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APDS-9800  
Integrated Ambient Light and Proximity Sensor  
Data Sheet  
Description  
Features  
The APDS-9800 integrates ambient light sensor (ALS), ꢀ Integrated module with ambient light sensor, proximity  
proximity sensor (PS) and ambient light cancelation  
functions in a single module. The module contains three  
chips in one small package: an ambient light sensor  
IC, a proximity sensor signal conditioning circuit and a  
sensor and signal conditioning IC  
ꢀ Small form factor: L 4.95 x W 3.0 x H 1.45 mm  
ꢀ Supply voltage range: 2.4 V to 3.6 V  
proximity sensor that includes both an LED emitter and ꢀ Spectral responsivity closely matches the human eye  
detector.  
ꢀ Built-in LED and detector for proximity detection  
The ambient light sensor has a spectral response close to  
the CIE standard photopic observer and a current output.  
ꢀ Low sensitivity variation across various light sources  
ꢀ Linear output across a wide illumination range  
ꢀ Operates under strong sunlight and artificial light  
The proximity sensor signal conditioning circuit has an  
LED driver and a receiver circuit that has both analog and  
digital outputs. With the built-in LED, the proximity sensor  
is able to sense the proximity of an object, such as a finger,  
ꢀ Controlled LED driving current, pulse and burst  
parameters  
hand or head that is close to a portable device. The PS also ꢀ Controlled output voltage and integration time with  
features an excellent ambient light cancellation circuit for  
operation in direct sunlight.  
an external resistor and capacitor  
ꢀ LED stuck High protection  
By detecting the ambient light illuminance level, the  
ambient light sensor can control the brightness of display  
backlights.  
ꢀ Both analog and digital outputs available  
ꢀ Shutdown mode for low current consumption  
ꢀ Lead-free and RoHS compliant  
The proximity sensor makes many interesting and useful  
applications possible. For example, a proximity sensor  
can detect the proximity of a mobile phone user’s head  
and turn off or on the phone keypad and LCD backlight.  
Applications  
ꢀ PDAs  
ꢀ Mobile phones  
By combining an ambient light sensor and proximity  
sensor in a single compact module, mobile phones, PDAs  
and notebooks can have additional features or benefit  
from increased performance, such as in battery life.  
ꢀ Portable and handheld devices  
ꢀ Personal computers, netbooks and notebooks  
ꢀ Amusement products  
ꢀ Games  
ꢀ Vending Machines  
Functional Block Diagram  
(4) Vcc  
(10) LEDK  
(1) NC  
LED  
Ambient Light  
Sensor  
(7) ALS_IOUT  
(2) LEDON  
LED Driver with  
Stuck High Protection  
(5) NC  
Sunlight  
Cancellation  
TIA  
PIN  
(6) PS_PFILT  
(9) PS_ENB  
V-I Converter  
(3) PS_DOUT  
Hysteresis  
Comparator  
Proximity Sensor ASIC  
(8) GND  
I/O Pins Configuration Table  
Pin  
1
Symbol  
NC  
Type  
Description  
–
No Connection  
2
LEDON  
Digital I/P  
LED Driver Input  
LEDA will turn off when LEDON is stuck in high state for > Max-PW  
3
PS_DOUT  
Digital O/P  
PS Digital Output  
(Open drain output that requires a pull-up resistor of recommended value 10kꢁ)  
PS_DOUT = LOW when PS_VPFILT > VTH  
PS_DOUT = HIGH when PS_VPFILT < VTH  
4
5
6
Vcc  
Supply  
–
Voltage Supply  
No Connection  
NC  
PS_PFILT  
Analog O/P  
PS Analog Output  
Connect to integration circuit (R3 and C3)  
7
ALS_IOUT  
Analog O/P  
ALS analog current output  
Connect to external load resistor R4. Recommended value 1kꢁ.  
8
9
GND  
Ground  
Ground  
PS_ENB  
Digital I/P  
PS Power Down Enable  
ENB = 0 Normal mode operation, ENB = 1 Shut down mode  
10  
LEDK  
Analog O/P  
Connect to Cathode of LED (proximity sensor)  
External current limiting resistor is used to control current flow in the LED  
2
Ordering Information  
Part Number  
Packaging  
Quantity  
APDS-9800-021  
Tape & Reel  
2500 per reel  
Absolute Maximum Ratings  
Parameter  
Supply Voltage  
Input Logic Voltage  
Reflow Soldering Temperature  
Symbol  
VCC  
VI  
Min.  
0
0
Max.  
4
4
Units  
V
V
Conditions  
TA = 25°C  
TA = 25°C  
260  
°C  
Recommended Operating Conditions  
Parameter  
Symbol  
TA  
TS  
Min.  
-40  
-40  
2.4  
Max.  
85  
85  
Units  
°C  
°C  
Conditions  
Operating Temperature  
Storage Temperature  
Supply Voltage  
VCC  
3.6  
V
3
Electrical & Optical Specifications (Ta=25°C)  
Parameters  
Symbol  
Minimum Typical  
Maximum Units  
Conditions  
ALS+PS Module  
Shutdown Current  
Idle Current  
ISD  
Icc  
–
325  
0.3  
500  
1
675  
ꢂA  
ꢂA  
Vcc = 3 V, PS_ENB = 3 V, Lux = 0  
Vcc = 3 V, PS_ENB = 0 V, Lux = 0  
ALS Output  
Photo Current  
Dark Current  
Light Current Ratio  
Rise Time  
Fall Time  
Propagation delay  
Saturation voltage  
I_PH1  
I_DARK  
15  
–
–
–
–
26  
300  
1.2  
5
5
5
–
–
–
–
–
–
–
ꢂA  
nA  
–
ms  
ms  
ms  
V
Vcc =3 V, Lux = 100 (1)  
Vcc = 3 V, Lux = 0  
Incandescent / Fluorescent  
R4 = 1k ꢁ, Lux = 100  
R4 = 1k ꢁ, Lux = 100  
Tr  
Tf  
Td  
Vsat  
–
1.0  
R4 = 1k ꢁ, Lux = 100  
R4 = 150k ꢁ, Vcc = 3 V, Lux = 100  
–
PS Input  
Logic High Voltage, LEDON  
Logic High Voltage, PS_ENB  
Logic Low Voltage, LEDON  
Logic Low Voltage, PS_ENB  
Logic High Input Current, LEDON  
Logic High Input Current, PS_ENB  
Logic Low Input Current, LEDON  
Logic Low Input Current, PS_ENB  
VIH  
VIH  
VIL  
VIL  
IIH  
IIH  
IIL  
1.8  
1.8  
0
0
–
–
–
–
–
–
–
–
0.1  
0.1  
0.1  
0.1  
–
–
0.3  
0.3  
1
1
1
1
V
V
V
V
ꢂA  
ꢂA  
ꢂA  
ꢂA  
VI ≥ VIH  
VI ≥ VIH  
VI ≤ VIL  
VI ≤ VIL  
IIL  
PS Output  
Analog Output  
Digital Output Low Level, PS_DOUT VOL  
VPFILT  
0.65  
0
1.9  
–
3.0  
0.4  
V
V
VCC = 3 V, ENB = 0 V,  
LEDON = 10k Hz, 50% DC,  
50 pulses; R3 = 1M ohm,  
C3 = 3.3 nF;  
Kodak 18% Grey card at  
detectable distance = 20 mm  
from the APDS-9800.  
Crosstalk  
VPFILT  
@
Crosstalk  
0
–
0.2  
V
VCC = 3 V, ENB = 0 V,  
LEDON = 10k Hz, 50% DC,  
50 pulses; R3 = 1M ohm,  
C3 = 3.3 nF;  
No blocking object  
Vcc = 3 V, PS_ENB = 0 V  
Vcc = 3 V, R1 = 10ꢃꢁ  
Max ILED Pulse Width  
Max-PW  
ILED  
–
–
120  
120  
–
–
ꢂs  
mA  
ILED Pulse Current  
Transmitter  
Rise Time (LEDA)  
Fall Time (LEDA)  
TR  
TF  
–
–
40  
40  
–
–
ns  
ns  
Vcc = 3 V , ILED = 120 mA,  
Freq = 10k Hz  
PS Receiver  
Rise Time(PS_DOUT)  
Fall Time(PS_DOUT)  
TR  
TF  
–
–
1
1
–
–
ꢂs  
ꢂs  
Vcc = 3 V, R2 = 10k ꢁ,  
Frequency = 10k Hz  
PS Hysteresis Comparator  
Hysteresis  
Threshold Voltage  
VHYS  
VTH  
–
–
40  
655  
–
–
mV  
mV  
Vcc= 3 V  
Vcc= 3 V  
PS Sunlight Cancellation  
Sun Light Illuminance  
Isun  
100K  
Lux  
Vcc= 3 V  
Note:  
1. White LED is used as light source.  
4
Typical Application Circuit  
R1  
(10) LEDK  
(4) Vcc  
C1  
C2  
(1) NC  
LED  
(7) ALS_IOUT  
Ambient  
Light  
ADC  
Sensor  
R4  
C4  
LED Driver with  
Stuck High  
(2) LEDON  
(5) NC  
PWM/GPIO  
MCU  
Protection  
Sunlight  
Cancellation  
TIA  
PIN  
Vdd  
(6) PS_PFILT  
R2  
C3  
R3  
V-I Converter  
(3) PS_DOUT  
GPIO  
GPIO  
Hysteresis  
(9) PS_ENB  
Comparator  
Proximity Sensor ASIC  
ADC  
(8) GND  
Component  
Recommended Values  
10 ꢁ  
R1  
R2  
R3  
R4  
C1  
C2  
C3  
C4  
10k ꢁ  
1M ꢁ  
1k ꢁ  
100 nF  
6.8 uF  
3.3 nF  
10 uF  
Note: Do NOT make connects to the NC pins.  
5
Ambient Light Sensor Performance Chart  
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
300  
250  
200  
150  
100  
50  
APDS-9800  
Eye Response  
0
300 400 500 600 700 800 900 1000 1100  
WAVELENGTH (nm)  
0
100 200 300 400 500 600 700 800 900 1000 1100 1200  
LIGHT INTENSITY (LUX)  
Figure 1. Normalized Sensor Spectral Response  
Figure 2. ALS Average Iout versus Lux (Vcc = 3.0V, T=25°C, White LED source)  
Vcc  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
ENB  
Burst Pulses  
>50ns  
LEDON  
>20us  
VTH  
PFILT  
DOUT  
-40  
-20  
0
20  
40  
60  
80  
100  
TEMPERATURE (°C)  
Figure 3. ALS Dark Current versus Temperature (Vcc = 3.0V)  
Figure 4. Proximity Sensor Typical Timing Waveforms  
Proximity Sensor Performance Charts  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
Vcc=2.4V  
Vcc=2.7V  
Vcc=3V  
Vcc=3.3V  
Vcc=3.6V  
1.20  
1.10  
1.00  
0.90  
0.80  
0.70  
2
3
4
5
6
7
8
9
10  
-60 -40 -20  
0
20  
40  
60  
80  
100  
RLED (OHM)  
TEMPERATURE (°C)  
Figure 5. ILED versus RLED (TA=25°C)  
Figure 6. Normalized Idle Icc versus Temperature (Vcc =3V)  
6
APDS-9800 Package Outline  
TOPVIEW  
SIDE VIEW  
1.45 0.10  
4.95 + 0.20  
ALS  
ꢀ
Photo Detector  
0
0.43  
0.07  
0.56  
0.73  
1.19  
1.80  
0.70  
9
LED  
0.38  
10  
0.70  
8
0.70  
7
0.38  
6
Notes:  
1. All dimensions are in millimeters.  
2. Standard tolerance, unless otherwise stated:  
0.15  
0.15  
Dimension  
Decimal  
Standard  
Tolerance  
XX  
XX.X  
0.5 mm  
0.2 mm  
0.1 mm  
0.1 mm  
XX.XX  
1
2
3
4
5
All others  
0.38  
0.38  
0.38  
0.38  
BOTTOMVIEW  
APDS-9800 Pin Configuration  
Recommended Land Pattern  
1
2
3
4
5
0.50  
0.50  
0.90  
0.90  
0.90  
Pin 1 : NC  
Pin 2 : LEDON  
Pin 3 : PS_DOUT  
Pin 4 : VCCPin 5: NC  
Pin 6 : PS_PFILT  
Pin 7 : ALS_IOUT  
Pin 8 : GND  
Pin 9 : PS_ENB  
Pin 10 : LEDKTOP  
0.18  
0.18  
10  
9
8
7
6
0.18  
0.18  
Notes:  
1. All dimensions are in millimeters.  
2. Do NOT connect NC pins.  
7
APDS-9800 Tape & Reel Dimensions  
Tape Dimensions  
2.00 0.05  
8.00 0.10  
4.00 0.10  
Ø 1.50 0.10  
1.75 0.10  
+0.30  
-0.10  
8.00  
3.50 0.05  
Ø 1.00 0.05  
User Direction of Feed  
0.25 0.02  
8° MAX  
6° MAX  
1.68 0.10  
3.23 0.10  
5.19 0.10  
A.  
K.  
B.  
Reel Dimensions:  
W
N
330.0 1.5  
100.0 1.5  
T1  
E
8.5 0.2/-0.1  
2.0 0.5  
T2  
C
13.5 0.2  
13.0 0.5/-0.2  
Unit: millimeter  
8
Moisture Proof Packaging  
All APDS-9800 options are shipped in a moisture proof package. Once opened, moisture absorption begins. This part is  
compliant to JEDEC Level 3.  
Units in a sealed  
moisture-proof  
package  
Package Is  
opened (Unsealed)  
Environment  
less than 30 °C and less  
than 60% RH ?  
Yes  
Package Is  
Yes  
Baking  
is not necessary  
open less  
than 168 hours ?  
No  
No  
Perform recommended  
bake  
Baking Conditions:  
Recommended Storage Conditions:  
If the parts are not stored in dry conditions, they must be  
baked before reflow soldering to prevent damage to the  
parts.  
Storage Temperature  
10°C to 30°C  
Relative Humidity  
below 60% RH  
Package  
In Reel  
In Bulk  
Temperature  
60°C  
Time  
Recommended Time from Unsealing to Soldering:  
48 hours  
4 hours  
After removal from the bag, the parts should be soldered  
within 168 hours if stored at the recommended storage  
conditions. If times longer than 168 hours are needed, the  
parts must be stored in a dry box.  
100°C  
Baking should only be done once.  
9
Recommended Reflow Profile  
MAX 260C  
255  
R3  
R4  
230  
217  
200  
180  
R2  
60 sec to 90 sec  
Above 217 C  
150  
R5  
120  
R1  
80  
25  
0
50  
100  
150  
200  
250  
P4  
COOL DOWN  
300  
P1  
HEAT  
UP  
P3  
t-TIME  
P2  
SOLDER  
REFLOW  
(SECONDS)  
SOLDER PASTE DRY  
Process Zone  
Heat Up  
Symbol  
P1, R1  
P2, R2  
ꢄT  
Maximum ꢄT/ꢄtime or Duration  
25°C to 150°C  
3°C/s  
Solder Paste Dry  
Solder Reflow  
150°C to 200°C  
100s to 180s  
P3, R3  
P3, R4  
200°C to 260°C  
260°C to 200°C  
3°C/s  
-6°C/s  
Cool Down  
P4, R5  
200°C to 25°C  
> 217°C  
-6°C/s  
60s to 120s  
–
Time Maintained Above Liquidus Point, 217°C  
Peak Temperature  
260°C  
Time within 5°C of Actual Peak Temperature  
Time 25°C to Peak Temperature  
> 255°C  
20s to 40s  
8minutes  
25°C to 260°C  
The reflow profile is a straight-line representation of Process zone P3 is the solder reflow zone. In zone P3, the  
a nominal temperature profile for a convective reflow temperature is quickly raised above the liquidus point of  
solder process. The temperature profile is divided into solder to 260°C (500°F) for optimum results. The dwell time  
four process zones, each with different ꢄT/ꢄtime tem- above the liquidus point of solder should be between 60  
perature change rates or duration. The ꢄT/ꢄtime rates or and 120 seconds. This is to assure proper coalescing of the  
duration are detailed in the above table. The temperatures solder paste into liquid solder and the formation of good  
are measured at the component to printed circuit board solder connections. Beyond the recommended dwell  
connections.  
time the intermetallic mm growth within the solder con-  
nections becomes excessive, resulting in the formation of  
weak and unreliable connections. The temperature is then  
rapidly reduced to a point below the solidus temperature  
of the solder to allow the solder within the connections to  
freeze solid.  
In process zone P1, the PC board and component pins are  
heated to a temperature of 150°C to activate the flux in  
the solder paste. The temperature ramp up rate, R1, is  
limited to 3°C per second to allow for even heating of both  
the PC board and component pins.  
Process zone P4 is the cool down after solder freeze. The cool  
down rate, R5, from the liquidus point of the solder to  
25°C (77°F) should not exceed 6°C per second maximum.  
This limitation is necessary to allow the PC board and  
component pins to change dimensions evenly, putting  
minimal stresses on the component.  
Process zone P2 should be of sufficient time duration (100  
to 180 seconds) to dry the solder paste. The temperature  
is raised to a level just below the liquidus point of the  
solder.  
It is recommended to perform reflow soldering no more  
than twice.  
10  
Window and Light Guide Recommendations  
Transparent window with IR coating (IR pass of around 90% and minimum 30% visible pass) is recommended in order to  
pass both visible and infrared light. The material of the window is recommended to be polycarbonate. The surface finish  
of the plastic should be smooth, without any texture.  
The recommended plastic material for use as a window is available from Bayer AG and Bayer Antwerp N. V. (Europe),  
Bayer Corp.(USA) and Bayer Polymers Co., Ltd. (Thailand), as shown in Table below.  
Recommended Plastic Materials  
Material number  
Visible light transmission*  
Refractive index  
1.587  
Makrolon LQ2647  
Makrolon LQ3147  
Makrolon LQ3187  
87%  
87%  
85%  
1.587  
1.587  
* Transmittance of visible light will reduce if plastic window is coated with IR ink  
To ensure that the performance of the APDS-9800 will not be affected by improper window design, there are some  
constraints on the dimensions and design of the window so that the maximum size of the window, which is placed in  
front of the photo light sensor, will not affect the angular response of the APDS-9800. This maximum dimension that is  
recommended will ensure an acceptable light reception cone.  
Plastic Window  
Windows thickness  
Filter  
IR absorbing area  
Air gap  
IR pass area  
APDS-9800  
Side view of IR pass areas for window design  
1.2 mm  
IR pass areas  
3 mm  
0.7 mm  
0.7 mm  
Top view of IR pass areas for window design  
The distance between the bottom of the window and the sensor top–the air gap– should be as close as possible and not  
more than 0.2 mm. For optimum performance, windows thickness should be limited to not more than 0.8mm.  
For product information and a complete list of distributors, please go to our web site: www.avagotech.com  
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.  
Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved.  
AV02-2132EN - March 21, 2011