VFDP35AW5FFH0YZ4--Datasheet/数据表在线中文翻译

3535DPF Series

VFDP35AW5FFH0YZ4

◆ Outline：3.5*3.5*2.22mm

◆ High efficiency

◆ Good thermal dissipation & optical uniformity

Table of Contents :

Features

1

2

3

4

5

6

7

8

9

Features------------------------------------------------------

Product Code------------------------------------------------

Typical Product Characteristics-------------------------

Maximum Rating-------------------------------------------

Intensity binning--------------------------------------------

Forward Voltage Binning---------------------------------

Color coordinate binning ---------------------------------

Relative Spectral Power Distribution------------------

Electronic-Optical Characteristics----------------------

Typical spatial distribution--------------------------------

Thermal Design for De-rating---------------------------

Dimensions--------------------------------------------------

Suggest Stencil Pattern----------------------------------

 Binning based on ANSI C78.377

 RoHS2.0 and REACH-compliant

 MSL2 qualified according to J-STD 020

 ESD 2KV (HBM : MIL-STD-883 Class 2)

Applications

 Portable lighting

 Outdoor lighting

 Indoor lighting

 Commercial lighting

 Industrial lighting

 Decorative lighting

 Automobile lighting

 Street and tunnel lighting

10

12

13

16

Packing------------------------------------------------------

Reflow Profile----------------------------------------------

Precautions-------------------------------------------------

Test items and results of reliability--------------------

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3535DPF Series

 Product Code

V – F – DP35 – A – W5FF – H – 0 – Y – Z – 4

① ②

③

④

⑤

⑥ ⑦ ⑧ ⑨ ⑩

①

②

③

④

⑤

Lens Angle

code

Dice wavelength

& Luminous rank

W5XX: Warm white

Process type

Category

Specification

V: Eutectic

process

F: Flip Chip LED DP35: Ceramic

3535

A: 120°

⑥

⑦

⑧

⑨

⑩

Zener &

High CRI

Module &

Lens code

Support code

H: HTCC

Cap color code

Y:1700K

Current code

4: 350mA

0: None Zener

Z: Molding

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3535DPF Series

 Typical Product Characteristics(Ta=25℃)

Luminous Flux (lm)

Forward Voltage (V)

@350mA

Typical CCT

(K)

Viewing

Angle

@350mA

Group

Min.

Max.

Min.

Max.

3.4

B32

B33

B34

90

100

110

120

100

110

1700

2.8

120°

Notes:

1. Forward voltage (V_F) ±0.05V；Luminous flux (Φ_V) ±7%；CRI ±2 Viewing angle(2θ_1/2) ±10°

2. IS standard testing.

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3535DPF Series

 Maximum Rating (Ta : 25℃)

Characteristics

Symbol

I_F

Min.

Typical

Max.

1000

Unit

mA

DC Forward Current¹

Pulse Forward Current²

Reverse Voltage

I_PF

V_R

I_R

1500

5

mA

V

Reverse Current

10

μA

℃

Junction Temperature³

T_j

150

Thermal Resistance Junction /

Solder Point

R_th

10

℃/W

Operation Temperature Range

Storage Temperature Range

Soldering Temperature

T_opr

T_stg

T_sol

-40

–

105

250

℃

Notes:

1. For other ambient, limited setting of current will depend on de-rating curves.

2. D=0.01s duty 1/10.

3. When drive on maximum current , Tj must be kept below 150℃

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3535DPF Series

 Intensity Binning

Bin code

(350mA)

Min. Φ_v

Max. Φ_v

(Lm)

B32

B33

B34

90

100

110

120

100

110

 Forward Voltage Binning

Bin code

(350mA)

Min. V_F

(V)

Max. V_F

(V)

V2830

V3032

V3234

2.8

3.0

3.2

3.0

3.2

3.4

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3535DPF Series

 Color coordinate binning

BIN

Y1

CIE X

0.56

CIE Y

0.44

BIN

Y2

CIE X

0.5745

0.5566

0.578

CIE Y

0.4253

0.4076

0.3972

0.409

BIN

CIE X

0.5908

0.578

0.5933

0.61

CIE Y

0.409

0.3972

0.3896

0.5375

0.5566

0.5745

0.4174

0.4076

0.4253

Y3

0.5908

Notes : Chromaticity ( CIEx, CIEy ) ±0.007

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3535DPF Series

 Relative spectral power distribution

100%

90%

80%

70%

60%

50%

40%

30%

20%

10%

0%

325 375 425 475 525 575 625 675 725 775 825

Wavelength (nm)

 Electronic-Optical Characteristics

Forward Current vs. Forward Voltage (Ta=25℃)

Relative luminous Flux vs. Forward Current (T_a=25℃)

 Typical Spatial Distribution

0

10

1.0

20

30

40

50

60

70

0.5

80

90

0

90°

1.0

0.6

0.4

0.5

0

10°

20°

0.9

0.80.7

0.3 0.2

30° 40°

50°

0.1

60° 80°

70°

Genealogies angle

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3535DPF Series

 Thermal Design for De-rating

The maximum forward current is determined by the thermal resistance between the LED junction

and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal

resistance from the solder point to ambient in order to optimize lamp life and optical characteristics.

1400

1200

1000

800

600

400

200

0

50

100

Solder Point Temperature (℃)

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3535DPF Series

 Dimensions

§ All dimensions are in millimeters.

§ Tolerance is ±0.13mm unless other specified.

 Suggest Stencil Pattern (Recommendations for reference)

§ Suggest stencil t =0.12 mm

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3535DPF Series

 Packing

-

+

Trailer 160mm (min) of

Leader 400mm (min) of

empty pockets sealed

Loaded Pockets

(1000 pcs)

empty pockets sealed

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3535DPF Series

Label

Notes:

1. Each reel (minimum number of pieces is 100 and maximum is 1000 for 120 degree product)

is packed in a moisture-proof bag along with a packs of desiccant and a humidity indicator

card.

2. A maximum of 5 moisture-proof bags are packed in an inner box (size: 260mm x 230mm x

100mm ±5mm).

3. A maximum of 4 inner boxes are put in an outer box (size: 480mm x 275mm x 215mm

±5mm).

4. Part No., Lot No., quantity should be indicated on the label of the moisture-proof bag and

the cardboard box.

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3535DPF Series



Reflow Profile

IR Reflow Soldering Profile

Lead Free solder

Notes:

1. The recommended reflow temperature is 240℃(±5℃). The maximum soldering temperature

should be limited to 250-260℃.

2. Do not stress the silicone resin while it is exposed to high temperature.

3. The reflow process should not exceed 2 times.

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3535DPF Series

 Precautions

1. Recommendation for using LEDs

1.1 The lens of LEDs should not be exposed to dust or debris. Excessive dust and debris may

cause a drastic decrease in the luminosity.

1.2 Avoid mechanical stress on LED lens.

1.3 Do not touch the LED lens surface. It would affect the optical performance of the LED

due to the LED lens’ damage.

1.4 Pick & place tools are recommended for the remove of LEDs from the factory tape & reel

packaging

2. Pick & place nozzle

The pickup tool was recommended and shown as below

3. Lens handling

Please follow the guideline to pick LEDs.

3.1 Use tweezers to pick LEDs.

3.2 Do not touch the lens by using tweezers.

3.3 Do not touch lens with fingers.

3.4 Do not apply more than 4N (400gw) directly onto the lens.

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3535DPF Series

Correct (  )

Wrong ( X )

4. Lens cleaning

In the case which a small amount of dirt and dust particles remain on the lens surface, a

suitable cleaning solution can be applied.

4.1 Try a gentle wiping with dust-free cloth.

4.2 If needed, use dust-free cloth and isopropyl alcohol to gently clean the dirt from the lens

surface.

4.3 Do not use other solvents as they may directly react with the LED assembly.

4.4 Do not use ultrasonic cleaning which will damage the LEDs.

5. Carrier tape handling

The following items are recommended when handling the carrier tape of LEDs.

5.1 Do not twist the carrier tape.

5.2 The inward bending diameter should not be smaller than 6cm for each carrier tape.

5.3 Do not bend the tape outward.

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3535DPF Series

6. Storage

6.1 The moisture-proof bag is sealed：

The LEDs should be stored at 30°C or less and 90%RH or less. And the LEDs are limited

to use within one year, while the LEDs is packed in moisture-proof package with the

desiccants inside.

6.2 The moisture-proof bag is opened：

The LEDs should be stored at 30°C or less and 60%RH or less. Moreover, the LEDs are

limited to solder process within 168hrs. If the humidity indicator card shows the pink color

in 10% even higher or exceed the storage limiting time since opened, that we

recommended to baking LEDs at 60°C at least 24hrs. To seal the remainder LEDs return

to the moisture-proof bag, it’s recommended to be with workable desiccants.

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3535DPF Series

 Test Items and Results of Reliability

Duration/

Cycle

Number of

Test Item

Test Conditions

Reference

Damage

–40℃ 30min

↑↓5min

Thermal Shock

1000 cycles

0/77

AEC-Q101

125℃ 30min

High Temperature

Storage

EIAJ ED-4701

200 201

T_a=105℃

1000 hrs

0/22

Humidity Heat

Storage

T_a=85℃

EIAJ ED-4701

100 103

RH=85%

Low Temperature

Storage

EIAJ ED-4701

200 202

T_a=-40℃

T_a=25℃

If=350mA

Life Test

High Humidity Heat

Operation

85℃ RH=85%

If=350mA

High Temperature

Operation

T_a=85℃

1000 hrs

3 Times

0/22

If=350mA

ESD(HBM)

2KV at 1.5kΩ;100pf

MIL-STD-883

Failure Criteria

Condition

Criteria for Judgment

Item

Symbol

Min

Max

-

Forward Voltage

Reverse Current

Luminous Intensity

V_F

I_R

I_v

If=350mA

V_R=5V

USL¹×1.1

-

100μA

If=350mA

LSL²×0.7

-

Notes:

1. USL: Upper specification level

2. LSL: Lower specification level

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