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To all our customers  
Regarding the change of names mentioned in the document, such as Hitachi  
Electric and Hitachi XX, to Renesas Technology Corp.  
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas  
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog  
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)  
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand  
names are mentioned in the document, these names have in fact all been changed to Renesas  
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and  
corporate statement, no changes whatsoever have been made to the contents of the document, and  
these changes do not constitute any alteration to the contents of the document itself.  
Renesas Technology Home Page: http://www.renesas.com  
Renesas Technology Corp.  
Customer Support Dept.  
April 1, 2003  
Cautions  
Keep safety first in your circuit designs!  
1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better  
and more reliable, but there is always the possibility that trouble may occur with them. Trouble with  
semiconductors may lead to personal injury, fire or property damage.  
Remember to give due consideration to safety when making your circuit designs, with appropriate  
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or  
(iii) prevention against any malfunction or mishap.  
Notes regarding these materials  
1. These materials are intended as a reference to assist our customers in the selection of the Renesas  
Technology Corporation product best suited to the customer's application; they do not convey any  
license under any intellectual property rights, or any other rights, belonging to Renesas Technology  
Corporation or a third party.  
2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any  
third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or  
circuit application examples contained in these materials.  
3. All information contained in these materials, including product data, diagrams, charts, programs and  
algorithms represents information on products at the time of publication of these materials, and are  
subject to change by Renesas Technology Corporation without notice due to product improvements or  
other reasons. It is therefore recommended that customers contact Renesas Technology Corporation  
or an authorized Renesas Technology Corporation product distributor for the latest product information  
before purchasing a product listed herein.  
The information described here may contain technical inaccuracies or typographical errors.  
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss  
rising from these inaccuracies or errors.  
Please also pay attention to information published by Renesas Technology Corporation by various  
means, including the Renesas Technology Corporation Semiconductor home page  
(http://www.renesas.com).  
4. When using any or all of the information contained in these materials, including product data, diagrams,  
charts, programs, and algorithms, please be sure to evaluate all information as a total system before  
making a final decision on the applicability of the information and products. Renesas Technology  
Corporation assumes no responsibility for any damage, liability or other loss resulting from the  
information contained herein.  
5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device  
or system that is used under circumstances in which human life is potentially at stake. Please contact  
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor  
when considering the use of a product contained herein for any specific purposes, such as apparatus or  
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.  
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whole or in part these materials.  
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than the approved destination.  
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the  
country of destination is prohibited.  
8. Please contact Renesas Technology Corporation for further details on these materials or the products  
contained therein.  
2SA673, 2SA673A  
Silicon PNP Epitaxial  
ADE-208-125 (Z)  
1st. Edition  
Mar. 2001  
Application  
Low frequency amplifier  
Complementary pair with 2SC1213 and 2SC1213A  
Outline  
TO-92 (1)  
1. Emitter  
2. Collector  
3. Base  
3
2
1
2SA673, 2SA673A  
Absolute Maximum Ratings (Ta = 25°C)  
Item  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
2SA673  
–35  
2SA673A  
–50  
Unit  
V
Collector to base voltage  
Collector to emitter voltage  
Emitter to base voltage  
Collector current  
–35  
–50  
V
–4  
–4  
V
–500  
400  
–500  
mA  
mW  
°C  
°C  
Collector power dissipation  
Junction temperature  
Storage temperature  
PC  
400  
Tj  
150  
150  
Tstg  
–55 to +150  
–55 to +150  
Electrical Characteristics (Ta = 25°C)  
2SA673  
2SA673A  
Item  
Symbol Min Typ Max Min Typ Max Unit Test conditions  
Collector to base  
breakdown voltage  
V(BR)CBO  
V(BR)CEO  
V(BR)EBO  
–35  
–35  
–4  
–50  
–50  
–4  
V
V
V
IC = –10 µA, IE = 0  
IC = –1 mA, RBE = ∞  
IE = –10 µA, IC = 0  
VCB = –20 V, IE = 0  
Collector to emitter  
breakdown voltage  
Emitter to base  
breakdown voltage  
Collector cutoff current ICBO  
–0.5  
–0.5 µA  
Collector to emitter  
saturation voltage  
VCE(sat)  
–0.2 –0.6  
–0.2 –0.6  
V
IC = –150 mA,  
IB = –15 mA*2  
DC current trnsfer ratio hFE*1  
DC current trnsfer ratio hFE  
Base to emitter voltage VBE  
60  
10  
320  
60  
10  
320  
VCE = –3 V,  
IC = –10 mA  
VCE = –3 V,  
IC = –500 mA*2  
–0.64 —  
–0.64 —  
V
VCE = –3 V,  
IC =–10 mA  
Notes: 1. The 2SA673 and 2SA673A are grouped by hFE as follows.  
2. Pulse test  
B
C
D
60 to 120  
100 to 200 160 to 320  
2
2SA673, 2SA673A  
Typical Output Characteristics (1)  
Maximum Collector Dissipation Curve  
–100  
–80  
–60  
–40  
–20  
600  
400  
200  
–0.2  
–0.1 mA  
IB = 0  
0
–2  
–4  
–6  
–8  
–10  
0
50  
100  
150  
Collector to Emitter Voltage VCE (V)  
Ambient Temperature Ta (°C)  
Typical Output Characteristics (2)  
Typical Transfer Characteristics  
–500  
–400  
–300  
–200  
–100  
–30  
–10  
VCE = –3 V  
–7  
–6  
–5  
–4  
–3  
–3  
–2  
–1 mA  
–1.0  
P
C = 400 mW  
IB = 0  
–4  
Collector to Emitter Voltage VCE (V)  
–0.3  
0
–2  
–6  
–8  
–10  
0
–0.2 –0.4 –0.6 –0.8 –1.0  
Base to Emitter Voltage VBE (V)  
3
2SA673, 2SA673A  
DC Current Transfer Ratio vs.  
Collector Current  
Gain Bandwidth Product vs.  
Collector Current  
150  
100  
50  
240  
200  
160  
120  
80  
VCE = –3 V  
VCE = –3 V  
40  
0
0
–5 –10 –20  
–50 –100 –200 –500  
–2  
–5 –10 –20  
–50 –100 –200 –500  
Collector Current IC (mA)  
Collector Current IC (mA)  
4
2SA673, 2SA673A  
Package Dimensions  
As of January, 2001  
Unit: mm  
4.8 ± 0.4  
3.8 ± 0.4  
0.60 Max  
0.55Max  
0.5Max  
1.27  
2.54  
Hitachi Code  
JEDEC  
EIAJ  
TO-92 (1)  
Conforms  
Conforms  
0.25 g  
Mass (reference value)  
5
2SA673, 2SA673A  
Cautions  
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,  
copyright, trademark, or other intellectual property rights for information contained in this document.  
Hitachi bears no responsibility for problems that may arise with third party’s rights, including  
intellectual property rights, in connection with use of the information contained in this document.  
2. Products and product specifications may be subject to change without notice. Confirm that you have  
received the latest product standards or specifications before final design, purchase or use.  
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,  
contact Hitachi’s sales office before using the product in an application that demands especially high  
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk  
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,  
traffic, safety equipment or medical equipment for life support.  
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly  
for maximum rating, operating supply voltage range, heat radiation characteristics, installation  
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used  
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable  
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-  
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other  
consequential damage due to operation of the Hitachi product.  
5. This product is not designed to be radiation resistant.  
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without  
written approval from Hitachi.  
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor  
products.  
Hitachi, Ltd.  
Semiconductor & Integrated Circuits.  
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109  
URL  
NorthAmerica  
Europe  
Asia  
: http://semiconductor.hitachi.com/  
: http://www.hitachi-eu.com/hel/ecg  
: http://sicapac.hitachi-asia.com  
Japan  
: http://www.hitachi.co.jp/Sicd/indx.htm  
For further information write to:  
Hitachi Semiconductor  
(America) Inc.  
179 East Tasman Drive, Dornacher Straβe 3  
Hitachi Europe GmbH  
Electronic Components Group  
Hitachi Asia Ltd.  
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Singapore 049318  
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San Jose,CA 95134  
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Fax : <852>-(2)-730-0281  
URL : http://www.hitachi.com.hk  
Hitachi Europe Ltd.  
Electronic Components Group.  
Whitebrook Park  
Lower Cookham Road  
Maidenhead  
Hitachi Asia Ltd.  
(Taipei Branch Office)  
4/F, No. 167, Tun Hwa North Road,  
Hung-Kuo Building,  
Taipei (105), Taiwan  
Berkshire SL6 8YA, United Kingdom  
Tel: <44> (1628) 585000  
Fax: <44> (1628) 585160  
Tel : <886>-(2)-2718-3666  
Fax : <886>-(2)-2718-8180  
Telex : 23222 HAS-TP  
URL : http://www.hitachi.com.tw  
Copyright Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.  
Colophon 2.0  
6