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Leaded Oscillator, VCXO, TTL / HC-MOS  
Metal Package, Full Size DIP and Half DIP  
I202 / I203 Series  
I203 Package  
20.7  
4
3
Product Features:  
Applications:  
Server & Storage  
Sonet /SDH  
802.11 / Wifi  
T1/E1, T3/E3  
12.6  
CMOS/TTL Compatible Logic Levels  
Compatible with Leadfree Processing  
RoHS Compliant  
1
2
7.62  
15.24  
5.1 Max.  
6 Min.  
0.048  
Frequency  
1 MHz to 170.000 MHz  
Output Level  
HC-MOS  
TTL  
‘0’ = 0.1 Vcc Max., ‘1’ = 0.9 Vcc Min.  
‘0’ = 0.4 VDC Max., ‘1’ = 2.4 VDC Min.  
0.36  
I202 Package  
12.6  
Duty Cycle  
50% 5%  
4
3
Rise / Fall Time  
10 nS Max.*  
12.6  
Output Load  
HC-MOS  
TTL  
Fo < 50 MHz = 10 TTL, Fo > 50 MHz = 5 LSTTL  
15 pF  
1
2
7.62  
Frequency Stability  
Supply Voltage  
Current  
See Frequency Stability Table  
See Input Voltage Table, tolerance 10 %  
50 mA Max.*  
7.62  
5.1 Max.  
6 Min.  
Control Voltage  
1.65 VDC 1.5 VDC for Vcc = 3.3 VDC, 2.5 VDC 2.0 VDC for VCC  
= 5.0 VDC  
0.48  
Slope  
Positive  
0.36  
Dimension Units: mm  
Pin Connection  
Operating  
Storage  
See Operating Temperature Table in Part Number Guide  
1
2
3
4
Control Voltage  
GND  
Output  
-55q C to +125q C  
Vcc  
Part Number Guide  
Operating  
Sample Part Number: I202-1BC3-27.000 MHz  
Package  
Frequency  
Stability  
Pullability  
Supply Voltage  
Frequency  
Temperature  
5 = 5.0 VDC  
3 = 3.3 VDC  
1 = 0q C to +70q C  
F = r20 ppm  
X = r30 ppm  
B = r50 ppm min.  
C = r100 ppm min.  
K = r150 ppm min.  
L = r200 ppm min.  
I202 -  
I203 -  
3 = -20q C to +70q C  
- 27.000 MHz  
4 = -30q C to +75q C  
2 = -40q C to +85q C  
B = r50 ppm  
C = r100 ppm  
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise.  
* Frequency, supply, and load related parameters.  
e-mail@ilsiamerica.com • www.ilsiamerica.com  
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail:
Specifications subject to change without notice  
12/09_A  
Page 1  
Leaded Oscillator, VCXO, TTL / HC-MOS  
Metal Package, Full Size DIP and Half DIP  
I202 / I203 Series  
Pb Free Solder Reflow Profile:  
Typical Application:  
*Units are backward compatible with 240C reflow processes  
Package Information:  
MSL = N.A. (package does not contain plastic, storage life is  
unlimited under normal room conditions).  
Termination = e4- (Sn / Cu / Ag over Ni over Kovar base metal).  
Environmental Specifications  
Thermal Shock  
MIL-STD-883, Method 1011, Condition A  
Moisture Resistance  
Mechanical Shock  
Mechanical Vibration  
Resistance to Soldering Heat  
Hazardous Substance  
Solderability  
MIL-STD-883, Method 1004  
MIL-STD-883, Method 2002, Condition B  
MIL-STD-883, Method 2007, Condition A  
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)  
Pb-Free / RoHS / Green Compliant  
JESD22-B102-D Method 2 (Preconditioning E)  
MIL-STD-883, Method 2004, Test Condition D  
MIL-STD-883, Method 1014, Condition C  
Terminal Strength  
Gross Leak  
Fine Leak  
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s  
MIL-STD-202, Method 215  
Solvent Resistance  
Marking  
Line 1: ILSI and Date Code  
Line 2: XXXX (Part Number detail = I203-XXXX-Freq.)  
Line 3: Frequency  
e-mail@ilsiamerica.com • www.ilsiamerica.com  
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail:
Specifications subject to change without notice  
12/09_A  
Page 2