1SC3535VGBW0MF09--Datasheet/数据表在线中文翻译

The RGBW Series

1SC3535VGBW0MF09

◆Outline (L* W*H): 3.7*3.5*1.8mm

◆Good thermal dissipation & optical uniformity

Features

Table of Contents

 Forward current:≦30mA

Product Code Method-----------------------------------------2

Maximum Rating-----------------------------------------------2

Typical Product Characteristics------------------------------3

Color Coordinate Comparison-White-----------------------4

Directive Characteristics--------------------------------------5

Electronic-Optical Characteristics---------------------------6

Dimensions -----------------------------------------------------7

Packing------------------------------------------------------------8

Precautions ------------------------------------------------------9

Test Items and Results of Reliability------------------------12

 Typical view angle 50% Iv: 120°

 Lens color: white diffused / yellowish

 RoHS2.0 and REACH-compliant

 Qualified according to JEDEC moisturevity

Level 5a

 ESD level 1kV(HBM)

Applications

 Amusement

 Indoor lighting

 Architecture lighting

 Decorative lighting

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The RGBW Series

 Product Code Method

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1 - S - C - 3535 - VGBW - 0 - M - F - 09

①

② ③

④

⑤

⑥

⑦

⑧

⑨

①

②

③

④

⑤

Dice wavelength

&luminous rank

V:red

Process Type

Category

LED Type

Lead Frame Size

C: PLCC top view

D: PLCC side view

3535:

G:green

1: normal process

S: SMD LED

3.7*3.5mm

B:blue

W:White

⑥

⑦

⑧

⑨

Lap Polarity

Cap Color

PCB Module Code

Flow Code

0: non-common anode and

non-common cathode

M: white diffused /

yellowish

09: no expression above

meaning for company

F: article mode

 Maximum Rating(Ta=25℃)

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Characteristics

Symbol

Rating

Unit

DC Forward Current

Pulse Forward Current^*3

Reverse Voltage

I_F

I_PF

30

70

mA

V

V_R

5

Junction Temperature

T_J

110

^oC

Operating Temperature Range

Storage Temperature Range

Soldering Temperature^*4

T_OP

T_STG

T_SD

-40~85

-40~100

260

^oC

Notes 1: There is no maximum or typical voltage parameter

2: For other ambient, limited setting of current will be depended on de-rating curves.

3: Duty 1/10, pulse width 0.1ms

4: The maximum of soldering time is 5 seconds in T_SD

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The RGBW Series

 Typical Product Characteristics(Ta=25℃)

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Characteristics

Symbol

Min.

Typ.

Max.

Unit

Test condition

R

1.9

2.8

-

2.5

3.4

10

-

G

B

-

Forward Voltage

Reverse Current

V_F

V

I_F=20mA

V_R= 5V

W

-

I_R

-

μA

R

G

B

-

750

1500

370

-

Luminous Intensity

Iv

mcd

I_F=20mA

-

W

R

-

2200

-

618

520

460

-

628

530

475

G

B

Dominant Wavelength

λd

nm

I_F=20mA

-

x

y

0.3212

0.3364

120

Color Coordinate

View Angle

I_F=20mA

2θ_1/2

-

deg

Notes: 1. Measurement Errors: Forward Voltage: ±0.1V, Luminous Intensity: ±10%Iv, Dominant Wavelength: ±1.0nm

2. Electrical-Optical Characteristics (Ta=25℃)

3. We will amend the Bin code to maintain Bin Code centralize,

4. And we get the Luminous Intensity is 1.3double per Bins and the Dominant Wavelength is 5/5/5nm of R/G/B per Bins

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The RGBW Series

 Color Coordinate Comparison-White

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Color Rank

Bin

X

Y

X

Y

X

Y

X

Y

1B-1

1B-2

2A-1

2A-2

0.3205

0.3213

0.3292

0.3293

0.3481

0.3371

0.3117

0.3131

0.3393

0.329

0.3131

0.3145

0.329

0.3187

0.3353

0.3243

0.3213

0.3221

0.3293

0.3294

0.3371

0.3261

0.3423

0.3306

0.3539 0.32064

0.3423 0.32143

0.3462 0.32143

0.3353 0.32223

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The RGBW Series

 Electronic-Optical Characteristics

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1). Relative Spectral Distribution

2). Typical Spatial Distribution

Wavelength (nm)

3). Relative Luminous Flux .Current

4). Relative Luminous Flux .Ambient Temperature

10000

110%

100%

1000

100

10

90%

80%

70%

0

20

40

60

80

100

30

25

20

Forward Current (mA)

0

5

10

15

Ambient Temperature(°C)

5). Electrical Characteristics

6). Forward Voltage Temperature

3.6

30

3.4

3.2

3.0

2.0

1.8

1.6

25

20

15

10

5

0

1.5

3

2.5

Forward Voltage VF(V)

3.5

2

2.5

8.5

6.5

10.5

4.5

7). Wavelength and Current

8). Thermal Design(R/G/B/W 1 chip on light)

50

620

600

40

30

20

520

500

470

450

10

F

o

r

w

a

r

d

C

u

r

e

n

t

I

F

(

m

A

)

0

20

40

60

Solder Point Temperature Ts(°C)

80

100

420

50

40

0

10

20

30

rent (mA)

Forward Cur

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The RGBW Series

 Dimensions

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8

7

5

3

1

6

4

2

W

G

7

5

3

1

8

6

4

2

R

B

Recommend Padlayout

§ All dimensions are in millimeters.

§ Tolerance is ±0.1mm unless other specified

§ Specifications are subject to change without notice

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The RGBW Series

 Reflow Profile

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1. I_Rreflow soldering Profile for Lead Free solder

300

℃

10sec. max

1-5℃/sec

260℃ max

230℃ max

250

2-5℃/sec

Pre heating 150-180℃

2-5℃/sec

200

150

100

50

120sec.Max

50sec.max

25℃

0

50

100

150

200

250

300

sec

Time

Notes:

1. We recommend the reflow temperature 240℃ (±5℃).the maximum soldering temperature should be

limited to 260℃.

2. Don’t cause stress to the silicone resin while it is exposed to high temperature.

3. Number of reflow process shall not be more than 2 time.

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The RGBW Series

 Test Circuit and Handling Precautions

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1. Test circuit

V

LED

2. Handling precautions

2.1. Over-current-proof

Customer must apply resistors for protection; otherwise slight voltage shift will cause big current

change (Burn out will happen).

2.2. Storage

1). It is recommended to store the products in the following conditions:

Humidity: 60% R.H. Max.

Temperature : 5℃~30℃(41℉~86℉)

2). Shelf life in sealed bag: 12 month at ＜5℃~30℃ and ＜60% R.H. after the package is Opened,

the products should be used within 48 hours or they should be keeping to stored at ≦20%R.H. with

zip-lock sealed.

2.3. Baking

Suggest packing opened after 24 hours, before use baking products, conditions as follows:

The Conditions are as followings:

1). 60±3℃ X 6hrs and ＜5%RH, for reel

2). 125±3℃ X 2hrs, for single LED

It shall be normal to see slight color fading of carrier (light yellow) after baking in process

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The RGBW Series



Packing

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

Dimensions of Reel (Unit: mm)

13±0.5

12.5±0.5

18max

Note: 01.The tolerance unless mentioned is ±0.2mm.

02.The measured unit is "mm".



Dimensions of Tape (Unit: mm)

Cathode

Mark



Arrangement of Tape

Notes:

1. Empty component pockets are sealed with top cover tape

2. The max loss number of SMD is 2pcs

3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481

specifications

4. 1000pcs per reel

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The RGBW Series



Packing

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

Packaging specifications

Moisture-poof bag

Reel(1,000pcs)

Label

inspection request form

Inner box(Max. 5 reels)

Label

Outer box(Max. 4 inner boxes)

Notes:

1. Each reel (minimum number of pieces is 100 and maximum is 1000 ) is packed in a

moisture-proof bag along with a packs of desiccant and a humidity indicator card.

2. A maximum of 5 moisture-proof bags are packed in an inner box (size: 260mm x 230mm x

100mm ±5mm).

3. A maximum of 4 inner boxes are put in an outer box (size: 480mm x 275mm x 215mm ±5mm).

4. Part No., Lot No., quantity should be indicated on the label of the moisture-proof bag and the

cardboard box.

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The RGBW Series



Precautions

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1. Abnormal situation caused by improper setting of collet

To choose the right collet is the key issue in improving the product’s quality. LED is different from other

electronic components, which is not only about electrical output but also for optical output. This

characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height is not well

set, it will bring damage to the gold wire at the time of collet’s picking up and loading which will cause the

LED fail to light up, light up now and then or other quality problems

2. How to choose the collet

During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in

case that improper position of collet will damage the gold wire inside the LED. Different collets fit for

different products, please refer to the following pictures cross out

Outer diameter of collet should be larger than the lighting area

Picture 1()

Picture 2(X)

3. Other points for attention

A. No pressure should be exerted to the epoxy shell of the SMD under high temperature.

B. Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross out

easy to break.

C. LED should be used as soon as possible when being taken out of the original package, and should

be stored in anti-moisture and anti-ESD package.

4. This usage and handling instruction is only for your reference.

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The RGBW Series

 Test Items and Results of Reliability

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Duration/

Cycle

Number of

Damage

Test Item

Ac/Re

Test Conditions

Reference

Ta＝23℃(±5℃)

Normal Temperature Life

(1chip on light)

JESD22 A-108

1008 hrs

0/1

0/22

I_F=20mA

Ta＝85℃(±5℃)

High Temperature Life

(1chip on light)

I_F=20mA

Ta＝85℃(±5℃)

RH=85%

High Humidity Heat Life

(1chip on light)

JESD22 A-108

JESD22 A-104

1008 hrs

0/1

0/22

I_F=20mA

-45℃/30min~105℃

/30min

Thermal shock

(±5℃)

According to the

SPEC

Electrostatic Discharge (ESD)

Test(1chip on light)

AEC Q101-001

JESD22-A103D

3 cycles

1008 hrs

0/1

0/22

T_a=-40℃

T_a=100℃

Low Temperature Storage

High Temperature Storage

*Criteria for Judging

Item

Criteria for Judgment of Pass

Symbol

Condition

Min

Max

USL*¹×1.1

10μA

Forward Voltage

Reverse Current

V_F

I_R

I_F=20mA

V_R= 5V

-

Luminous Intensity

Iv

I_F=20mA

LSL^*2×0.7

-

[Note] USL*¹: Upper Specification Level

LSL*²: Lower Specification Level

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