6SC2214W32E0WMZ3--Datasheet/数据表在线中文翻译

2214 Series

6SC2214W32E0WMZ3

◆Outline(L*W*H): 2.2*1.4*1.3 mm

◆High flux efficiency & Energy conservation

◆Good thermal dissipation & optical uniformity

Features

Table of Contents



Forward current: ≦30mA

Product Code Method-----------------------------------------2

Maximum Rating----------------------------------------------2

Typical Product Characteristics------------------------------3

Range of Bins---------------------------------------------------3

Color Coordinate Comparison--------------------------------4

Relative Spectral Power Distribution------------------------5

Typical Diagram Characteristics of Radiation-------------5

Relative Spectral Power Distribution-----------------------6

Dimensions ----------------------------------------------------8

Reflow Profile-------------------------------------------------9

Test Circuit and Handling Precautions---------------------10

Packing-----------------------------------------------------------11

Precautions-----------------------------------------------------13

Test Items and Results of Reliability-----------------------14

Typical view angle 50% Iv: 120°

RoHS2.0 and REACH-compliant

Lens color: yellowish

Qualified according to JEDEC moisturevity

Level 2a



ESD level 6kV(HBM)

Reliability Test: AEC Q-102qualified

Applications



Indoor lighting applications

Flat backlight for LCD. Switch and symbol

Indicator and backlighting for all consumer

electronics



Automotive electronics

Others applications

http://www.ystone.com.tw

2214 Series

 Product Code Method

------------------------------------------------------------------------------------------------------------------------------------

6 - S - C - 2214 - W32E - 0 - W - M - Z3

① ②

③

④

⑤

⑥

⑦

⑧

⑨

①

②

③

④

⑤

Dice wavelength

&luminous rank

Process Type

Category

LED Type

Lead Frame Size

C: PLCC top view

D: PLCC side view

2214:

6 : special product

S: SMD LED

Wxxx: White

2.2* 1.4mm

⑥

⑦

⑧

⑨

PCB Module

Code

Lap Polarity

Cap Color

Flow Code

Z:zener

0: non-common anode and

non-common cathode

W: yellowish

M: article mode

3: no expression above meaning for

company company

 Maximum Rating(Ta=25℃)

------------------------------------------------------------------------------------------------------------------------------------

Characteristics

Symbol

Typical

Unit

DC Forward Current

Pulse Forward Current^*3

Reverse Voltage

I_F

I_PF

30

100

mA

V

V_R

5

Junction Temperature

T_J

125

^oC

Operating Temperature Range

Storage Temperature Range

Soldering Temperature^*4

T_OP

T_STG

T_SD

-40-105

260

Thermal Resistance Junction/

Solder Point

Thermal Resistance Junction/

Ambient Point

RTH_J-S

RTH_J-A

130

260

℃/W

Notes 1: There is no maximum or typical voltage parameter

2: For otherambient, limited setting of current will be depended on de-rating curves.

3: Duty 1/10, pulse width 0.1ms

4: The maximum of soldering time is 10 seconds in T_SD

http://www.ystone.com.tw

2214 Series

 TypicalProduct Characteristics(Ta=25℃)

------------------------------------------------------------------------------------------------------------------------------------

Characteristics

Symbol

Min.

Typ.

Max.

Unit

Test condition

Forward Voltage

V_F

Iv

2.8

2.9

1900

0.303

0.304

450

20

3.4

V

mcd

-

I_F=20mA

Luminous Intensity

1450

-

x

-

Color Coordinate

I_F=20mA

y

-

Peak Wavelength

Spectral Width 50%

Reverse Current

λp

∆λ

I_R

-

nm

μA

deg

IF=20mA

V_R= 5V

-

10

-

Viewing Angle

2θ_1/2

120

I_F=20mA

Notes: 1. Measurement errors:

Forward Voltage: ±0.1V, Luminous Intensity: ±10%Iv, Color Coordinate: ±0.005, Viewing Angle (2θ_1/2)±5%

2. Electrical-Optical Characteristics (Ta=25℃)

 Range of Bins

------------------------------------------------------------------------------------------------------------------------------------

1).Forward Voltage (I_F= 20mA)

Bin Code

Min. V_F(V)

Max. V_F(V)

B

C

D

E

F

2.8

2.9

3.0

3.1

3.2

3.3

2.9

3.0

3.1

3.2

3.3

3.4

G

2).Luminous Intensity (I_F= 20mA)

Bin Code

Min. I_V(mcd)

Max. I_V(mcd)

3

4

5

6

1450

1650

1850

2050

1650

1850

2050

2250

http://www.ystone.com.tw

2214 Series

 ColorCoordinate Comparison

------------------------------------------------------------------------------------------------------------------------------------

0.33

6650K

0.32

7400K

SR4

0.31

8400K

SR3

ST4

ST3

0.3

0.29

0.28

0.285

0.29

0.295

0.3

0.305

0.31

0.315

0.32

ColorRank

BIN

X

Y

X

Y

X

Y

X

Y

SR3

0.303

0.305

0.305 0.2972 0.3136 0.306 0.3124 0.3142

SR4

ST3

ST4

0.3011 0.3127 0.303

0.2934 0.2954 0.2962 0.2884 0.305 0.2972 0.303

0.291 0.3024 0.2934 0.2954 0.303

0.305 0.3124 0.3142 0.311

0.323

0.305

0.305 0.3011 0.3127

http://www.ystone.com.tw

2214 Series

 Relative Spectral PowerDistribution

------------------------------------------------------------------------------------------------------------------------------------

100%

80%

60%

40%

20%

0%

380

420

460

500

540

580

620

660

700

740

780

Wavelength(nm)

 Typical Diagram CharacteristicsofRadiation

------------------------------------------------------------------------------------------------------------------------------------

0

10

1.0

0.5

0

20

30

40

50

60

70

80

90

1.0

0.3

0.6

0.4

0.2

0 10°

20°

30° 40°

0.9

0.5

0.1

0.8 0.7

90°

80°

50°

70°

60°

Genealogies angle

http://www.ystone.com.tw

2214 Series

 Relative Spectral PowerDistribution

------------------------------------------------------------------------------------------------------------------------------------

Forward Current vs. Forward Voltage

Forward Voltage vs. Solder Temperature

30

0.6

25

20

15

10

5

0.4

0.2

0

-0.2

-0.4

0

-40

-10

20

50

80

110

140

2.4

2.6

2.8

3

3.2

3.4

Forward Voltage VF(V)

Solder Temperature(℃)

Relative Intensity vs. Forward Current

Relative Intensity vs. Solder Temperature

160%

140%

120%

100%

80%

140%

120%

100%

80%

60%

40%

20%

0%

60%

40%

20%

0%

-50

0

50

100

150

0

5

10

15

20

25

30

Solder Temperature(℃)

Forward Current(mA)

Chromaticity Coordinate vs. Forward Current

Chromaticity Coordinate vs. Solder Temperature

0.02

∆Cx

∆Cy

∆Cx

∆Cy

∆Cx

∆Cy

0.01

0

-0.01

-0.02

0

-0.01

-0.02

-40 -20

0

20 40 60 80 100 120 140

0

5

10

15

20

25

30

Solder Temperature(℃)

Forward Current(mA)

http://www.ystone.com.tw

2214 Series

 Relative Spectral PowerDistribution

------------------------------------------------------------------------------------------------------------------------------------

The maximum forward current is determined by the thermal resistance between the LED junction and

solder point. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance

from the solder point to ambient in order to optimize lamp life and optical characteristics.

35

30

25

20

15

10

5

0

20

40

60

80

100

120

Solder Point Temperature(℃)

http://www.ystone.com.tw

2214 Series

 Dimensions

------------------------------------------------------------------------------------------------------------------------------------

2.0

1

2

0.5

2.2

Bottom View

Top View

1.7

Polarity Mark

2

1

Polarity

SIde View

Recommend Pad layout

Notes: 1. All dimensions are in millimeters

2. Tolerance is ±0.1mm unless otherwise noted

3. Specifications are subject to change without notice.

http://www.ystone.com.tw

2214 Series

 Reflow Profile

------------------------------------------------------------------------------------------------------------------------------------

SMTReflow Soldering Profile

tp

Critical Zone

T

P

L

T to T

L

P

Ramp-up

t_L

TS max

TS min

ts

Preheat

Ramp-down

25

t 25℃ to Peak

Time

Pb-Free (SnAgCu) Assembly

Profile Feature

Symbol

Unit

Min.

Recommendation

Max.

Ramp-up rate to preheat (25°C to 150°C)

Time t_S(T_{S min}to T_{S max}

-

t_S

-

60

-

2

3

120

3

K/s

s

)

100

2

Ramp-up rate to peak (T_{S max}to T_P)

Liquidus temperature

-

K/s

°C

s

T_L

t_L

T_P

-

217

80

-

Time above liquidus temperature

Peak temperature

-

100

260

-

245

°C

Time within 5 °C of the specified

peak temperature T_P- 5 K

t_P

-

10

s

Ramp-down Rate (T_Pto 100 °C)

-

3

-

4

K/s

s

Time 25 °C to T_P

480

Notes:

1. Do not stress the silicone resin while it is exposed to high temperature.

2. The reflow process should not exceed 3 times.

http://www.ystone.com.tw

2214 Series

 TestCircuit and Handling Precautions

------------------------------------------------------------------------------------------------------------------------------------

1. Test Circuit

V

LED

2. Handling Precautions

2.1. Over-current-proof

Customer must apply resistors for protection; otherwise slight voltage shift will cause big current

change (Burn out will happen).

2.2. Storage

1). It is recommended to store the products in the following conditions:

Humidity: 60% R.H. Max.

Temperature: 5℃~30℃(41℉~86℉)

2). Shelf life in sealed bag: 12 month at ＜5℃~30℃ and ＜60% R.H. after the package is Opened,

the products should be used within four weeks or they should be keeping to stored at ≦20%R.H. with

zip-lock sealed.

2.3. Baking

If the package has been opened for more than 4 weeks, it is recommended to bake the products with

the following instruction:

1). 60±3℃ X 6hrs and ＜5%RH, for reel

2). 125±3℃ X 2hrs, for single LED

It shall be normal to see slight color fading of carrier (light yellow) after baking in process

http://www.ystone.com.tw

2214 Series

 Packing

------------------------------------------------------------------------------------------------------------------------------------



Feeding Direction (Unit: mm)



Dimensions of Reel (Unit: mm)

178±1

8.5±0.5

Label



Dimensions of Tape (Unit: mm)

2.0±0.05

1.55±0.05

0.20

4.0±0.10

Polority

Mark

4.0±0.10

2.0



Arrangement of Tape

Empty parts

(min.10)

s

Empty Parts

(min.40)

d Part

Loade

s)

3000Pc

(LED:

Feeding Direction

Cover Tape

Emboss Tape

Introduction Parts

(Min.160mm)

Conclusion Parts

(Min.40mm)

Notes:

1. Empty component pockets are sealed with top cover tape

2. The max loss number of SMD is 2pcs;

3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481

specifications;

4. 3,000pcs per reel;

5.The remainder packing in multiples of 500pcs.

http://www.ystone.com.tw

2214 Series

 Packing

------------------------------------------------------------------------------------------------------------------------------------



Packaging Specifications

Notes:

Reeled product (max.3,000) is packed in a sealed moisture-proof bag. Seven bags are packed in an

inner box (size: about 260 X 230 X 100 mm) and four inner boxes are in an outer box (size: about 480 X

275 X 215 mm). On the label of moisture-poof bag, there should be the information of Part No., Lot No.

and quantity number; also the total quantity number should be on inspection request form on outer box.

.

http://www.ystone.com.tw

2214 Series

 Precautions

-----------------------------------------------------------------------------------------------------------------------------------

1. Abnormal situation caused by improper setting of collet

To choose the right collet is the key issue in improving the product’s quality. LED is different from other

electronic components, which is not only about electrical output but also for optical output. This characteristic

made LED more fragile in the process of SMT. If the collet’s lowering down height is not well set, it will

bring damage to the gold wire at the time of collet’s picking up and loading which will cause the LED fail to

light up, light up now and then or other quality problems

2. How to choose the collet

During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in case

that improper position of collet will damage the gold wire inside the LED. Different collets fit for different

products, please refer to the following pictures cross out

Outer diameter of collet should be larger than the lighting area

Picture 1()

Picture 2(X)

3. Other points for attention

A. No pressure should be exerted to the epoxy shell of the SMD under high temperature.

B. Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross out

easy to break.

C. LED should be used as soon as possible when being taken out of the original package, and

should be stored in anti-moisture and anti-ESD package.

4. This usage and handling instruction is only for your reference.

http://www.ystone.com.tw

2214 Series

 TestItems and Results of Reliability

------------------------------------------------------------------------------------------------------------------------------

Duration/

Cycle

Number of

Damage

Test Item

Test Conditions

Reference

–40℃ 30min

↑↓5min

Thermal Shock

1000 cycles

1000 hrs

0/26

JESD22 A-106

JESD22 A-103B

105℃ 30min

High Temperature

Storage

T_a=105℃

T_a=-40℃

Low Temperature

Storage

1000 hrs

0/26

JESD22 A-119

JESD22 A-108

JESD22 A-101

T_a=25℃

If=30mA

Life Test

85℃ RH=85%

High Humidity Heat

Operation

1000 hrs

0/26

If=20mA

High Temperature

Operation

T_a=105℃

If=20mA

1000 hrs

3 times

0/26

0/30

JESD22 A-108C

ANSI/JEDEC

JS-001

ESD(HBM)

6KV at 1.5kΩ;100pF

Failure Criteria

Criteria for Judgment

Item

Symbol

Condition

Min

Max

USL¹×1.1

10μA

-

Forward Voltage

Reverse Current

Radiant Power

V_F

I_R

If=20mA

V_R=5V

If=20mA

-

P_O

LSL²×0.7

[Note] USL*¹: Upper Specification Level

LSL*²: Lower Specification Level

Note: Version updates will not be announced and Yellow Stone Corp. will have the final interpretation rights

http://www.ystone.com.tw