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FM1608  
64Kb Bytewide FRAM Memory  
Features  
SRAM & EEPROM Compatible  
64K bit Ferroelectric Nonvolatile RAM  
·
·
·
·
JEDEC 8Kx8 SRAM & EEPROM pinout  
120 ns access time  
180 ns cycle time  
·
·
·
·
·
Organized as 8,192 x 8 bits  
High endurance 10 Billion (1010) read/writes  
10 year data retention at 85° C  
NoDelay™ write  
Equal access & cycle time for reads and writes  
Advanced high-reliability ferroelectric process  
Low Power Operation  
·
·
15 mA active current  
20 mA standby current  
Superior to BBSRAM Modules  
·
·
·
·
·
No battery concerns  
Monolithic reliability  
True surface mount solution, no rework steps  
Superior for moisture, shock, and vibration  
Resistant to negative voltage undershoots  
Industry Standard Configuration  
·
·
Industrial temperature -40° C to +85° C  
28-pin SOP or DIP  
Description  
Pin Configuration  
The FM1608 is a 64-kilobit nonvolatile memory  
employing an advanced ferroelectric process. A  
ferroelectric random access memory or FRAM is  
nonvolatile but operates in other respects as a RAM.  
It provides data retention for 10 years while  
eliminating the reliability concerns, functional  
disadvantages and system design complexities of  
battery-backed SRAM. Its fast write and high write  
endurance make it superior to other types of  
nonvolatile memory.  
NC  
A12  
A7  
VDD  
WE  
NC  
A6  
A8  
A5  
A9  
A4  
A11  
OE  
A3  
A2  
A10  
CE  
In-system operation of the FM1608 is very similar to  
other RAM based devices. Memory read- and write-  
cycles require equal times. The FRAM memory,  
however, is nonvolatile due to its unique ferroelectric  
memory process. Unlike BBSRAM, the FM1608 is a  
truly monolithic nonvolatile memory. It provides the  
same functional benefits of a fast write without the  
serious disadvantages associated with modules and  
batteries or hybrid memory solutions.  
A1  
A0  
DQ7  
DQ6  
DQ5  
DQ4  
DQ3  
DQ0  
DQ1  
DQ2  
VSS  
These capabilities make the FM1608 ideal for  
nonvolatile memory applications requiring frequent or  
Ordering Information  
120 ns access, 28-pin plastic DIP  
120 ns access, 28-pin SOP  
rapid writes in  
a bytewide environment. The  
FM1608-120-P  
FM1608-120-S  
availability of a true surface-mount package improves  
the manufacturability of new designs, while the DIP  
package facilitates simple design retrofits. The  
FM1608 offers guaranteed operation over an  
industrial temperature range of -40°C to +85°C.  
This data sheet contains design specifications for product development.  
These specifications may change in any manner without notice  
Ramtron International Corporation  
1850 Ramtron Drive, Colorado Springs, CO 80921  
(800) 545-FRAM, (719) 481-7000, Fax (719) 481-7058  
www.ramtron.com  
28 July 2000  
1/12  
Ramtron  
FM1608  
Figure 1. Block Diagram  
A10-A12  
Block Decoder  
Pin  
Description  
1Kx8  
1Kx8  
1Kx8  
1Kx8  
1Kx8  
1Kx8  
1Kx8  
1Kx8  
Address  
Latch  
A0-A12  
A0-A7  
Row  
Decoder  
CE  
A8-A9  
Column Decoder  
Control  
Logic  
WE  
OE  
DQ0-7  
I/O Latch  
Bus Driver  
Pin Name  
Pin Number  
I/O Pin Description  
A0-A12  
2-10, 21, 23-25  
I
Address. The 13 address lines select one of 8,192 bytes in the FRAM  
array. The address value will be latched on the falling edge of /CE.  
DQ0-7  
/CE  
11-13, 15-19  
20  
I/O Data. 8-bit bi-directional data bus for accessing the FRAM array.  
I
Chip Enable. /CE selects the device when low. The falling edge of /CE  
causes the address to be latched internally. Address changes that  
occur after /CE goes low will be ignored until the next falling edge  
occurs.  
/OE  
22  
27  
I
I
Output Enable. When /OE is low the FM1608 drives the data bus when  
valid data is available. Taking /OE high causes the DQ pins to be tri-  
stated.  
/WE  
Write Enable. Taking /WE low causes the FM1608 to write the contents  
of the data bus to the address location latched by the falling edge of  
/CE.  
VDD  
VSS  
28  
14  
I
I
Supply Voltage. 5V  
Ground.  
Functional Truth Table  
/CE  
H
æ
/WE  
X
X
H
L
/OE  
X
X
L
X
Function  
Standby/Precharge  
Latch Address  
Read  
L
L
Write  
28 July 2000  
2/12  
Ramtron  
FM1608  
Overview  
The FM1608 is a bytewide FRAM memory. The  
memory array is logically organized as 8,192 x 8 and is  
accessed using an industry standard parallel  
interface. The FM1608 is inherently nonvolatile via its  
unique ferroelectric process. All data written to the  
part is immediately nonvolatile with no delay.  
Functional operation of the FRAM memory is similar  
to SRAM type devices. The major operating  
difference between the FM1608 and an SRAM  
(beside nonvolatile storage) is that the FM1608  
latches the address on the falling edge of /CE.  
cycle is initiated. Once started, a complete memory  
cycle must be completed internally regardless of the  
state of /CE. Data becomes available on the bus after  
the access time has been satisfied.  
After the address has been latched, the address value  
may change upon satisfying the hold time parameter.  
Unlike an SRAM, changing address values will have  
no effect on the memory operation after the address is  
latched.  
The FM1608 will drive the data bus when /OE is  
asserted to a low state. If /OE is asserted after the  
memory access time has been satisfied, the data bus  
will be driven with valid data. If /OE is asserted prior  
to completion of the memory access, the data bus will  
not be driven until valid data is available. This feature  
minimizes supply current in the system by eliminating  
transients due to invalid data. When /OE is inactive  
the data bus will remain tri-stated.  
Memory Architecture  
Users access 8,192 memory locations each with 8 data  
bits through a parallel interface. The complete address  
of 13-bits specifies each of the 8,192 bytes uniquely.  
Internally, the memory array is organized into 8 blocks  
of 1Kb each. The 3 most-significant address lines  
decode one of 8 blocks. This block segmentation has  
no effect on operation, however the user may wish to  
group data into blocks by its endurance requirements  
as explained in a later section.  
Write Operation  
Writes occur in the FM1608 in the same time interval  
as reads. The FM1608 supports both /CE and /WE  
controlled write cycles. In all cases, the address is  
latched on the falling edge of /CE.  
The access and cycle time are the same for read and  
write memory operations. Writes occur immediately at  
the end of the access with no delay. Unlike an  
EEPROM, it is not necessary to poll the device for a  
ready condition since writes occur at bus speed. A  
pre-charge operation, where /CE goes inactive, is a  
part of every memory cycle. Thus unlike SRAM, the  
FM1608 access and cycle times are not equal.  
In a /CE controlled write, the /WE signal is asserted  
prior to beginning the memory cycle. That is, /WE is  
low when /CE falls. In this case, the part begins the  
memory cycle as a write. The FM1608 will not drive  
the data bus regardless of the state of /OE.  
Note that the FM1608 has no special power-down  
demands. It will not block user access and it contains  
no power-management circuits other than a simple  
internal power-on reset. It is the user’s responsibility  
to ensure that VDD is within data sheet tolerances to  
prevent incorrect operation.  
In a /WE controlled write, the memory cycle begins on  
the falling edge of /CE. The /WE signal falls after the  
falling edge of /CE. Therefore the memory cycle  
begins as a read. The data bus will be driven  
according to the state of /OE until /WE falls. The  
timing of both /CE and /WE controlled write cycles is  
shown in the electrical specifications.  
Memory Operation  
Write access to the array begins asynchronously  
after the memory cycle is initiated. The write access  
terminates on the rising edge of /WE or /CE,  
whichever is first. Data set-up time, as shown in the  
electrical specifications, indicates the interval during  
which data cannot change prior to the end of the write  
access.  
The FM1608 is designed to operate in a manner very  
similar to other bytewide memory products. For users  
familiar with BBSRAM, the performance is comparable  
but the bytewide interface operates in a slightly  
different manner as described below. For users  
familiar with EEPROM, the obvious differences result  
from the higher write performance of FRAM  
technology including NoDelay writes and much  
higher write endurance.  
Unlike other truly nonvolatile memory technologies,  
there is no write delay with FRAM. Since the read and  
write access times of the underlying memory are the  
same, the user experiences no delay through the bus.  
The entire memory operation occurs in a single bus  
Read Operation  
A read operation begins on the falling edge of /CE. At  
this time, the address bits are latched and a memory  
28 July 2000  
3/12  
Ramtron  
FM1608  
cycle. Therefore, any operation including read or write  
can occur immediately following a write. Data polling,  
a technique used with EEPROMs to determine if a  
write is complete, is unnecessary.  
flexibility, the FM1608 employs a unique memory  
organization as described below.  
The memory array is divided into 8 blocks, each 1Kx8.  
The 3-upper address lines decode the block selection  
as shown in Figure 2. Data targeted for significantly  
different numbers of cycles should be located in  
separate blocks since memory rows do not extend  
across block boundaries.  
Pre-charge Operation  
The pre-charge operation is an internal condition  
where the state of the memory is prepared for a new  
access. All memory cycles consist of a memory  
access and a pre-charge. The pre-charge is user  
initiated by taking the /CE signal high or inactive. It  
must remain high for at least the minimum pre-charge  
timing specification.  
Figure 2. Address Blocks  
The user dictates the beginning of this operation  
since a pre-charge will not begin until /CE rises.  
However the device has a maximum /CE low time  
specification that must be satisfied.  
Endurance and Memory Architecture  
Data retention is specified in the electrical  
specifications below. This section elaborates on the  
relationship between data retention and endurance.  
FRAM offers substantially higher write endurance  
than other nonvolatile memories. Above a certain  
level, however, the effect of increasing memory  
accesses on FRAM produces an increase in the soft  
error rate. There is a higher likelihood of data loss but  
the memory continues to function properly. This  
effect becomes significant only after 100 million (1E8)  
read/write cycles, far more than allowed by other  
nonvolatile memory technologies.  
Each block of 1Kx8 consists of 256 rows and 4  
columns. The address lines A0-A7 decode row  
selection and A8-A9 lines decode column selection.  
Endurance is a soft specification. Therefore, the user  
may operate the device with different levels of cycling  
for different portions of the memory. For example,  
critical data needing the highest reliability level could  
be stored in memory locations that receive  
comparatively few cycles. Data with frequent changes  
or shorter-term use could be located in an area  
receiving many more cycles. A scratchpad area,  
needing little if any retention can be cycled virtually  
without limit.  
This scheme facilitates  
a
relatively uniform  
distribution of cycles across the rows of a block. By  
allowing the address LSBs to decode row selection,  
the user avoids applying multiple cycles to the same  
row when accessing sequential data. For example, 256  
bytes can be accessed sequentially without accessing  
the same row twice. In this example, one cycle would  
be applied to each row. An entire block of 1Kx8 can  
be read or written with only four cycles applied to  
each row. Figure 3 illustrates the organization within a  
memory block.  
Internally, a FRAM operates with a read and restore  
mechanism similar to a DRAM. Therefore, each cycle,  
be it read or write, involves a change of state. The  
memory architecture is based on an array of rows and  
columns. Each access causes an endurance cycle for  
an entire row. Therefore, data locations targeted for  
substantially differing numbers of cycles should not  
be located within the same row. To balance the  
endurance cycles and allow the user the maximum  
28 July 2000  
4/12  
Ramtron  
FM1608  
Figure 3. Row and Column Organization  
qualified using HAST – highly accelerated stress test.  
This requires 120º C at 85% Rh, 24.4 psia at 5.5V bias.  
3. System reliability  
Data integrity must be in question when using a  
battery-backed SRAM. They are inherently  
vulnerable to shock and vibration. If the battery  
contact comes loose, data will be lost. In addition a  
negative voltage, even a momentary undershoot, on  
any pin of a battery-backed SRAM can cause data  
loss. The negative voltage causes current to be drawn  
directly from the battery. These momentary short  
circuits can greatly weaken a battery and reduce its  
capacity over time. In general, there is no way to  
monitor the lost battery capacity. Should an  
undershoot occur in a battery backed system during a  
power down, data can be lost immediately.  
Applications  
As the first truly nonvolatile RAM, the FM1608 fits  
into many diverse applications. Clearly, its monolithic  
nature and high performance make it superior to  
battery-backed SRAM in most every application. This  
applications guide is intended to facilitate the  
transition from BBSRAM to FRAM. It is divided into  
two parts. First is a treatment of the advantages of  
FRAM memory compared with battery-backed  
SRAM. Second is a design guide, which highlights  
the simple design considerations that should be  
reviewed in both retrofit and new design situations.  
4. Space  
Certain disadvantages of battery-backed, such as  
susceptibility to shock, can be reduced by using the  
old fashioned DIP module. However, this alternative  
takes up board space, add height, and dictates  
through-hole assembly. FRAM offers a true surface-  
mount solution that uses 25% of the board space.  
No multi-piece assemblies no connectors, and no  
modules.  
available!  
A real nonvolatile RAM is finally  
FRAM Advantages  
Although battery-backed SRAM is a mature and  
established solution, it has numerous weaknesses.  
These stem, directly or indirectly from the presence of  
the battery. FRAM uses an inherently nonvolatile  
storage mechanism that requires no battery. It  
therefore eliminates these weaknesses. The major  
considerations in upgrading to FRAM are as follows.  
Direct Battery Issues  
5. Field maintenance  
Batteries, no matter how mature, are a built-in  
maintenance problem. They eventually must be  
replaced. Despite long life projections, it is impossible  
to know if any individual battery will last considering  
all of the factors that can degrade them.  
Construction Issues  
1. Cost  
6. Environmental  
The cost of both the component and the  
manufacturing overhead of battery-backed SRAM is  
high. FRAM, with its monolithic construction is  
inherently a lower cost solution. In addition, there is  
no ‘built-in’ rework step required for battery  
attachment when using surface mount parts.  
Therefore assembly is streamlined and more cost  
effective. In the case of DIP battery-backed modules,  
the user is constrained to through-hole assembly  
techniques and a board wash using no water.  
Lithium batteries are widely regarded as an  
environmental problem. They are a potential fire  
hazard and proper disposal can be a burden. In  
addition, shipping of lithium batteries may be  
restricted.  
7. Style!  
Backing up an SRAM with a battery is an old-  
fashioned approach. In many cases, such modules are  
the only through-hole component in sight. FRAM is  
the latest memory technology and it is changing the  
way systems are designed.  
2. Humidity  
A typical battery-backed SRAM module is qualified at  
60º C, 90% Rh, no bias, and no pressure. This is  
because the multi-component assemblies are  
vulnerable to moisture, not to mention dirt. FRAM is  
FRAM is nonvolatile and writes fast -- no battery  
required!  
28 July 2000  
5/12  
Ramtron  
FM1608  
FRAM Design Considerations  
The main design issue is to create a decoder scheme  
that will drive /CE active, then inactive for each  
address. This accomplishes the two goals of latching  
the new address and creating the precharge period.  
When designing with FRAM for the first time, users  
of SRAM will recognize a few minor differences. First,  
bytewide FRAM memories latch each address on the  
falling edge of chip enable. This allows the address  
bus to change after starting the memory access. Since  
every access latches the memory address on the  
falling edge of /CE, users should not ground it as they  
might with SRAM.  
A second design consideration relates to the level of  
VDD during operation. Battery-backed SRAMs are  
forced to monitor VDD in order to switch to battery  
backup. They typically block user access below a  
certain VDD level in order to prevent loading the  
battery with current demand from an active SRAM.  
The user can be abruptly cut off from access to the  
nonvolatile memory in a power down situation with  
no warning or indication.  
Users that are modifying existing designs to use  
FRAM should examine the hardware address  
decoders. Decoders should be modified to qualify  
addresses with an address valid signal if they do not  
already. In many cases, this is the only change  
required. Systems that drive chip enable active, then  
inactive for each valid address may need no  
modifications. An example of the target signal  
relationships is shown in Figure 4. Also shown is a  
common SRAM signal relationship that will not work  
for the FM1608.  
FRAM memories do not need this system overhead.  
The memory will not block access at any VDD level.  
The user, however, should prevent the processor  
from accessing memory when VDD is out-of-  
tolerance. The common design practice of holding a  
processor in reset when VDD drops is adequate; no  
special provisions must be taken for FRAM design.  
Figure 4. Memory Address Relationships  
28 July 2000  
6/12  
Ramtron  
FM1608  
Electrical Specifications  
Absolute Maximum Ratings  
Description  
Ratings  
Ambient storage or operating temperature  
-40°C to + 85°C  
Voltage on any pin with respect to ground -1.0V to +7.0V  
Lead temperature (Soldering, 10 seconds) 300° C  
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a  
stress rating only, and the functional operation of the device at these or any other conditions above those listed in  
the operational section of this specification is not implied. Exposure to absolute maximum ratings conditions for  
extended periods may affect device reliability  
DC Operating Conditions TA = -40° C to + 85° C, VDD = 4.5V to 5.5V unless otherwise specified  
Symbol  
VDD  
IDD  
ISB  
ISB  
ILI  
ILO  
VIL  
VIH  
VOL  
VOH  
Parameter  
Power Supply  
Min  
4.5  
Typ  
Max  
Units  
V
Notes  
5.0  
5
5.5  
15  
400  
20  
10  
10  
1
2
3
4
5
5
1
1
VDD Supply Current - Active  
Standby Current - TTL  
Standby Current - CMOS  
Input Leakage Current  
Output Leakage Current  
Input Low Voltage  
Input High Voltage  
Output Low Voltage  
Output High Voltage  
mA  
mA  
mA  
mA  
mA  
V
V
V
V
7
-1.0  
2.0  
0.8  
VDD + 1.0  
0.4  
1,6  
1,7  
2.4V  
Notes  
1. Referenced to VSS.  
2. VDD = 5.5V, /CE cycling at minimum cycle time. All inputs at CMOS levels, all outputs unloaded.  
3. VDD = 5.5V, /CE at VIH, All inputs at TTL levels, all outputs unloaded.  
4. VDD = 5.5V, /CE at VIH, All inputs at CMOS levels, all outputs unloaded.  
5. VIN, VOUT between VDD and VSS.  
6. IOL = 4.2 mA  
7. IOH = -2.0 mA  
28 July 2000  
7/12  
Ramtron  
FM1608  
Read Cycle AC Parameters TA = -40° C to + 85° C, VDD = 4.5V to 5.5V unless otherwise specified  
Symbol  
tCE  
tCA  
tRC  
tPC  
Parameter  
Min  
Max  
120  
10,000  
Units  
ns  
ns  
ns  
ns  
Notes  
Chip Enable Access Time ( to data valid)  
Chip Enable Active Time  
Read Cycle Time  
Precharge Time  
Address Setup Time  
120  
180  
60  
0
tAS  
ns  
tAH  
tOE  
tHZ  
Address Hold Time  
10  
ns  
ns  
ns  
ns  
Output Enable Access Time  
Chip Enable to Output High-Z  
Output Enable to Output High-Z  
10  
15  
15  
1
1
tOHZ  
Write Cycle AC Parameters TA = -40° C to + 85° C, VDD = 4.5V to 5.5V unless otherwise specified  
Symbol  
tCA  
tCW  
tWC  
tPC  
Parameter  
Min  
120  
120  
180  
60  
0
10  
40  
40  
Max  
10,000  
Units  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Notes  
Chip Enable Active Time  
Chip Enable to Write High  
Write Cycle Time  
Precharge Time  
tAS  
Address Setup Time  
Address Hold Time  
Write Enable Pulse Width  
Data Setup  
tAH  
tWP  
tDS  
tDH  
tWZ  
tWX  
tHZ  
Data Hold  
0
Write Enable Low to Output High Z  
Write Enable High to Output Driven  
Chip Enable to Output High-Z  
Write Setup  
15  
15  
1
1
1
2
2
10  
tWS  
tWH  
0
0
Write Hold  
Notes  
1
2
This parameter is periodically sampled and not 100% tested.  
The relationship between /CE and /WE determines if a /CE- or /WE-controlled write occurs. There is no timing  
specification associated with this relationship.  
Power Cycle Timing TA = -40° C to + 85° C, VDD = 4.5V to 5.5V unless otherwise specified  
Symbol  
tPU  
tPD  
Parameter  
VDD Min to First Access Start  
Last Access Complete to VDD Min  
Min  
Units Notes  
ms  
ms  
1
0
Capacitance TA = 25° C , f=1.0 MHz, VDD = 5V  
Symbol  
CI/O  
CIN  
Parameter  
Input Output Capacitance  
Input Capacitance  
Max  
Units  
pF  
pF  
Notes  
8
6
28 July 2000  
8/12  
Ramtron  
FM1608  
AC Test Conditions  
Input Pulse Levels  
Input rise and fall times  
Input and output timing levels  
Equivalent AC Load Circuit  
0 to 3V  
10 nS  
1.5V  
Read Cycle Timing  
Write Cycle Timing - /CE Controlled Timing  
28 July 2000  
9/12  
Ramtron  
FM1608  
Write Cycle Timing - /WE Controlled Timing  
Power Cycle Timing  
Data Retention TA = -40° C to + 85° C, VDD = 4.5V to 5.5V unless otherwise specified  
Parameter  
Data Retention  
Min  
Units  
Years  
Notes  
10  
1
Notes  
1. Data retention is specified at 85° C. The relationship between retention, temperature, and the associated  
reliability level is characterized separately.  
28 July 2000  
10/12  
Ramtron  
FM1608  
28-pin SOP JEDEC MS -013  
Index  
Area  
E
H
Pin 1  
D
h
°
45  
A
L
.10 mm  
.004 in.  
B
e
C
A1  
Selected Dimensions  
For complete dimensions and notes, refer to JEDEC MS-013  
Controlling dimensions is in millimeters. Conversions to inches are  
not exact.  
Symbol  
A
Dim  
mm  
in.  
mm  
in.  
mm  
in.  
mm  
in.  
mm  
in.  
mm  
in.  
mm  
in.  
Min  
2.35  
0.0926  
0.10  
0.004  
0.33  
0.013  
0.23  
0.0091  
17.70  
0.6969  
7.40  
Nom.  
Max  
2.65  
0.1043  
0.30  
0.0118  
0.51  
0.020  
0.32  
0.0125  
18.10  
0.7125  
7.60  
A1  
B
C
D
E
e
0.2914  
0.2992  
1.27 BSC  
0.050 BSC  
H
h
mm  
in.  
mm  
in.  
mm  
in.  
10.00  
0.394  
0.25  
0.010  
.40  
10.65  
0.419  
0.75  
0.029  
1.27  
0.050  
8°  
L
a
0.016  
0°  
28 July 2000  
11/12  
Ramtron  
FM1608  
28-pin DIP JEDEC MS -011  
E1  
Index  
Area  
E
D
A2  
A
A1  
e
b
eA  
eB  
B1  
D1  
Selected Dimensions  
For complete dimensions and notes, refer to JEDEC MS-011  
Controlling dimensions is in inches. Conversions to millimeters are  
not exact.  
Symbol  
A
Dim  
in.  
Min  
Nom.  
Max  
0.250  
mm  
in.  
mm  
in.  
mm  
in.  
mm  
in.  
mm  
in.  
mm  
in.  
mm  
in.  
mm  
in.  
mm  
in.  
mm  
in.  
mm  
in.  
mm  
in.  
6.35  
A1  
A2  
B
0.015  
0.39  
0.125  
3.18  
0.014  
0.356  
0.030  
0.77  
1.380  
35.1  
0.005  
0.13  
0.195  
4.95  
0.022  
0.558  
0.070  
1.77  
B1  
D
1.565  
39.7  
D1  
E
0.600  
15.24  
0.485  
12.32  
0.625  
15.87  
0.580  
14.73  
E1  
e
0.100 BSC  
2.54 BSC  
0.600 BSC  
15.24 BSC  
eA  
eB  
L
0.700  
17.78  
0.200  
5.08  
0.115  
2.93  
mm  
28 July 2000  
12/12