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HS-26CT31RH  
Data Sheet  
August 1999  
File Number 2929.2  
Radiation Hardened Quad Differential Line  
Driver  
Features  
• Electronically Screened to SMD #5962-95632  
• QML Qualified Per MIL-PRF-38535 Requirements  
• 1.2 Micron Radiation Hardened CMOS  
Total Dose Up to 300kRAD(Si)  
The Intersil HS-26CT31RH is a quad differential line driver  
designed for digital data transmission over balanced lines  
and meets the requirements of EIA standard RS-422.  
Radiation hardened CMOS processing assures low power  
consumption, high speed, and reliable operation in the most  
severe radiation environments.  
• Latchup Free  
• EIA RS-422 Compatible Outputs (Except for IOS)  
• TTL Compatible Inputs  
The HS-26CT31RH accepts TTL signal levels and converts  
them to RS-422 compatible outputs. This circuit uses special  
outputs that enable the drivers to power down without  
loading down the bus. Enable and disable pins allow several  
devices to be connected to the same data source and  
addressed independently.  
• High Impedance Outputs when Disabled or Powered  
Down  
• Low Power Dissipation 2.75mW Standby (Max)  
• Single 5V Supply  
Specifications for Rad Hard QML devices are controlled  
by the Defense Supply Center in Columbus (DSCC). The  
SMD numbers listed here must be used when ordering.  
• Low Output Impedance 10or Less  
o
o
• Full -55 C to +125 C Military Temperature Range  
Detailed Electrical Specifications for these devices are  
contained in SMD 5962-95632. A “hot-link” is provided  
on our homepage for downloading.  
Pinouts  
HS1-26CT31RH (SBDIP) CD1P2-T16  
TOP VIEW  
http://www.intersil.com/spacedefense/space.htm  
Logic Diagram  
AIN  
AO  
1
2
3
4
5
6
7
8
16 VDD  
15 DIN  
14 DO  
ENABLE ENABLE DIN  
CIN  
BIN  
AIN  
AO  
ENABLE  
BO  
13 DO  
12 ENABLE  
11 CO  
BO  
10 CO  
BIN  
9
CIN  
GND  
DO DO  
CO CO  
BO BO  
AO AO  
Ordering Information  
TEMP.  
HS9-26CT31RH (FLATPACK) CDFP4-F16  
INTERNAL  
RANGE  
TOP VIEW  
o
ORDERING NUMBER  
5962F9563201QEC  
5962F9563201QXC  
5962F9563201V9A  
5962F9563201VEC  
5962F9563201VXC  
MKT. NUMBER  
HS1-26CT31RH-8  
HS9-26CT31RH-8  
HS0-26CT31RH-Q  
HS1-26CT31RH-Q  
HS9-26CT31RH-Q  
( C)  
-55 to 125  
-55 to 125  
25  
AIN  
AO  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
VDD  
DIN  
AO  
DO  
ENABLE  
BO  
DO  
-55 to 125  
-55 to 125  
ENABLE  
CO  
BO  
BIN  
CO  
HS1-26CT31RH/PROTO HS1-26CT31RH/PROTO -55 to 125  
HS9-26CT31RH/PROTO HS9-26CT31RH/PROTO -55 to 125  
GND  
CIN  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999  
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HS-26CT31RH  
Die Characteristics  
DIE DIMENSIONS:  
Substrate:  
96.5 mils x 195 mils x 21 mils  
(2450 x 4950)  
AVLSI1RA  
Backside Finish:  
Silicon  
INTERFACE MATERIALS:  
Glassivation:  
ASSEMBLY RELATED INFORMATION:  
Substrate Potential (Powered Up):  
Type: PSG (Phosphorus Silicon Glass)  
Thickness: 10kÅ ±1kÅ  
V
DD  
Metallization:  
ADDITIONAL INFORMATION:  
Worst Case Current Density:  
M1: Mo/TiW  
Thickness: 5800Å  
M2: Al/Si/Cu (Top)  
Thickness: 10kÅ ±1kÅ  
5
2
<2.0 x 10 A/cm  
Bond Pad Size:  
110µm x 100µm  
Metallization Mask Layout  
HS26CT31RH  
AO (2)  
(14) DO  
AO (3)  
(13) DO  
ENABLE (4)  
(12) ENABLE  
(11) CO  
BO (5)  
BO (6)  
(10) CO  
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.  
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-  
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com  
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