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August 2005  
rev 0.2  
ASM3P1819N  
Low Power Mobile VGA EMI Reduction IC  
Features  
The ASM3P1819N reduces electromagnetic interference  
(EMI) at the clock source, allowing a system wide EMI  
reduction for all the down stream clocks and data  
dependent signals. The ASM3P1819N allows significant  
system cost savings by reducing the number of circuit  
board layers, ferrite beads, shielding, and other passive  
components that are traditionally required to pass EMI  
regulations.  
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FCC approved method of EMI attenuation  
Provides up to 15dB EMI reduction  
Generates low EMI spread spectrum clock  
a
and a non-spread Reference Clock of the input  
frequency  
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Optimized for frequency range from 20MHz to  
40MHz  
Internal loop filter minimizes external components  
and board space  
The ASM3P1819N modulates the output of a single PLL in  
order to “spread” the bandwidth of a synthesized clock,  
thereby decreasing the peak amplitude of its harmonics.  
This result in significantly lower system EMI compared to  
the typical narrow band signal produced by oscillators and  
most clock generators.  
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Down Spread Deviation: -1.25%  
Low inherent Cycle-to-Cycle jitter  
3.3V Operating Voltage  
CMOS/TTL compatible inputs and outputs  
Low power CMOS design  
Lowering EMI by increasing a signal’s bandwidth is called  
“spread spectrum clock generation”. The ASM3P1819N  
uses the most efficient and optimized modulation profile  
approved by the FCC and is implemented by using a  
proprietary all digital method  
Supports notebook VGA and other LCD timing  
controller applications  
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Power Down function for mobile application  
Products are available for industrial temperature  
range.  
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Available in 8 pin SOIC and TSSOP Packages  
Applications  
The ASM3P1819N is targeted towards EMI management  
for memory and LVDS interfaces in mobile graphic chipsets  
and high-speed digital applications such as PC peripheral  
devices, consumer electronics and embedded controller  
system.  
Functional Description  
The ASM3P1819N is  
a
versatile spread spectrum  
frequency modulator designed specifically for a wide range  
of input clock frequencies from 20 to 40MHz. The  
ASM3P1819N can generate an EMI reduced clock from  
crystal, ceramic resonator, or system clock.  
PD#  
VDD  
Block Diagram  
PLL  
Modulation  
XIN  
Frequency  
Divider  
Crystal  
Oscillator  
Output  
Loop  
Filter  
Phase  
VCO  
Divider  
Detector  
Feedback  
Divider  
XOUT  
REF  
ModOUT  
VSS  
Alliance Semiconductor  
2575 Augustine Drive Santa Clara, CA Tel: 408.855.4900 Fax: 408.855.4999 www.alsc.com  
Notice: The information in this document is subject to change without notice.  
August 2005  
ASM3P1819N  
rev 0.2  
Pin Configuration  
XOUT  
1
2
3
4
8
7
6
5
XIN  
VSS  
VDD  
PD#  
REF  
ASM3P1819N  
NC  
ModOUT  
Pin Description  
Pin#  
Pin Name  
Type  
Description  
1
2
3
4
5
XIN  
VSS  
I
Connect to externally generated Clock signal or Crystal.  
Ground Connection. Connect to system ground.  
No Connect.  
P
-
NC  
ModOUT  
REF  
O
O
Spread spectrum clock output.  
Non-modulated Reference clock output of the input frequency.  
Power down control pin. Pull LOW to enable Power-Down mode. This pin  
has an internal pull-up resistor.  
Connect to +3.3V.  
6
7
8
PD#  
VDD  
I
P
I
XOUT  
Connect to crystal. No connect if externally generated clock signal is used.  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
-0.5 to +7.0  
-65 to +125  
0 to 70  
Unit  
V
°C  
°C  
°C  
°C  
VDD, VIN  
Voltage on any pin with respect to Ground  
TSTG  
TA  
Storage temperature  
Operating temperature  
Ts  
TJ  
Max. Soldering Temperature (10 sec)  
Junction Temperature  
260  
150  
Static Discharge Voltage  
TDV  
2
KV  
(As per JEDEC STD22- A114-B)  
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect  
device reliability.  
Output Frequency and Modulation Rate  
Input Frequency Range  
Output Frequency Range  
Modulation Rate  
Spread Deviation  
(MHz)  
(MHz)  
(%)  
20 to 40  
20 to 40  
Input Frequency / 512  
-1.25  
Low Power Mobile VGA EMI Reduction IC  
2 of 7  
Notice: The information in this document is subject to change without notice.  
August 2005  
rev 0.2  
ASM3P1819N  
DC Electrical Characteristics  
(Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated)  
Symbol  
VIL  
Parameter  
Min  
Typ  
Max  
Unit  
V
Input Low voltage  
Input High voltage  
Input Low current  
Input High current  
VSS – 0.3  
-
-
0.8  
VIH  
2.0  
VDD + 0.3  
V
IIL  
-
-
-20.0  
µA  
µA  
mA  
mA  
V
IIH  
-
-
-
1.0  
IXOL  
IXOH  
VOL  
VOH  
XOUT Output low current @ 0.4V, VDD = 3.3V  
XOUT Output high current @ 2.5V, VDD = 3.3V  
Output Low voltage VDD = 3.3V, IOL = 20mA  
Output High voltage VDD = 3.3V, IOH = 20mA  
3
3
-
-
-
-
-
0.4  
-
2.5  
-
V
Dynamic Supply current  
7.1  
26.9  
ICC  
-
mA  
3.3V and 10pF probe loading  
fIN - min  
fIN - max  
IDD  
Static Supply current  
-
-
-
-
4.5  
3.3  
-
-
-
-
mA  
V
VDD  
tON  
Operating Voltage  
Power up time (First locked clock cycle after power up)  
Clock Output impedance  
0.18  
50  
mS  
ZOUT  
AC Electrical Characteristics  
Symbol  
Parameter  
Min  
20  
20  
Typ  
-
-
Max  
40  
40  
Unit  
MHz  
MHz  
fIN  
fOUT  
Input Frequency  
Output Frequency  
Output Rise time  
1
tLH  
-
-
0.69  
0.66  
-
-
nS  
nS  
( Measured from 0.8V to 2.0V )  
Output Fall time  
1
tHL  
( Measured from 2.0V to 0.8V )  
tJC  
tD  
Jitter (Cycle to Cycle)  
Output Duty cycle  
-200  
45  
-
50  
200  
55  
pS  
%
Note:1. tLH and tHL are measured into a capacitive load of 15pF  
Low Power Mobile VGA EMI Reduction IC  
3 of 7  
Notice: The information in this document is subject to change without notice.  
August 2005  
ASM3P1819N  
rev 0.2  
Package Information  
8-Pin (150-mil) SOIC Package  
H
E
D
A2  
A
C
θ
e
A1  
L
B
Dimensions  
Symbol  
Inches  
Millimeters  
Min  
Max  
0.010  
0.069  
0.059  
0.020  
0.010  
Min  
0.10  
1.35  
1.25  
0.31  
0.18  
Max  
0.25  
1.75  
1.50  
0.51  
0.25  
A1  
A
0.004  
0.053  
0.049  
0.012  
0.007  
A2  
B
C
D
E
0.193 BSC  
0.154 BSC  
0.050 BSC  
0.236 BSC  
4.90 BSC  
3.91 BSC  
1.27 BSC  
6.00 BSC  
e
H
L
0.016  
0.050  
0.41  
0°  
1.27  
8°  
θ
0°  
8°  
Note: Controlling dimensions are millimeters  
SOIC – 0.074 grams unit weight  
Low Power Mobile VGA EMI Reduction IC  
4 of 7  
Notice: The information in this document is subject to change without notice.  
August 2005  
rev 0.2  
ASM3P1819N  
8-lead Thin Shrunk Small Outline Package (4.40-MM Body)  
H
E
D
A2  
A
C
θ
e
A1  
L
B
Dimensions  
Symbol  
Inches  
Millimeters  
Min  
Max  
Min  
Max  
A
A1  
A2  
B
0.043  
0.006  
0.037  
0.012  
0.008  
0.122  
0.177  
1.10  
0.002  
0.033  
0.008  
0.004  
0.114  
0.169  
0.05  
0.85  
0.19  
0.09  
2.90  
4.30  
0.15  
0.95  
0.30  
0.20  
3.10  
4.50  
c
D
E
e
0.026 BSC  
0.252 BSC  
0.65 BSC  
6.40 BSC  
H
L
0.020  
0°  
0.028  
8°  
0.50  
0°  
0.70  
8°  
θ
Note: Controlling dimensions are millimeters  
TSSOP – 0.0325 grams unit weight  
Low Power Mobile VGA EMI Reduction IC  
5 of 7  
Notice: The information in this document is subject to change without notice.  
August 2005  
ASM3P1819N  
rev 0.2  
Ordering Information  
Part number  
Marking  
Package Configuration  
Temperature Range  
Commercial  
Commercial  
Commercial  
Commercial  
Commercial  
Commercial  
Industrial  
ASM3P1819N -08-ST  
ASM3P1819N -08-SR  
ASM3P1819NF-08-ST  
ASM3P1819NF-08-SR  
ASM3P1819NG-08-ST  
ASM3P1819NG-08-SR  
ASM3I1819N -08-ST  
ASM3I1819N -08-SR  
ASM3I1819NF-08-ST  
ASM3I1819NF-08-SR  
ASM3I1819NG-08-ST  
ASM3I1819NG-08-SR  
ASM3P1819N -08-TT  
ASM3P1819N -08-TR  
ASM3P1819NF-08-TT  
ASM3P1819NF-08-TR  
ASM3P1819NG-08-TT  
ASM3P1819NG-08-TR  
ASM3I1819N -08-TT  
ASM3I1819N -08-TR  
ASM3I1819NF-08-TT  
ASM3I1819NF-08-TR  
ASM3I1819NG-08-TT  
ASM3I1819NG-08-TR  
3P1819N  
8-Pin SOIC,Tube  
3P1819N  
3P1819NF  
3P1819NF  
3P1819NG  
3P1819NG  
3I1819N  
8-Pin SOIC, Tape and Reel  
8-Pin SOIC, Tube, Pb Free  
8-Pin SOIC, Tape and Reel, Pb Free  
8-Pin SOIC, Tube, Green  
8-Pin SOIC, Tape and Reel, Green  
8-Pin SOIC, Tube  
3I1819N  
8-Pin SOIC, Tape and Reel  
8-Pin SOIC, Tube, Pb Free  
8-Pin SOIC, Tape and Reel, Pb Free  
8-Pin SOIC, Tube, Green  
Industrial  
3I1819NF  
3I1819NF  
3I1819NG  
3I1819NG  
3P1819N  
3P1819N  
3P1819NF  
3P1819NF  
3P1819NG  
3P1819NG  
3I1819N  
Industrial  
Industrial  
Industrial  
8-Pin SOIC, Tape and Reel, Green  
8-Pin TSSOP, Tube  
Industrial  
Commercial  
Commercial  
Commercial  
Commercial  
Commercial  
Commercial  
Industrial  
8-Pin TSSOP, Tape and Reel  
8-Pin TSSOP, Tube, Pb Free  
8-Pin TSSOP, Tape and Reel, Pb Free  
8-Pin TSSOP, Tube, Green  
8-Pin TSSOP, Tape and Reel, Green  
8-Pin TSSOP, Tube  
3I1819N  
8-Pin TSSOP, Tape and Reel  
8-Pin TSSOP, Tube, Pb Free  
8-Pin TSSOP, Tape and Reel, Pb Free  
8-Pin TSSOP, Tube, Green  
8-Pin TSSOP, Tape and Reel, Green  
Industrial  
3I1819NF  
3I1819NF  
3I1819NG  
3I1819NG  
Industrial  
Industrial  
Industrial  
Industrial  
Device Ordering Information  
A S M 3 P 1 8 1 9 N F - 0 8 - S R  
R = Tape & reel, T = Tube or Tray  
O = SOT  
U = MSOP  
E = TQFP  
L = LQFP  
U = MSOP  
P = PDIP  
S = SOIC  
T = TSSOP  
A = SSOP  
V = TVSOP  
B = BGA  
D = QSOP  
X = SC-70  
Q = QFN  
DEVICE PIN COUNT  
F = LEAD FREE AND RoHS COMPLIANT PART  
G = GREEN PACKAGE  
PART NUMBER  
X= Automotive  
I= Industrial  
P or n/c = Commercial  
(0C to +70C)  
(-40C to +125C) (-40C to +85C)  
1 = Reserved  
6 = Power Management  
7 = Power Management  
8 = Power Management  
9 = Hi Performance  
0 = Reserved  
2 = Non PLL based  
3 = EMI Reduction  
4 = DDR support products  
5 = STD Zero Delay Buffer  
ALLIANCE SEMICONDUCTOR MIXED SIGNAL PRODUCT  
Licensed under US patent #5,488,627, #6,646,463 and #5,631,920  
Low Power Mobile VGA EMI Reduction IC  
6 of 7  
Notice: The information in this document is subject to change without notice.  
August 2005  
rev 0.2  
ASM3P1819N  
Alliance Semiconductor Corporation  
2575 Augustine Drive,  
Santa Clara, CA 95054  
Tel# 408-855-4900  
Copyright © Alliance Semiconductor  
All Rights Reserved  
Part Number: ASM3P1819N  
Document Version: 0.2  
Fax: 408-855-4999  
www.alsc.com  
Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to Alliance Semiconductor, dated 11-11-2003  
© Copyright 2003 Alliance Semiconductor Corporation. All rights reserved. Our three-point logo, our name and Intelliwatt are  
trademarks or registered trademarks of Alliance. All other brand and product names may be the trademarks of their  
respective companies. Alliance reserves the right to make changes to this document and its products at any time without  
notice. Alliance assumes no responsibility for any errors that may appear in this document. The data contained herein  
represents Alliance's best data and/or estimates at the time of issuance. Alliance reserves the right to change or correct this  
data at any time, without notice. If the product described herein is under development, significant changes to these  
specifications are possible. The information in this product data sheet is intended to be general descriptive information for  
potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or  
customer. Alliance does not assume any responsibility or liability arising out of the application or use of any product  
described herein, and disclaims any express or implied warranties related to the sale and/or use of Alliance products  
including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual  
property rights, except as express agreed to in Alliance's Terms and Conditions of Sale (which are available from Alliance).  
All sales of Alliance products are made exclusively according to Alliance's Terms and Conditions of Sale. The purchase of  
products from Alliance does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any  
other intellectual property rights of Alliance or third parties. Alliance does not authorize its products for use as critical  
components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant  
injury to the user, and the inclusion of Alliance products in such life-supporting systems implies that the manufacturer  
assumes all risk of such use and agrees to indemnify Alliance against all claims arising from such use.  
Low Power Mobile VGA EMI Reduction IC  
7 of 7  
Notice: The information in this document is subject to change without notice.