1ZHP35AB17CHZ1Z4--Datasheet/数据表在线中文翻译

3535HP Series

1ZHP35AB17CHZ1Z4

◆Outline：3.5*3.5*2.22mm

◆High efficiency

◆Good thermal dissipation & optical uniformity

Table of Contents:

Features

Features----------------------------------------------------1

Product Code----------------------------------------------2

Typical Product Characteristics-----------------------3

Maximum Rating----------------------------------------- 3

Dominant Wavelength Binning------------------------4

Intensity binning------------------------------------------ 4

Forward Voltage Binning-------------------------------4

Relative Spectral Power Distribution----------------5

Electronic-Optical Characteristics--------------------5

Typical spatial distribution------------------------------5

Thermal Design for De-rating--------------------------6

Dimensions----------------------------------------------- 6

Suggest Stencil Pattern------------------------------- 7

Packing---------------------------------------------------- 8

Reflow Profile--------------------------------------------10

Precautions-----------------------------------------------11

Test items and results of reliability-----------------14

 RoHS2.0 and REACH-compliant

 MSL2 qualified according to J-STD 020

 ESD 8KV (HBM : MIL-STD-883 Class 3B)

Applications

 Portable lighting

 Outdoor lighting

 Indoor lighting

 Commercial lighting

 Industrial lighting

 Decorative lighting

 Agricultural lighting

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3535HP Series

 Product Code

1 – Z – HP35 – A – B17C – H – Z – 1 – Z – 4

① ②

③

④

⑤

⑥

⑦ ⑧ ⑨ ⑩

①

②

③

④

⑤

Dice wavelength

Process type

Category

Specification

Lens Angle code

& Luminous rank

BXXX: blue light &

level

1: Normal

process

Z: High Power

LED

HP35: Ceramic

3535

A: 120°

⑥

Support code

H: HTCC

⑦

Zener &

High CRI

Z: Zener

⑧

⑨

Module &

Lens code

Z: Molding

⑩

Current code

4: 350mA

Cap color code

1: Series No.

 Typical Product Characteristics(Ta=25℃)

Forward Voltage (V)

@350mA

Dominant

Wavelength

Luminous Flux (lm)

Viewing

Angle

(nm)

Group

Min.

Max.

Min.

Max.

B17

22

24

B18

B19

B20

24

26

28

26

28

30

460-470

2.8

3.6

120°

Notes:

1. Forward voltage (V_F) ±0.05V；Luminous flux (Φv) ±7%；Wavelength (λd/λp) ±1nm；

Viewing angle(2θ_1/2) ±10°

2. IS standard testing.

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3535HP Series

 Maximum Rating (Ta : 25℃)

Characteristics

DC Forward Current¹

Pulse Forward Current²

Reverse Voltage

Symbol

I_F

Min.

Typical

Max.

700

1000

5

Unit

mA

V

I_PF

V_R

Reverse Current

I_R

10

μA

℃

Junction Temperature³

Storage Temperature Range

Soldering Temperature

T_j

150

100

250

T_stg

T_sol

-40

–

℃

Notes:

1. For other ambient, limited setting of current will depend on de-rating curves.

2. D=0.01s duty 1/10.

3. When drive on maximum current , Tj must be kept below 150℃

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3535HP Series

 Dominant Wavelength Binning

Bin code

(350mA)

Min. λ_d

Max. λ_d

(nm)

B460

B465

460

465

470

 Intensity Binning

Bin code

(350mA)

Min. Φ_v

Max. Φ_v

(Lm)

(lm)

B17

B18

B19

B20

22

24

26

28

24

26

28

30

 Forward Voltage Binning

Bin code

(350mA)

Min. V_F

(V)

Max. V_F

(V)

V2830

V3032

V3234

V3436

2.8

3.0

3.2

3.4

3.0

3.2

3.4

3.6

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3535HP Series

 Relative Spectral Power Distribution

120%

100%

80%

60%

40%

20%

0%

400

500

600

700

800

Wavelength(nm)

 Electronic-Optical Characteristics

Forward Current vs. Forward Voltage (Ta=25℃)

Relative luminous Flux vs. Forward Current (T_a=25℃)

 Typical Spatial Distribution

Genealogies angle

Ta=25°

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3535HP Series

 Thermal Design for De-rating

The maximum forward current is determined by the thermal resistance between the LED junction

and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal

resistance from the solder point to ambient in order to optimize lamp life and optical characteristics.

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3535HP Series

 Dimensions

§ All dimensions are in millimeters.

§ Tolerance is ±0.13mm unless other specified.

 Suggest Stencil Pattern (Recommendations for reference)

§ Suggest stencil t =0.12 mm

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3535HP Series

 Packing

-

+

Trailer 160mm (min) of

Leader 400mm (min) of

empty pockets sealed

Loaded Pockets

(1000 pcs)

empty pockets sealed

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3535HP Series

Label

Notes:

1. Each reel (minimum number of pieces is 100 and maximum is 1000 for 120 degree product)

is packed in a moisture-proof bag along with a packs of desiccant and a humidity indicator

card.

2. A maximum of 5 moisture-proof bags are packed in an inner box (size: 260mm x 230mm x

100mm ±5mm).

3. A maximum of 4 inner boxes are put in an outer box (size: 480mm x 275mm x 215mm

±5mm).

4. Part No., Lot No., quantity should be indicated on the label of the moisture-proof bag and

the cardboard box.

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3535HP Series



Reflow Profile

IR Reflow Soldering Profile

Lead Free solder

Notes:

1. The recommended reflow temperature is 240℃(±5℃). The maximum soldering temperature

should be limited to 250-260℃.

2. Do not stress the silicone resin while it is exposed to high temperature.

3. The reflow process should not exceed 2 times.

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3535HP Series

 Precautions

1. Recommendation for using LEDs

1.1 The lens of LEDs should not be exposed to dust or debris. Excessive dust and debris may

cause a drastic decrease in the luminosity.

1.2 Avoid mechanical stress on LED lens.

1.3 Do not touch the LED lens surface. It would affect the optical performance of the LED

due to the LED lens’ damage.

1.4 Pick & place tools are recommended for the remove of LEDs from the factory tape & reel

packaging

2. Pick & place nozzle

The pickup tool was recommended and shown as below

3. Lens handling

Please follow the guideline to pick LEDs.

3.1 Use tweezers to pick LEDs.

3.2 Do not touch the lens by using tweezers.

3.3 Do not touch lens with fingers.

3.4 Do not apply more than 4N (400gw) directly onto the lens.

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3535HP Series

Correct (  )

Wrong ( X )

4. Lens cleaning

In the case which a small amount of dirt and dust particles remain on the lens surface, a

suitable cleaning solution can be applied.

4.1 Try a gentle wiping with dust-free cloth.

4.2 If needed, use dust-free cloth and isopropyl alcohol to gently clean the dirt from the lens

surface.

4.3 Do not use other solvents as they may directly react with the LED assembly.

4.4 Do not use ultrasonic cleaning which will damage the LEDs.

5. Carrier tape handling

The following items are recommended when handling the carrier tape of LEDs.

5.1 Do not twist the carrier tape.

5.2 The inward bending diameter should not be smaller than 6cm for each carrier tape.

5.3 Do not bend the tape outward.

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3535HP Series

6. Storage

6.1 The moisture-proof bag is sealed：

The LEDs should be stored at 30°C or less and 90%RH or less. And the LEDs are limited

to use within one year, while the LEDs is packed in moisture-proof package with the

desiccants inside.

6.2 The moisture-proof bag is opened：

The LEDs should be stored at 30°C or less and 60%RH or less. Moreover, the LEDs are

limited to solder process within 168hrs. If the humidity indicator card shows the pink color

in 10% even higher or exceed the storage limiting time since opened, that we

recommended to baking LEDs at 60°C at least 24hrs. To seal the remainder LEDs return

to the moisture-proof bag, it’s recommended to be with workable desiccants.

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3535HP Series

 Test Items and Results of Reliability

Duration/

Cycle

Number of

Test Item

Test Conditions

Reference

AEC-Q101

Damage

–40℃ 30min

↑↓5min

Thermal Shock

1000 cycles

0/77

125℃ 30min

High Temperature

Storage

EIAJ ED-4701

200 201

T_a=100℃

1000 hrs

0/22

Humidity Heat

Storage

T_a=85℃

EIAJ ED-4701

100 103

RH=85%

Low Temperature

Storage

EIAJ ED-4701

200 202

T_a=-40℃

T_a=25℃

If=350mA

Life Test

High Humidity Heat

Operation

85℃ RH=85%

If=350mA

High Temperature

Operation

T_a=85℃

1000 hrs

3 Times

0/22

If=350mA

ESD(HBM)

2KV at 1.5kΩ;100pf

MIL-STD-883

Failure Criteria

Condition

Criteria for Judgment

Item

Symbol

Min

Max

-

Forward Voltage

Reverse Current

Luminous Intensity

V_F

I_R

I_v

If=350mA

V_R=5V

USL¹×1.1

-

100μA

-

If=350mA

LSL²×0.7

Notes:

1. USL: Upper specification level

2. LSL: Lower specification level

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