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HS-26CT32RH  
Data Sheet  
October 1999  
File Number 2930.3  
Radiation Hardened Quad Differential Line  
Receiver  
Features  
• Electrically Screened to SMD # 5962-95631  
The Intersil HS-26CT32RH is a differential line receiver  
designed for digital data transmission over balanced lines  
and meets the requirements of EIA standard RS-422.  
Radiation hardened CMOS processing assures low power  
consumption, high speed, and reliable operation in the most  
severe radiation environments.  
• QML Qualified per MIL-PRF-38535 Requirements  
• 1.2 Micron Radiation Hardened CMOS  
- Total Dose . . . . . . . . . . . . . . . . . . . Up to 300kRAD(Si)  
• Latchup Free  
• EIA RS-422 Compatible Outputs  
• TTL Compatible Inputs  
The HS-26CT32RH has an input sensitivity typically of  
200mV over the common mode input voltage range of 7V.  
The receivers are also equipped with input fail safe circuitry,  
which causes the outputs to go to a logic “1” when the inputs  
are open. Enable and Disable functions are common to all  
four receivers.  
• Input Fail Safe Circuitry  
• High Impedance Inputs when Disabled or Powered Down  
• Low Power Dissipation Standby (Max). . . . . . . . . .138mW  
• Single 5V Supply  
Specifications for Rad Hard QML devices are controlled  
by the Defense Supply Center in Columbus (DSCC). The  
SMD numbers listed here must be used when ordering.  
o
o
• Full Military Temperature Range . . . . . . . -55 C to 125 C  
Pinouts  
Detailed Electrical Specifications for these devices are  
contained in SMD 5962-95631. A “hot-link” is provided  
on our homepage for downloading.  
HS1-26CT32RH (SBDIP) CDIP2-T16  
TOP VIEW  
http://www.intersil.com/spacedefense/space.htm  
AIN  
AIN  
1
2
3
4
5
6
7
8
16 VDD  
15 BIN  
Logic Diagram  
AOUT  
ENABLE  
COUT  
CIN  
14 BIN  
ENABLE ENABLE DIN DIN  
CIN CIN  
BIN BIN  
AIN AIN  
13 BOUT  
12 ENABLE  
11 DOUT  
10 DIN  
+
-
+
-
+
-
+
-
CIN  
9
DIN  
GND  
DOUT  
COUT  
BOUT  
AOUT  
HS9-26CT32RH (FLATPACK) CDFP4-F16  
TOP VIEW  
Ordering Information  
AIN  
AIN  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
VDD  
INTERNAL  
TEMP.  
o
BIN  
ORDERING NUMBER  
5962F9563101QEC  
5962F9563101QXC  
5962F9563101V9A  
5962F9563101VEC  
5962F9563101VXC  
MKT. NUMBER  
HS1-26CT32RH-8  
HS9-26CT32RH-8  
HS0-26CT32RH-Q  
HS1-26CT32RH-Q  
HS9-26CT32RH-Q  
RANGE ( C)  
-55 to 125  
-55 to 125  
25  
AOUT  
ENABLE  
COUT  
CIN  
BIN  
BOUT  
ENABLE  
DOUT  
DIN  
CIN  
-55 to 125  
-55 to 125  
GND  
DIN  
HS1-26CT32RH/PROTO HS1-26CT32RH/PROTO -55 to 125  
HS9-26CT32RH/PROTO HS9-26CT32RH/PROTO -55 to 125  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999  
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HS-26CT32RH  
Die Characteristics  
DIE DIMENSIONS:  
Backside Finish:  
84 mils x 130 mils  
Silicon  
(2140µm x 3290µm)  
ASSEMBLY RELATED INFORMATION:  
Substrate Potential:  
INTERFACE MATERIALS:  
Glassivation:  
V
(When Powered Up)  
DD  
Type: PSG (Phosphorus Silicon Glass)  
Thickness: 10kÅ 1kÅ  
ADDITIONAL INFORMATION:  
Worst Case Current Density:  
Top Metallization:  
5
2
<2.0 x 10 A/cm  
M1: Mo/Tiw  
Thickness: 5800Å  
M2: Al/Si/Cu  
Thickness: 10kÅ 1kÅ  
Transistor Count:  
240  
Bond Pad Size:  
Substrate:  
110µm x 100µm  
AVLSI1RA  
Metallization Mask Layout  
HS-26CT32RH  
AIN  
(1)  
V
(16)  
BIN  
(15)  
DD  
(14) BIN  
AIN (2)  
(13) BOUT  
(12) ENAB  
AOUT (3)  
ENAB (4)  
(11) DOUT  
(10) DIN  
COUT (5)  
CIN (6)  
(7)  
(8)  
(9)  
CIN  
GND  
DIN  
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.  
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-  
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com  
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