C322C101J2G5TA 封装和模型
品牌：KEMET
描述：GoldMax 300 Comm C0G, Ceramic, 100 pF, 5%, 200 V, C0G, GoldMax, Commercial Standard, Lead Spacing = 5.08mm
EDA/CDA模型
原理图符号
PCB 封装图
3D模型
其他器件
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