

Component solvent

resistance

Isopropyl alcohol

+50 °C; method 2

No visible damage

RR 1005M and

RR 1608M; 9 N

4.32

21 (Ue₃)

Shear (adhesion)

No visible damage

RR 2012M and

RR 3216M; 45 N

(0.05 % R + 0.01)

4.33

4.7

21 (Ue₁)

Substrate bending

Voltage proof

Depth 2 mm, 3 times

no visible damage, no open circuit in bent position

U_RMS= U_ins; 60 5 s

No flashover or breakdown

IEC 60695-11-5 ⁽¹⁾

4.35

Flammability

No burning after 30 s

needle flame test; 10 s

U = 15 x P₇₀x R

Periodic electric

overload:

Standard operation

mode

or U = 2 x U_max.

;

4.39

4.37

whichever is the less severe;

0.1 s on; 2.5 s off;

1000 cycles

(0.1 R + 0.02 )

(0.25 R + 0.05 )

Damp heat,

steady state,

accelerated

(85 5) °C; 56 days

(85 5) % RH

67 (Cy)

IEC 61340-3-1 ⁽¹⁾

3 pos. + 3 neg.

;

(equivalent to MIL-STD-883,

method 3015)

Electro static

discharge

(Human Body Model)

4.38

(0.5 R + 0.05 )

TNPU0402: 400 V

TNPU0603: 1000 V

TNPU0805: 1500 V

TNPU1206: 2000 V

Note

(1)

The quoted IEC standards are also released as EN standards with the same number and identical contents

Revision: 09-Jan-2020

Document Number: 28779

For technical questions, contact: thinfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TNPU e3

Vishay Draloric

www.vishay.com

DIMENSIONS

T_t

T_b

DIMENSIONS AND MASS

(mm)

T_t/ T_b

(mm)

MASS

(mg)

TYPE / SIZE

(mm)

TNPU0402 e3

TNPU0603 e3

TNPU0805 e3

TNPU1206 e3

1.0 0.05

0.5 0.05

0.85 0.10

1.25 0.15

1.6 0.15

0.35 0.05

0.45 0.10

0.55 0.10

0.2 0.10

0.3 0.20

0.4 0.20

0.5 0.25

0.65

1.6 0.10

2.0 0.15

3.2 0.15

5.5

SOLDER PAD DIMENSIONS

RECOMMENDED SOLDER PAD DIMENSIONS

REFLOW SOLDERING

TYPE / SIZE

WAVE SOLDERING

(mm)

TNPU0402 e3

TNPU0603 e3

TNPU0805 e3

TNPU1206 e3

0.4

0.5

0.7

0.9

0.6

0.9

1.3

1.7

0.5

1.0

1.2

2.0

0.9

1.1

0.9

1.3

1.7

1.0

1.3

2.3

Notes

•

The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x ⁽¹⁾

or in publication IPC-7351

(1)

The quoted IEC standards are also released as EN standards with the same number and identical contents

Revision: 09-Jan-2020

Document Number: 28779

For technical questions, contact: thinfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Legal Disclaimer Notice

www.vishay.com

Vishay

Disclaimer

ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE

RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.

Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,

“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other

disclosure relating to any product.

Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or

the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all

liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,

consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular

purpose, non-infringement and merchantability.

Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical

requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements

about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product

with the properties described in the product specification is suitable for use in a particular application. Parameters provided in

datasheets and / or specifications may vary in different applications and performance may vary over time. All operating

parameters, including typical parameters, must be validated for each customer application by the customer's technical experts.

Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited

to the warranty expressed therein.

Hyperlinks included in this datasheet may direct users to third-party websites. These links are provided as a convenience and

for informational purposes only. Inclusion of these hyperlinks does not constitute an endorsement or an approval by Vishay of

any of the products, services or opinions of the corporation, organization or individual associated with the third-party website.

Vishay disclaims any and all liability and bears no responsibility for the accuracy, legality or content of the third-party website

or for that of subsequent links.

Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining

applications or for any other application in which the failure of the Vishay product could result in personal injury or death.

Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please

contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by

any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.

Revision: 09-Jul-2021

Document Number: 91000

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