BL-HE1G033B-TRB--Datasheet/数据表在线中文翻译

BL-HE1G033B-TRB

● Features:

●Package Dimensions:

1. Emitted Color :Hi-Eff Red and Yellow Green

2. Lens Appearance : Water Clear.

3. Bi-color type.

4. 3.2x2.7x1.1mm(1210) standard package.

5. Suitable for all SMT assembly methods.

6. Compatible with infrared and vapor phase

reflow solder process.

7. Compatible with automatic placement

equipment.

8. This product doesn’t contain restriction

Substance, comply ROHS standard.

NOTES:

1.All dimensions are in millimeters.

2.Tolerance is ±0.10mm unless otherwise specified.

3.Specifications are subject to change without notice.

● Applications:

1. Backlighting : LCDs, Key pads advertising.

2. Status indicators : Comsumer & industrial

electronics.

3. General use.

● Absolute Maximum Ratings(Ta=25℃)

Parameter

Symbol

Pd

Hi-Eff Red

Yellow Green

Unit

mW

mA

V

Power Dissipation

50

20

50

20

Forward Current

I_F

Peak Forward Current ＊1

Reverse Volage

I_FP

100

V_R

5

-40℃~85℃

See Page 6

Operating Temperature

Storage Temperature

Soldering Temperature

Topr

Tstg

Tsol

-

＊1 Condition for I_FPis pulse of 1/10 duty and 0.1msec width.

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BL-HE1G033B-TRB

● Electrical and optical characteristics(Ta=25℃)

Parameter

Symbol

Condition

Color

Min.

Typ.

Max.

Unit

Hi-Eff Red

Yellow Green

Hi-Eff Red

Yellow Green

Hi-Eff Red

Yellow Green

Hi-Eff Red

Yellow Green

Hi-Eff Red

Yellow Green

2.2

10

2.6

Forward Voltage

Vf

I_F=20mA

-

V

3.7

Luminous Intensity

Reverse Current

Iv

I_R

I_F=20mA

V_R=5V

-

100

-

mcd

μA

10

-

640

568

λp

λd

2θ_1/2

Peak Wave Length

Dominant Wave Length

Veiwing Angle

I_F=20mA

nm

deg

626

566

636

576

Hi-Eff Red

Yellow Green

-

120

-

● Typical Electro-Optical Characteristics Curves

Fig.1 Relative intensity vs. wavelength

(G)

(R)

1.0

Fig.2 Forward current derating curve

vs. ambient temperature

50

40

30

20

0.5

10

0

400

20

40

60

80

100

500

600

700

Ambient temperature Ta( C)

Wavelength (nm)

Fig.4 Relative luminous intensity vs.

ambient temperature

Fig.3 Forward current vs. forward voltage

(G)

(R)

3.0

2.5

2.0

1.5

1.0

40

30

20

10

0

0.5

0

1

2

3

4

5

-40

-20

0

20

40

60

Forward voltage(V)

AAmbient temperature Ta( C)

Fig.5 Relative luminous intensity vs. forward current

4.0

Fig.6 Radiation diagram

0

10

20

30

3.0

2.0

40

50

(G)

(R)

1.0

0.9

0.8

0.7

60

70

1.0

0

80

90

0.5

0.3

0.1

0.2

0.4

0.6

5

10

20

30

40

50

Forward current (mA)

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BL-HE1G033B-TRB

● Tapping and packaging specifications(Units: mm)

Quantity: 3000PCS

USER DIRECTION OF FEED

● Package Method:(unit:mm)Vacuum

12 bag/box

3000 pcs/reel

200

Bar Code Label

245

220

185

Aluminum Foil Bag

220

645

6 box/carton

210

470

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BL-HE1G033B-TRB

● Bin Limits

Intensity Bin Limits (E1) (At 20mA)

BIN CODE

Min. (mcd)

Max. (mcd)

G

H

J

3.7

5.5

8.2

12.3

18.5

K

12.3

Tolerance for each Bin limit is ± 15 %.

Intensity Bin Limits (G0) (At 20mA)

BIN CODE

Min. (mcd)

Max. (mcd)

G

H

J

3.7

5.5

8.2

12.3

18.5

K

12.3

Tolerance for each Bin limit is ± 15 %.

Color Bin Limits (G0) (At 20mA)

BIN CODE

Min. (nm)

566

Max. (nm)

568

4

5

6

7

8

568

570

572

574

576

Tolerance for each Bin limit is ± 1 nm.

● BIN： x - x

x

Color BIN CODE (G0)

Intensity BIN CODE (G0)

Intensity BIN CODE (E1)

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BL-HE1G033B-TRB

● Reliability Test

Classification

Test Item

Reference Standard

Test Conditions

Result

MIL-STD-750D:1026

Operation Life MIL-STD-883D:1005

JIS-C-7021 :B-1

Ta: Under room temperature

Test time:1,000hrs

IF=Product Recommended IF

0/32

High

Ta:85±5℃

Temperature MIL-STD-202F:103B

High Humidity JIS-C-7021 :B-11

Storage

0/32

RH:90%-95%

Test time:240hrs

Ta:100±5℃

Endurance

Test

High

MIL-STD-883:1008

Temperature

JIS-C-7021 :B-10

Storage

Test time:1,000hrs

0/32

Ta: -45±5℃

Low

Temperature JIS-C-7021 :B-11

Storage

Test time=1,000hrs

MIL-STD-202F:107D

Temperature MIL-STD-750D:1051

Ta:-35±5℃~25±5℃~85±5℃~25±5℃

0/32

Cycling

MIL-STD-883D:1010

JIS-C-7021 :A-2

30min 5min 30min 5min

Time: 5cycles

Ta:-45±5℃ ~+85±5℃

MIL-STD-202F:107D(1980)

Thermal Shock MIL-STD-750D:1051(1995) 20min

MIL-STD-883D:1011(1991) Time: 10cycles

20 min

Environmental

Test

MIL-STD-883:2003

MIL-STD-202F:208D

MIL-STD-883D:2003

Ta:230±5℃

Time:5±0.5s

Wetting

balance

MIL-STD-202F:210A

MIL-STD-883D:1011

JIS-C-7021 :A-1

Ta:260±10℃

Time:10±1s

Solder

Resistance

0/32

● Judgment criteria of failure for the reliability

Measuring items

Forward voltage

Reverse current

Luminous intensity

Symbol

V_F( V)

Measuring conditions

I_F=20mA

Judgement criteria for failure

Initial Level*1.1

I_R(uA)

V_R=5V

Over U*2

Iv ( mcd )

I_F=20mA

Initial Level*0.7

Note: 1.U means the upper limit of specified characteristics.

2.Measurment shall be taken between 2 hours and after the test pieces have been returned to

normal ambient conditions after completion of each test.

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BL-HE1G033B-TRB

● IR-Reflow Soldering

1. Avoid any external stress applied to the resin while the LEDs are at high temperature, especially during soldering.

2. Avoid rapid cooling or any excess vibration during temperature ramp-down process.

3. Although the soldering condition is recommended above, soldering at the lowest possible temperature is feasible for the

LEDs.

● IRON Soldering

350℃ Within 3 sec.,One time only.

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BL-HE1G033B-TRB

● Notes for designing:

Care must be taken to provide the current limiting resistor in the circuit so as to drive the LEDs

within the rated figures. Also, caution should be taken not to overload LEDs with instantaneous

voltage at the turning ON and OFF of the circuit.

When using the pulse drive care must be taken to keep the average current within the rated figures.

Also, the circuit should be designed so as be subjected to reverse voltage when turning off the

LEDs.

● Storage:

In order to avoid the absorption of moisture, it is recommended to solder LEDs as soon as possible

after unpacking the sealed envelope.

If the envelope is still packed, to store it in the environment as following:

(1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max.

(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or

equivalent soldering process must be:

a. Completed within 168 hours.

b. Stored at less than 30% RH.

(3) Devices require baking before mounting, if:

(2) a or (2) b is not met.

(4) If baking is required, devices must be baked under below conditions:

48 hours at 60℃±3℃.

● Package and Label of Products:

(1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached

on each bag.

(2) Label:

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