CATALOGUE NUMBERS
The resistors have a catalogue number starting with .
WR25
X
472_
J
T
L
J
Size code
Type code
X :
Resistance code
Tolerance
F : ±1%
Packaging code
Termination
code
Special code
WR25 : 2512
WR20 : 2010
5%, E24: 2 significant digits
followed by no. of zeros
T
: 7” Reeled taping
: 10” Reeled taping
: 13” Reeled taping
: Bulk
J
= Automotive grade
and Anti-Sulfuration
10ppm x 240hrs
L
= Sn base
Q
G
B
±5%, 1R ~ 10MR
±1%, 10R ~ 1MR
W :
J : ±5%
(lead free)
100Ω = 101_
10KΩ = 103
P : Jumper
1%, E24+E96: 3 significant
digits followed by no. of
zeros
±1%,< 10R; > 1MR
100Ω
=1000
=3742
37.4KΩ
TEST AND REQUIREMENTS
Essentially all tests are carried out according to the schedule of IEC publication 115-8, category
LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp
heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.
The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical
robustness testing procedure for electronic components" and under standard atmospheric conditions according
to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :
Temperature: 15°C to 35°C.
Relative humidity: 45% to 75%.
Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).
All soldering tests are performed with midly activated flux.
REQUIREMENT
TEST
PROCEDURE / TEST METHOD
Resistor
Within the specified tolerance
Refer to “QUICK REFERENCE
DATA”
0Ω
Electrical Characteristics
-
-
DC resistance values measurement
Temperature Coefficient of Resistance (T.C.R)
Natural resistance change per change in degree centigrade.
JISC5201-1: 1998
Clause 4.8
<50mΩ
R2 − R
×106 (ppm/°C) t1 : 20°C+5°C-1°C
1
R
(
t2 − t1
)
1
R1 : Resistance at reference temperature
R2 : Resistance at test temperature
ΔR/R max. ±(1.0%+0.05Ω)
Un-mounted chips completely immersed for 10±1second in a
SAC solder bath at 270℃±5ºC
Resistance to soldering
heat(R.S.H)
no visible damage
<50mΩ
MIL-STD-202
method 210
a) Bake the sample for 155℃ dwell time 4hrs/ solder dipping
235℃/ 5sec.
Solderability
95% coverage min., good tinning and no
visible damage
J-STD-002
b) Steam the sample dwell time 1 hour/ solder dipping
260℃/ 7sec.
1000 cycles, -55℃ ~ +155℃, dwell time 5~10min
∆R/R max. ±(1.0%+0.05Ω)
Temperature cycling
JESD22
<50mΩ
No visible damage
Method JA-104
Page 5 of 7
WR20, WR25 ( Automotive )_V02
Jan.2011