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DISCRETE SEMICONDUCTORS  
DATA SHEET  
1N4001G to 1N4007G  
Rectifiers  
1996 May 24  
Product specification  
Supersedes data of April 1992  
Philips Semiconductors  
Product specification  
Rectifiers  
1N4001G to 1N4007G  
This package is hermetically sealed  
and fatigue free as coefficients of  
expansion of all used parts are  
matched.  
FEATURES  
DESCRIPTION  
• Glass passivated  
Rugged glass package, using a high  
temperature alloyed construction.  
• High maximum operating  
temperature  
• Low leakage current  
• Excellent stability  
k
a
• Available in ammo-pack.  
MAM047  
Fig.1 Simplified outline (SOD57) and symbol.  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
VRRM  
repetitive peak reverse voltage  
1N4001G  
−
−
−
−
−
−
−
50  
100  
200  
400  
600  
800  
V
V
V
V
V
V
V
1N4002G  
1N4003G  
1N4004G  
1N4005G  
1N4006G  
1N4007G  
1000  
VR  
continuous reverse voltage  
1N4001G  
−
−
−
−
−
−
−
−
50  
100  
V
V
V
V
V
V
V
1N4002G  
1N4003G  
200  
1N4004G  
400  
1N4005G  
600  
1N4006G  
800  
1N4007G  
1000  
IF(AV)  
1.00 A  
0.75 A  
1.00 A  
average forward current  
averaged over any 20 ms  
period; Tamb = 75 °C; see Fig.2  
−
averaged over any 20 ms  
period; Tamb = 100 °C; see Fig.2  
IF  
continuous forward current  
repetitive peak forward current  
non-repetitive peak forward current  
storage temperature  
−
−
Tamb = 75 °C; see Fig.2  
IFRM  
IFSM  
Tstg  
Tj  
10  
A
A
half sinewave; 60 Hz  
−
30  
+175  
+175  
−65  
−65  
°C  
°C  
junction temperature  
1996 May 24  
2
Philips Semiconductors  
Product specification  
Rectifiers  
1N4001G to 1N4007G  
ELECTRICAL CHARACTERISTICS  
Tj = 25 °C; unless otherwise specified.  
SYMBOL  
PARAMETER  
forward voltage  
CONDITIONS  
IF = 1 A; see Fig.3  
MAX.  
UNIT  
VF  
1.1  
0.8  
10  
V
V
VF(AV)  
IR  
full-cycle average forward voltage  
reverse current  
IF(AV) = 1 A  
VR = VRmax  
µA  
µA  
µA  
VR = VRmax; Tamb = 100 °C  
VR = VRRMmax; Tamb = 75 °C  
50  
IR(AV)  
full-cycle average reverse current  
30  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
CONDITIONS  
VALUE  
46  
UNIT  
Rth j-tp  
Rth j-a  
thermal resistance from junction to tie-point  
thermal resistance from junction to ambient  
lead length = 10 mm  
note 1  
K/W  
K/W  
100  
Note  
1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥40 µm, see Fig.4.  
For more information please refer to the “General Part of associated Handbook”.  
1996 May 24  
3
Philips Semiconductors  
Product specification  
Rectifiers  
1N4001G to 1N4007G  
GRAPHICAL DATA  
MBH385  
10  
handbook, halfpage  
MBH386  
1.5  
handbook, halfpage  
I
F
I
F
(A)  
(A)  
1
1
0.5  
(1)  
(2)  
(3)  
1
−1  
10  
0
0.5  
1.5  
V
(V)  
F
0
0
100  
200  
T
(°C)  
amb  
(1) Tamb = 100 °C.  
(2) Tamb = 20 °C.  
(3) Tamb = −50 °C.  
Fig.2 Maximum forward current as a function of  
ambient temperature.  
Fig.3 Forward current as a function of forward  
voltage; typical values.  
50  
handbook, halfpage  
25  
7
50  
2
3
MGA200  
Dimensions in mm.  
Fig.4 Device mounted on a printed-circuit board.  
1996 May 24  
4
Philips Semiconductors  
Product specification  
Rectifiers  
1N4001G to 1N4007G  
PACKAGE OUTLINE  
k
a
0.81  
max  
3.81  
max  
4.57  
max  
MBC880  
28 min  
28 min  
Dimensions in mm.  
Fig.5 SOD57.  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1996 May 24  
5