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Following the acquisi�on of Adesto Technologies, Dialog Semiconductor offers memory products as part of its  
product porꢀolio. The exis�ng content from datasheets, including part numbers and codes should be used. Terms of  
Purchase are provided on the Dialog website  
https://www.dialog-semiconductor.com/general-terms-and-conditions-purchase  
View our Dialog memory products porꢀolio:  
www.dialog-semiconductor.com/products/memory  
Contacting Dialog Semiconductor  
United Kingdom (Headquarters)  
Dialog Semiconductor (UK) LTD  
Phone: +44 1793 757700  
North America  
Dialog Semiconductor Inc.  
Phone: +1 408 845 8500  
Hong Kong  
Dialog Semiconductor Hong Kong  
Phone: +852 2607 4271  
China (Shenzhen)  
Dialog Semiconductor China  
Phone: +86 755 2981 3669  
Germany  
Japan  
Korea  
China (Shanghai)  
Dialog Semiconductor GmbH  
Phone: +49 7021 805-0  
Dialog Semiconductor K. K.  
Phone: +81 3 5769 5100  
Dialog Semiconductor Korea  
Phone: +82 2 3469 8200  
Dialog Semiconductor China  
Phone: +86 21 5424 9058  
The Netherlands  
Taiwan  
#
Dialog Semiconductor B.V.  
Phone: +31 73 640 8822  
Dialog Semiconductor Taiwan  
Phone: +886 281 786 222  
Email:  
Web site:  
enquiry@diasemi.com  
www.dialog-semiconductor.com  
AT25DF021A  
2-Mbit, 1.7V-3.6V Minimum  
SPI Serial Flash Memory  
DATASHEET (ADDENDUM)  
High Temperature Operation (125°C)  
This data sheet addendum is to be used in conjunction with the existing AT25DF021A  
datasheet specifications. The Adesto AT25DF021A 2Mbit Serial Flash devices will  
operate @ 125°C with the following datasheet caveats. All other parameters will meet  
the existing datasheet specifications.  
The ordering code suffix (CAN# Code) 'HR' or 'HT' must be used to ensure correct  
operation at this extended temperature range. Adesto will not modify and republish the  
current datasheet to reflect the CAN# ordering code or the above caveats.The  
standard AT25DF021A datasheet is available at http://www.adestotech.com.  
1.  
Electrical Specifications  
1.1  
DC and AC Operating Range  
AT25DF021A-xxxHR  
Operating Temperature  
Endurance (Maximum)  
-40C to +125C  
20,000 Cycles  
1.2  
DC, AC, Program and Erase Characteristics  
1.7V to 3.6V  
2.3V to 3.6V  
Symbol  
IUDPD  
IDPD  
ISB  
Parameter  
Units  
Min  
Typ  
.2  
Max  
1
Min  
Typ  
Max  
1
Ultra Deep Power-Down Current  
Deep Power-Down Current  
Standby Current  
.3  
8
µA  
µA  
5
40  
40  
25  
11  
11  
65  
25  
12  
12  
65  
µA  
(1)(2)  
ICC3  
Active Current, Program Operation  
Active Current, Erase Operation  
14.5  
14.5  
14.5  
14.5  
mA  
mA  
(1) (2)  
ICC4  
Maximum Clock Frequency for All  
Operation ( including 0Bh Opcode)  
fSCK  
85  
85  
MHz  
fRDLF  
Maximum Clock Frequency for 03h  
25  
40  
25  
40  
MHz  
MHz  
Maximum Clock Frequency for 3Bh  
Opcode  
fRDDO  
tPP  
tPE  
tBP  
Page Program Time (256 Bytes)  
Page Erase Time  
2
6
2
5
ms  
ms  
µs  
ms  
ms  
ms  
s
6
20  
6
20  
Byte Program Time  
12  
12  
Block Erase Time (4K)  
Block Erase Time (32K)  
Block Erase Time (64K)  
Chip Erase Time  
45  
100  
700  
1400  
6
45  
100  
700  
1400  
6
tBLKE  
300  
500  
2.5  
300  
500  
2.5  
tCHPE  
DS-25DF021A–042D–11/2015  
1. Typical values measured at 1.8V @ 25°C for the 1.7V to 3.6V range.  
2. Typical values measured at 3.0V @ 25°C for the 2.3V to 3.6V range.  
2.  
Ordering Code  
2.1  
Green Package Options (Pb/Halide-free/RoHS Compliant)  
Max. Freq.  
Ordering Code (1)  
Package  
Operating Voltage  
(MHz)  
Operation Range  
AT25DF021A-SSHNHR-T  
AT25DF021A-SSHNHR-B  
AT25DF021A-XMHNHR-T  
AT25DF021A-XMHNHR-B  
AT25DF021A-MHNHR-T  
AT25DF021A-MHNHR-Y  
AT25DF021A-MAHNHR-T  
AT25DF021A-DWFHT (2)  
8S1  
8X  
Extended  
1.7V to 3.6V  
85MHz  
(-40°C to +125°C)  
8MA1  
8MA3  
DWF  
1. The shipping carrier option code is not marked on the devices.  
2. Contact Adesto for mechanical drawing or Die Sales information.  
Package Type  
8S1  
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)  
8-lead, Thin Shrink Small Outline Package  
8X  
8MA1  
8MA3  
DWF  
8-pad, 5 x 6 x 0.6mm, Thermally Enhanced Plastic Ultra Thin Dual Flat No-lead (UDFN)  
8-pad, 2 x 3 x 0.6mm, Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead Package (UDFN)  
Die in Wafer Form  
3. Revision History  
Revision Level – Release Date History  
A – January 2015  
B – May 2015  
Initial release.  
Updated AC and DC Characteristics.  
Added tray option to 5x6 UDFN.  
Removed preliminary package note.  
C – May 2015  
D – November 2015  
© 2015 Adesto Technologies. All rights reserved. / Rev.: DS-25DF021A–042D–11/2015  
Disclaimer: Adesto Technologies Corporation makes no warranty for the use of its products, other than those expressly contained in the Company's standard warranty which is detailed in Adesto's Terms  
and Conditions located on the Company's web site. The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications  
detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Adesto are granted by the  
Company in connection with the sale of Adesto products, expressly or by implication. Adesto's products are not authorized for use as critical components in life support devices or systems.