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BA-9G3H3UD-LC5.8  
Package Dimensions :  
Features :  
4.30x11=47.30(1.862)  
1. Emitting area : 4.0×1.5×12mm)  
2. Low power requirement.  
3. Excellent characters appearance.  
4. Solid state reliability.  
4.00(.157)  
0.30(.012)  
1.60(.063)  
G
G
G
G
G
G
G
G
G
H
H
H
56.00(2.205)  
58.00(2.283)  
5. Categorized for luminous intensity.  
6. Universal pin out.  
0.50(.020)  
8.00(.315)  
5.8±0.5(.138±020)  
z Description :  
1. The BA-9G3H3U
array display.  
meters(inches).  
)unless otherwise  
2. This product use
red chips, the gr
GaP on GaP sub
are made from G
3. This product hav
white segments.  
o change without  
4. This product doe
substance, comp
Internal Circuit Diagram :  
http://www.ystone.com.tw  
BA-9G3H3UD-LC5.8  
Absolute Maximum Ratings(Ta=25)  
Parameter  
Symbol  
Green  
Bright Red  
Unit  
Power Dissipation Per Segment  
Forward Current Per Segment  
Peak Forward Current Per Segment  
Reverse Voltage P
Operating Temper
Pd  
IF  
80  
30  
40  
15  
50  
mW  
mA  
IFP  
150  
mA  
(Duty 1/10, 1KHZ)  
V
-
Storage Temperat
-
Soldering Temper
(1/16" From Body)  
onds  
-
Electrical And
Green  
Para
Max.  
Unit  
V
Forward Voltage P
Luminous Intensit
Reverse Current P
Peak Wave Lengt
2.5  
-
100  
-
mcd  
µA  
λd  
λ  
IF=10mA  
IF=10mA  
567  
-
-
nm  
nm  
nm  
Dominant Wave Length  
572  
-
Spectral Line Half-width  
30  
Bright Red  
Parameter  
Symbol Condition Min.  
Typ.  
2.1  
1.8  
-
Max.  
Unit  
V
Forward Voltage Per Segment  
Luminous Intensity Per Segment  
Reverse Current Per Segment  
Peak Wave Length  
Vf  
Iv  
IF=10mA  
IF=10mA  
VR=5V  
-
-
-
-
-
-
2.5  
-
mcd  
µA  
IR  
100  
λp  
λd  
λ  
IF=10mA  
IF=10mA  
IF=10mA  
700  
650  
100  
-
-
-
nm  
nm  
nm  
Dominant Wave Length  
Spectral Line Half-width  
http://www.ystone.com.tw  
BA-9G3H3UD-LC5.8  
Typical Electro-Optical Characteristics Curves  
(25Ambient Temperature Unless Otherwise Noted)  
Fig.1 Relative Radiant Intensity VS. Wavelength  
(G) (H)  
1.0  
0.5  
0
510  
810  
inous  
Fig
perature  
50  
40  
30  
20  
10  
0
1
2
3
4
5
-40 -20  
0
20  
40  
60  
Ambient Temperature Ta( C)  
Forward Voltage (V)  
Fig.4 Relative Luminous  
Intensity VS.  
Fig.5 Forward Current  
Derating Curve VS.  
Ambient Temperature  
Forward Current  
50  
3.0  
2.0  
1.0  
0.0  
40  
(G)  
30 (G)  
(H)  
20  
(H)  
10  
0
0
20 40 60 80 100 120  
10  
20  
30  
40  
50  
Ambient Temperature Ta( C)  
Forward Current(mA)  
http://www.ystone.com.tw  
BA-9G3H3UD-LC5.8  
Bin Limits  
1. Intensity bin limits (At IF= 20mA)  
Bin Code  
Min. (mcd)  
Max. (mcd)  
L
2.660  
3.590  
M
N
3.460  
4.500  
4.670  
6.070  
2. Color Bin Li
Bi
m)  
Binx  
x
color bin code  
Intensity bin code  
http://www.ystone.com.tw  
BA-9G3H3UD-LC5.8  
Dip Soldering  
300  
Max:260,5sec.  
Suggest:2~3sec.  
250  
200  
150  
100  
Fluxing  
50  
30  
10  
110  
120  
1. Please avoid an
epoxy while the
2. DIP soldering a
3. After soldering,
vibration until th
4. Avoid rapid coo
5. Although the so
soldering at the lowest possible temperature is feasible for the LEDs  
IRON Soldering  
350Within 3 sec., One time only.  
http://www.ystone.com.tw