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Document Number: MMA25312B  
Rev. 0, 9/2012  
Freescale Semiconductor  
Technical Data  
Heterojunction Bipolar Transistor  
MMA25312BT1  
Technology (InGaP HBT)  
High Efficiency/Linearity Amplifier  
The MMA25312B is a high efficiency InGaP HBT amplifier designed for  
use in 2400 MHz ISM applications, WLAN (802.11g), WiMAX (802.16e) and  
wireless broadband mesh networks. It is suitable for applications with  
frequencies from 2300 to 2700 MHz using simple external matching  
components with a 3 to 5 volt supply.  
2300--2700 MHz, 26 dB  
31 dBm  
InGaP HBT  
Features  
•
•
•
•
•
•
•
•
•
Frequency: 2300--2700 MHz  
P1dB: 31 dBm @ 2500 MHz  
Power Gain: 26 dB @ 2500 MHz  
OIP3: 40 dBm @ 2500 MHz  
Active Bias Control (On--chip)  
Single 3 to 5 Volt Supply  
Single--ended Power Detector  
Cost--effective QFN Surface Mount Package  
In Tape and Reel. T1 Suffix = 1,000 Units, 12 mm Tape Width, 7 inch Reel.  
CASE 2131--01  
QFN 3×3  
PLASTIC  
Table 1. Typical CW Performance (1)  
Table 2. Maximum Ratings  
Rating  
Supply Voltage  
Symbol  
Value  
Unit  
V
Characteristic  
Symbol 2300 2500 2700  
Unit  
dB  
MHz  
MHz  
MHz  
V
6
550  
CC  
CC  
Small--Signal Gain  
(S21)  
G
26  
26  
24.5  
p
Supply Current  
I
mA  
dBm  
°C  
RF Input Power  
P
30  
in  
Input Return Loss  
(S11)  
IRL  
ORL  
P1dB  
-- 1 4  
-- 11  
30  
-- 1 2  
-- 1 3  
31  
-- 1 2  
-- 1 5  
29.8  
dB  
Storage Temperature Range  
T
stg  
--65 to +150  
150  
(2)  
Junction Temperature  
T
J
°C  
Output Return Loss  
(S22)  
dB  
2. For reliable operation, the junction temperature should not  
exceed 150°C.  
Power Output @  
1dB Compression  
dBm  
1. V  
= V  
= V  
= 5 Vdc, T = 25°C, 50 ohm system, CW  
BIAS A  
CC1  
CC2  
Application Circuit  
Table 3. Thermal Characteristics  
(3)  
Characteristic  
Symbol  
Value  
Unit  
Thermal Resistance, Junction to Case  
R
θ
92  
°C/W  
JC  
Case Temperature 91°C, V = V  
= V  
= 5 Vdc  
BIAS  
CC1  
CC2  
3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.  
Select Documentation/Application Notes -- AN1955.  
© Freescale Semiconductor, Inc., 2012. All rights reserved.  
Table 4. Electrical Characteristics (V  
= V  
= V  
= 5 Vdc, 2500 MHz, T = 25°C, 50 ohm system, in Freescale CW Application  
BIAS A  
CC1  
CC2  
Circuit)  
Characteristic  
Small--Signal Gain (S21)  
Symbol  
Min  
24.5  
—
Typ  
26  
Max  
—
Unit  
dB  
G
p
Input Return Loss (S11)  
IRL  
ORL  
P1dB  
OIP3  
NF  
-- 1 2  
-- 1 3  
31  
—
dB  
Output Return Loss (S22)  
—
—
dB  
Power Output @ 1dB Compression  
—
—
dBm  
dBm  
dB  
Third Order Output Intercept Point, Two--Tone CW  
Noise Figure  
—
40  
—
—
3.8  
124  
5
—
(1)  
Supply Current  
I
110  
—
138  
—
mA  
V
CQ  
(1)  
Supply Voltage  
V
CC  
Table 5. ESD Protection Characteristics  
Test Methodology  
Class  
Human Body Model (per JESD 22--A114)  
Machine Model (per EIA/JESD 22--A115)  
Charge Device Model (per JESD 22--C101)  
2
A
IV  
Table 6. Moisture Sensitivity Level  
Test Methodology  
Rating  
Package Peak Temperature  
Unit  
Per JESD22--A113, IPC/JEDEC J--STD--020  
1
260  
°C  
1. For reliable operation, the junction temperature should not exceed 150°C.  
V
V
V
CC1  
BA2  
CC1  
V
V
V
BA2 CC1 CC1  
RF  
V
12 11 10  
out  
out  
BA1  
BIAS  
CIRCUIT  
V
1
2
3
9
8
7
RF  
BA1  
out  
RF  
V
RF  
BIAS  
out  
V
BIAS  
V
RF  
CC2  
V
in  
CC2  
4
5
6
RF  
in  
N.C. N.C. PDET  
PDET  
Figure 1. Functional Block Diagram  
Figure 2. Pin Connections  
MMA25312BT1  
RF Device Data  
Freescale Semiconductor, Inc.  
2
V
V
CC1  
BIAS  
L2  
10  
C1  
C7  
C2  
Z2  
R1  
R2  
12  
11  
1
9
BIAS  
CIRCUIT  
RF  
OUTPUT  
C5  
Z1  
2
3
8
7
C13  
C11  
RF  
INPUT  
V
CC2  
L3  
C8  
DETECTOR  
6
C14  
4
5
P
DET  
C9  
Z1  
Z2  
0.140″ x 0.030″ Microstrip  
0.073″ x 0.030″ Microstrip  
Figure 3. MMA25312BT1 Test Circuit Schematic — 2500 MHz, 5 Volt Operation  
Table 7. MMA25312BT1 Test Circuit Component Designations and Values — 2500 MHz, 5 Volt Operation  
Part  
Description  
1 μF Chip Capacitors  
Part Number  
Manufacturer  
Murata  
C1, C2  
GRM155R61A105KE15  
C3, C4, C6, C10, C12, C15  
Components Not Placed  
100 pF Chip Capacitors  
8.2 pF Chip Capacitor  
22 pF Chip Capacitors  
1.5 pF Chip Capacitor  
4.7 μF Chip Capacitor  
1.2 nH Chip Inductor  
C5, C9  
C7  
GRM1555C1H101JA01  
04023J8R2BBS  
Murata  
AVX  
C8, C13  
C11  
C14  
L2  
04023J22R0BBS  
AVX  
04023J1R5BBS  
AVX  
GRM188R60J475KE19D  
LL1608-FH1N2S  
Murata  
TOKO  
TOKO  
Yageo  
Yageo  
L3  
22 nH Chip Inductor  
LL1608-FH22N0S  
RC0402JR-07430RL  
RC0402JR-071K60L  
R1  
430 Ω, 1/16 W Chip Resistor  
1.6 kΩ, 1/16 W Chip Resistor  
Component Not Placed  
R2  
R3  
PCB  
0.014″, ε = 3.7  
FR408  
Isola  
r
Note: Component numbers C3, C4, C6, C10, C12, C15 and R3 are labeled on board but not placed.  
Note: Component L1 intentionally omitted.  
MMA25312BT1  
RF Device Data  
Freescale Semiconductor, Inc.  
3
C2  
C1  
R3*  
C3*  
L2  
C6*  
R2  
C7  
RF  
R1  
C5  
OUT  
C4*  
RF  
IN  
C12*  
C13  
C11  
C8  
C10*  
C9  
C14  
L3  
C15*  
QFN 3x3--12N Rev. 0  
(1) V  
[Board] supplies V  
, V  
BA1  
and V  
[Device].  
BIAS  
BIAS  
BA2  
Note: Component numbers C3*, C4*, C6*, C10*, C12*, C15* and R3* are labeled on board  
but not placed.  
Figure 4. MMA25312BT1 Test Circuit Component Layout — 2500 MHz, 5 Volt Operation  
Table 7. MMA25312BT1 Test Circuit Component Designations and Values — 2500 MHz, 5 Volt Operation  
Part  
Description  
1 μF Chip Capacitors  
Part Number  
Manufacturer  
Murata  
C1, C2  
GRM155R61A105KE15  
C3, C4, C6, C10, C12, C15  
Components Not Placed  
100 pF Chip Capacitors  
8.2 pF Chip Capacitor  
22 pF Chip Capacitors  
1.5 pF Chip Capacitor  
4.7 μF Chip Capacitor  
1.2 nH Chip Inductor  
C5, C9  
C7  
GRM1555C1H101JA01  
04023J8R2BBS  
Murata  
AVX  
C8, C13  
C11  
C14  
L2  
04023J22R0BBS  
AVX  
04023J1R5BBS  
AVX  
GRM188R60J475KE19D  
LL1608-FH1N2S  
Murata  
TOKO  
TOKO  
Yageo  
Yageo  
L3  
22 nH Chip Inductor  
LL1608-FH22N0S  
RC0402JR-07430RL  
RC0402JR-071K60L  
R1  
430 Ω, 1/16 W Chip Resistor  
1.6 kΩ, 1/16 W Chip Resistor  
Component Not Placed  
R2  
R3  
PCB  
0.014″, ε = 3.7  
FR408  
Isola  
r
Note: Component L1 intentionally omitted.  
(Component Designations and Values table repeated for reference.)  
MMA25312BT1  
RF Device Data  
Freescale Semiconductor, Inc.  
4
V
V
CC1  
BIAS  
L2  
10  
C1  
C7  
C2  
Z2  
R1  
R2  
12  
11  
1
9
BIAS  
CIRCUIT  
RF  
OUTPUT  
C5  
Z1  
2
3
8
7
C13  
C11  
RF  
INPUT  
V
CC2  
L3  
C8  
DETECTOR  
6
C14  
4
5
P
DET  
C9  
Z1  
Z2  
0.140″ x 0.030″ Microstrip  
0.073″ x 0.030″ Microstrip  
Figure 5. MMA25312BT1 Test Circuit Schematic — 2500 MHz, 3.3 Volt Operation  
Table 8. MMA25312BT1 Test Circuit Component Designations and Values — 2500 MHz, 3.3 Volt Operation  
Part  
Description  
1 μF Chip Capacitors  
Part Number  
Manufacturer  
Murata  
C1, C2  
GRM155R61A105KE15  
C3, C4, C6, C10, C12, C15  
Components Not Placed  
100 pF Chip Capacitors  
8.2 pF Chip Capacitor  
22 pF Chip Capacitors  
1.5 pF Chip Capacitor  
4.7 μF Chip Capacitor  
1.2 nH Chip Inductor  
C5, C9  
C7  
GRM1555C1H101JA01  
04023J8R2BBS  
Murata  
AVX  
C8, C13  
C11  
C14  
L2  
04023J22R0BBS  
AVX  
04023J1R5BBS  
AVX  
GRM188R60J475KE19D  
LL1608-FH1N2S  
Murata  
TOKO  
TOKO  
Yageo  
Yageo  
L3  
22 nH Chip Inductor  
LL1608-FH22N0S  
RC0402JR-07100RL  
RC0402JR-07470RL  
R1  
100 Ω, 1/16 W Chip Resistor  
470 Ω, 1/16 W Chip Resistor  
Component Not Placed  
R2  
R3  
PCB  
0.014″, ε = 3.7  
FR408  
Isola  
r
Note: Component numbers C3, C4, C6, C10, C12, C15 and R3 are labeled on board but not placed.  
Note: Component L1 intentionally omitted.  
MMA25312BT1  
RF Device Data  
Freescale Semiconductor, Inc.  
5
C2  
C1  
R3*  
C3*  
L2  
C6*  
R2  
C7  
RF  
R1  
C5  
OUT  
C4*  
RF  
IN  
C12*  
C13  
C11  
C8  
C10*  
C9  
C14  
L3  
C15*  
QFN 3x3--12N Rev. 0  
(1) V  
[Board] supplies V  
, V  
BA1  
and V  
[Device].  
BIAS  
BIAS  
BA2  
Note: Component numbers C3*, C4*, C6*, C10*, C12*, C15* and R3* are labeled on board  
but not placed.  
Figure 6. MMA25312BT1 Test Circuit Component Layout — 2500 MHz, 3.3 Volt Operation  
Table 8. MMA25312BT1 Test Circuit Component Designations and Values — 2500 MHz, 3.3 Volt Operation  
Part  
Description  
1 μF Chip Capacitors  
Part Number  
Manufacturer  
Murata  
C1, C2  
GRM155R61A105KE15  
C3, C4, C6, C10, C12, C15  
Components Not Placed  
100 pF Chip Capacitors  
8.2 pF Chip Capacitor  
22 pF Chip Capacitors  
1.5 pF Chip Capacitor  
4.7 μF Chip Capacitor  
1.2 nH Chip Inductor  
C5, C9  
C7  
GRM1555C1H101JA01  
04023J8R2BBS  
Murata  
AVX  
C8, C13  
C11  
C14  
L2  
04023J22R0BBS  
AVX  
04023J1R5BBS  
AVX  
GRM188R60J475KE19D  
LL1608-FH1N2S  
Murata  
TOKO  
TOKO  
Yageo  
Yageo  
L3  
22 nH Chip Inductor  
LL1608-FH22N0S  
RC0402JR-07100RL  
RC0402JR-07470RL  
R1  
100 Ω, 1/16 W Chip Resistor  
470 Ω, 1/16 W Chip Resistor  
Component Not Placed  
R2  
R3  
PCB  
0.014″, ε = 3.7  
FR408  
Isola  
r
Note: Component L1 intentionally omitted.  
(Component Designations and Values table repeated for reference.)  
MMA25312BT1  
RF Device Data  
Freescale Semiconductor, Inc.  
6
3.00  
0.70  
2.00  
0.30  
3.40  
0.50  
1.6 x 1.6 Solder Pad  
with Thermal Via  
Structure  
Figure 7. PCB Pad Layout for QFN 3×3  
MA04  
YWZ  
Figure 8. Product Marking  
MMA25312BT1  
RF Device Data  
Freescale Semiconductor, Inc.  
7
PACKAGE DIMENSIONS  
MMA25312BT1  
RF Device Data  
Freescale Semiconductor, Inc.  
8
MMA25312BT1  
RF Device Data  
Freescale Semiconductor, Inc.  
9
MMA25312BT1  
RF Device Data  
Freescale Semiconductor, Inc.  
10  
PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS  
Refer to the following documents, software and tools to aid your design process.  
Application Notes  
•
•
AN1955: Thermal Measurement Methodology of RF Power Amplifiers  
AN3100: General Purpose Amplifier and MMIC Biasing  
Software  
.s2p File  
Development Tools  
•
•
Printed Circuit Boards  
For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the  
Software & Tools tab on the part’s Product Summary page to download the respective tool.  
REVISION HISTORY  
The following table summarizes revisions to this document.  
Revision  
Date  
Description  
0
Sept. 2012  
• Initial Release of Data Sheet  
MMA25312BT1  
RF Device Data  
Freescale Semiconductor, Inc.  
11  
Information in this document is provided solely to enable system and software  
implementers to use Freescale products. There are no express or implied copyright  
licenses granted hereunder to design or fabricate any integrated circuits based on the  
information in this document.  
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herein. Freescale makes no warranty, representation, or guarantee regarding the  
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disclaims any and all liability, including without limitation consequential or incidental  
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E 2012 Freescale Semiconductor, Inc.  
Document Number: MMA25312B  
Rev. 0, 9/2012