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F315M F11  
SAW Filter  
1. SCOPE  
This specification shall cover the characteristics of SAW filter 315MHz with used for  
remote-control security.  
2. ELECTRICAL SPECIFICATION  
DC Voltage VDC 10V  
AC Voltage Vpp  
10V50Hz/60Hz  
-40℃ to +85℃  
-45℃ to +85℃  
0dBm  
Operation temperature  
Storage temperature  
RF Power Dissipation  
Electronic Characteristics  
2-1.Type frequency response  
2-2.Electrical characteristics  
Characteristic  
Sym  
Fc  
Notes  
1.2  
Min  
Typical  
Max  
Units  
MHz  
KHz  
dB  
Absolute frequency  
314.920 315.000 315.080  
Center  
frequency  
Tolerance from nominal  
Δfc  
IL  
±80  
Insertion Loss  
1
1.7  
700  
0.2  
50  
3.0  
800  
0.5  
3dB Bandwidth  
BW3  
1.2  
500  
KHz  
dB  
Passband Ripple (Fc±400 KHz)  
At fo-21.4MHz (Image)  
Rejection At fo-10.7 MHz (LO)  
Ultimate  
40  
16  
1
40  
dB  
80  
Operating case temp.  
Tc  
To  
-35  
22  
+85  
62  
℃
℃
Tumor temp.  
37  
fc  
Temperature  
3.4  
5
characteristics  
Tumover Frequency  
Fre.temp.coeficient  
fo  
MHz  
ppm/℃  
ppm/y  
FTC  
0.032  
<±10  
Frequency aging  
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD  
.
F315M F11  
SAW Filter  
Note:  
1. Typical test circuit is shown as below.  
2. Passband and reject bands are specified in reference to fc.  
3. The turnover temperature, To, is the temperature at the maximum frequency, Fo.  
4. The nominal frequency at any case temperature, Tc, inside the operating temperature range may  
be calculated from:f=fo[1-FTC(To-Tc)2].  
5. Typical aging is for 10 years.  
3. TEST CIRCUIT  
4. DIMENSION  
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD  
.
F315M F11  
SAW Filter  
5. ENVIRONMENTAL CHARACTERISTICS  
5-1 High temperature exposure  
Subject the device to +85℃ for 16 hours. Then release the filter into the room conditions  
for 24 hours prior to the measurement. It shall fulfill the specifications in 2-2.  
5-2 Low temperature exposure  
Subject the device to -40℃ for 16 hours. Then release the device into the room conditions  
for 24 hours prior to the measurement. It shall fulfill the specifications in 2-2.  
5-3 Temperature cycling  
Subject the device to a low temperature of -40℃ for 30 minutes. Following by a high  
temperature of +85℃ for 30 Minutes. Then release the device into the room conditions  
for 24 hours prior to the measurement. It shall meet the specifications in 2-2.  
5-4 Resistance to solder heat  
Dip the device terminals no closer than 1.5mm into the solder bath at 260℃ ±10℃ for  
10±1 sec. Then release the device into the room conditions for 4 hours. The device shall  
meet the specifications in 2-2.  
5-5 Solderability  
Subject the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95%  
area of the terminals must be covered with new solder. It shall meet the specifications in  
2-2.  
5-6 Mechanical shock  
Drop the device randomly onto the concrete floor from the height of 1m 3 times. the  
device shall fulfill the specifications in 2-2.  
5-7 Vibration  
Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of  
1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in 2-2.  
6. REMARK  
6.1 Static voltage  
Static voltage between signal load & ground may cause deterioration &destruction of  
the component. Please avoid static voltage.  
6.2 Ultrasonic cleaning  
Ultrasonic vibration may cause deterioration & destruction of the component. Please  
avoid ultrasonic cleaning  
6.3 Soldering  
Only leads of component may be solded. Please avoid soldering another part of  
component.  
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD  
.