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BA-12G3UI  
Package Dimensions :  
Features :  
1. Emitting area : 4.0×1.5×12mm)  
2. Low power requirement.  
3. Excellent characters appearance.  
4. Solid state reliability.  
5. Categorized for luminous intensity.  
6. Universal pin out.  
Description :  
1. The BA-12GE3U
graph array disp
ters(inches).  
nless otherwise  
change without  
2. This product us
3. This product ha
segments.  
4. This product do
substance, com
Internal Circuit
http://www.ystone.com.tw  
BA-12G3UI  
Absolute Maximum Ratings(Ta=25)  
Parameter  
Symbol  
Rating  
Unit  
mW  
mA  
mA  
V
Power Dissipation Per Segment  
Forward Current Per Segment  
Peak Forward Current Per Segment  
Pd  
80  
IF  
30  
150  
IFP  
(Duty 1/10, 1KHZ)  
Reverse Voltage Per Segment  
Operating Tempera
Storage Temperatu
V
5
℃  
℃  
-
-
Soldering Tempera
(1/16" From Body)  
conds  
-
Electrical And O
Parameter  
Forward Voltage Per Segment  
Luminous Intensity Per Segment  
Reverse Current Per Segment  
Peak Wave Length  
Symbol Condition Min.  
Typ.  
2.1  
5.0  
-
Max.  
Unit  
V
Vf  
Iv  
IF=10mA  
IF=10mA  
VR=5V  
-
2.5  
-
-
100  
-
mcd  
µA  
IR  
-
λp  
λd  
λ  
IF=20mA  
IF=20mA  
IF=20mA  
-
569  
-
568  
-
nm  
nm  
nm  
Dominant Wave Length  
574  
-
Spectral Line Half-width  
30  
http://www.ystone.com.tw  
BA-12G3UI  
Typical Electro-Optical Characteristics Curves  
(25Ambient Temperature Unless Otherwise Noted)  
Fig.1 Relative Radiant Intensity VS. Wavelength  
1.0  
0.5  
0
460  
640  
inous  
Fig.2
mperature  
50  
40  
30  
20  
10  
0
1
40  
60  
Ambient Temperature Ta( C)  
Forward Voltage (V)  
Fig.4 Relative Luminous  
Intensity VS.  
Fig.5 Forward Current  
Derating Curve VS.  
Ambient Temperature  
Forward Current  
50  
3.0  
2.0  
40  
30  
20  
1.0  
0.0  
10  
0
20 40 60 80 100 120  
0
10  
20  
30  
40  
50  
Forward Current(mA)  
Ambient Temperature Ta( C)  
http://www.ystone.com.tw  
BA-12G3UI  
Dip Soldering  
300  
Max:260,5sec.  
Suggest:2~3sec.  
250  
200  
150  
100  
Fluxing  
50  
30  
10  
110  
120  
1. Please avoid an
epoxy while the
2. DIP soldering a
3. After soldering,
vibration until th
4. Avoid rapid coo
5. Although the so
soldering at the lowest possible temperature is feasible for the LEDs  
IRON Soldering  
350Within 3 sec., One time only.  
http://www.ystone.com.tw