HMC875LC3CTR 封装和模型

品牌:ADI
描述:TpHL传输延迟时间:0.12ns;通道数:1;共模抑制比CMRR:35dB PSRR;最小工作温度:-40°C;最大工作温度:85°C;元器件封装:16-SMT(3x3);
EDA/CDA模型
原理图符号
PCB 封装图
3D模型
其他器件
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- HMC832LP6GETR
- HMC8410LP2FE
- HMC882ALP5E
- HMC8412TCPZ-EP-R7
- HMC840LP6CETR
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- HMC8411LP2FETR
- HMC848LC5
- HMC8412TCPZ-EP-PT
- HMC802ALP3ETR
- HMC8100LP6JE
- HMC875LC3CTR
- HMC8500LP5DE
- HMC814LC3B
- HMC840LP6CE
- HMC8342LS6
- HMC8500PM5ETR
- HMC8108LC5
- HMC830LP6GE
- HMC815BLC5TR-R5
- HMC8413LP2FETR
- HMC830LP6GETR
- HMC8410LP2FETR
- HMC8191LC4
- HMC8413LP2FE
- HMC849LP4CE
- HMC8412LP2FE
- HMC8362LP6GE
- HMC8412LP2FETR
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- HMC870LC5
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- HMC8362LP6GETR
- HMC875LC3CTR-R5
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- HMC822LP6CETR
- HMC8342LS6TR
- HMC8038LP4CETR
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- HMC838LP6CETR
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- HMC815BLC5TR