Approval sheet
TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)
TEST
PROCEDURE
REQUIREMENT
High temperature
exposure
155ºC, no load, 1000hours
R/R max. (1%+0.05)
no visible damage
MIL-STD-202 method
108
30 minutes at -55C3C, 2~3 minutes at 20°C+5°C-1°C, 30
minutes at +155C3C, 2~3 minutes at 20°C+5°C-1°C, total
1000 cycles
no visible damage
Temperature cycling
AEC Q200-4
R/R max. ±(0.5%+0.05)
Bias Humidity
1000 hours, at 10% rated continuous power in humidity
chamber controller at 85C2C and 85% relative humidity,
R/R max. (1%+0.05)
MIL-STD-202 method
103
no visible damage
Operational Life
MIL-STD-202 method
108
1000+48/-0 hours; 35% of operation power, 1252C
R/R max. (1%+0.05)
no visible damage
Solvent: 2−propanol at 25℃
Immersion time: 3 min
Brush: 10 times brushing
Resistance to Solvent
MIL-STD-202 method
215
R/R max. ±(0.5%+0.05)
no visible damage
Immersion and brush cycle: 3cycle
Mechanical Shock
MIL-STD-202 method
213
Waveform: half sine,
Peak value100G,
Normal duration 6ms
Condition: XX'YY'ZZ', 10times each
Peak acceleration and Sweep time: 5 g's for 20
min , Frequency 10Hz to 2000Hz,
Condition: 12 cycles each of 3 orientations
R/R max. ±(0.5%+0.05)
no visible damage
Vibration
MIL-STD-202 method
204
R/R max. ±(0.5%+0.05)
no visible damage
Un-mounted chips completely immersed for 10±1second in a
solder bath at 260℃±5ºC
Resistance to soldering
heat (R.S.H) MIL-STD-
202 method 210
R/R max. ±(0.5%+0.05)
no visible damage
Human body model, 2 Kohm, 150 pF,
Test voltage: 2KV
ESD test
R/R max. (1%+0.05)
no visible damage
JIS-STD-002
a) Bake the sample for 155 ºC dwell time 4hrs /
solder dipping 235ºC/ 5s. Solder: Sn96.5-Ag3-Cu0.5
b) Solder dipping 215ºC/ 5s. Solder: Sn63Pb37
good tinning (>95% covered)
no visible damage
Solderability
JIS-STD-002
c) Solder dipping 260ºC/ 7s.
Natural resistance change per change in degree centigrade.
Refer to “QUICK
REFERENCE DATA”
Temperature Coefficient
of Resistance(T.C.R)
R2 R
106 (ppm/C) t1 : 20°C+5°C-1°C
1
Clause 4.8
R
1t2 t1
R1 : Resistance at reference temperature
R2 : Resistance at test temperature +155’C
Bending strength
Resistors mounted on a 90mm glass epoxy resin PCB(FR4);
bending : 2 mm, once for 60 seconds
R/R max. ±(0.5%+0.05)
no visible damage
AEC Q200-005
Adhesion
Pressurizing force: 10N for 0603; 17.7N for 0805,
R/R max. ±(0.5%+0.05)
AEC Q200-006
Test time: 60±1sec.
No remarkable damage or
removal of the terminations
Page 6 of 8
ASC_MKxxS_AUTO_V02
APR 2017